• Restorative Dentistry and Endodontics
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• v.28 no.2
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• pp.127-133
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• 2003

The object of this study was to compare the microleakage between various composite resin systems of multistep, one-bottle, and self-etching systems using electrical conductivity. After making class V cavities ($4{\times}3{\times}1.5{\;}mm$ around CEJ), they were bulk filled with three kinds of resins of A3. Teeth were storaged in a saline solution for one day, after then, they were finished and polished using Sof-Lex system. Another stress of thermocycling was made for 500 times from $5^{\circ}{\;}to{\;}55^{\circ}C$ with each dwelling time of 10 seconds. Electrical conductivity (microamphere, $\mu\textrm{A}$) was checked four times: before and after cavity preparation, after filing, after thermocycling. One-way ANOVA and 95% Scheffe Post Hoc test was used for checking any statistical difference among groups. Another 95% Paired Samples T-test was also used for estimating any significant difference within group after cavity filling or thermocycling. The results were as follows: 1 Every specimen showed various range of microleakage after filing. There was, however, no difference between composite resin systems. 2. All composite resin systems showed marked increase in microleakage with a thermocycling (p<0.05), there was, however, no difference between composite resin systems. 3. Although there was no significant difference between groups (p=0.078), one-bottle and self-etching systems seemed to be unstable than multistep system. Within the limits of this study, it was concluded that much more consideration should be needed when using thermally unstable one-bottle and self-etching systems that have multi-advantages from simplified step. More studies will be needed to solve these kinds of problems.

• Restorative Dentistry and Endodontics
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• v.29 no.1
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• pp.66-72
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• 2004

All-in-one adhesives were recently developed for reducing the technique sensitivity and chair time, but lots of concerns were made on bondability, longevity, and microleakage. The object of this study was to evaluate microleakage and marginal quality of all-in-one adhesives using electrochemical method and SEM analysis quantitatively. After making Class V cavities, they were bulk filled with Heliomolar(#A1 after surface treatment with three adhesives: Adper Prompt (Group A), One up bond F (Group O), Xeno III (Group X) Electrical conductivity (microamphere, ${\mu}A$) was checked two times: before and after cavity filling. Percentage of leaky margin was estimated from SEM image (${\times}1,000$). The data were statistically analysed: ANOVA and Paired T test for electrical conductivity, Kruskal-Wallis and Mann-Whitney test for marginal quality, Spearman s rho test for checking of relationships between 2 methods. The result were as follows: 1. There was no difference in microleakage between adhesive systems and every specimen showed some of microleakage after filling. 2. Microleakage was reduced about 70% with composite resin filling. 3. Marginal quality was the best in group A. decreasing among groups in the following order: group O, followed by group X. There were significant differences between group A and group X (p=0.015), and between group 0 and group X (p=0.019). 4. There was no relationship between the microleakage measured by electrochemical method and marginal quality measured by SEM analysis. Within the results of this study, there was no difference in microleakage among groups by electrical conductivity. However, significant difference in marginal quality was seen among groups. It was believed that these dissimilar results might be induced because of their own characteristics. Analysis of microleakage needs various methods for accuracy.