• Title/Summary/Keyword: Micro-tribology

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Study on the Frictional Characteristics of Micro-particles for Tribological Application (미세입자의 트라이볼로지적 응용을 위한 마찰특성 고찰)

  • Sung, In-Ha;Han, Hung-Gu;Kong, Ho-Sung
    • Tribology and Lubricants
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    • v.25 no.2
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    • pp.81-85
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    • 2009
  • Interests in micro/nano-particles have been greatly increasing due to their wide applications in various fields such as environmental and medical sciences as well as engineering. In order to obtain a fundamental understanding of the tribological characteristics at particle-surface contact interface, frictional behaviors according to load/pressure and materials were obtained by using atomic force microscope(AFM) cantilevers with different stiffnesses and tips. Lateral contact stiffnesses were observed in various tip-surface contact situations. Experimental results show that stick-slip friction behavior occurs even when the colloidal probes with a particle of a few micrometers in diameter, which have a relatively large contact area and lack a well-shaped apex, were used. This indicates that atomic stick-slip friction may be a more common phenomenon than it is currently thought to be. Also, experimental results were investigated by considering the competition between the stiffness of the interatomic potential across the interface and the elastic stiffnesses of the contacting materials and the force sensor itself.

Effect of Temperature on the Micro-scale Adhesion Behavior of Thermoplastic Polymer Film (열가소성 폴리머 필름의 마이크로 점착 거동에 대한 온도의 영향)

  • Kim, Kwang-Seop;Heo, Jung-Chul;Kim, Kyung-Woong
    • Tribology and Lubricants
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    • v.25 no.2
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    • pp.86-95
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    • 2009
  • Adhesion tests were carried out in order to investigate the effect of temperature on the adhesion behavior between a PMMA film and a fused silica lens in the micro scale. For the tests, a microtribometer system was specially designed and constructed. The pull-off forces on the PMMA film were measured under atmospheric condition as the temperature of the PMMA film was increased from 300 K to 443 K and decreased to 300 K. The contact area between the PMMA film and the lens was observed during the test. The adhesion behavior was changed with the change of the PMMA surface state as the temperature increased. In glassy state below 363 K, the pull-off force did not change with the increase of temperature. In rubbery state from 383 K to 413 K, the pull-off force increased greatly as the temperature increased. In addition, the area of contact was enlarged. In viscous state above 423 K, the fingering instability was observed in the area of contact when the PMMA film contacted with the lens. It was also found that the adhesion behavior can be varied with the thermal history of the PMMA film. The residual solvent in the PMMA film could emerge to the PMMA surface due to the heating and reduced the pull-off force.

A study of Frictional Behavior of SCM415 Steel as a Function of Density of Micro Dimples (미세 딤플의 밀도에 따른 SCM415강의 마찰 거동 연구)

  • Cho, Min-Haeng;Lee, Seung-Hyuk;Park, Sang-Il;Lyo, In-Woong
    • Tribology and Lubricants
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    • v.26 no.6
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    • pp.311-316
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    • 2010
  • Surface texturing of micro dimple or pore-shaped pattern was prepared using a fiber laser system. Surface texturing was designed to have a square pattern with a particular pitch distance for each corresponding density of 5, 10, 20, and 30%. Thermal damages such as bulges and burrs formed during laser irradiation were observed around the dimples. Thermal damages were later removed by lapping using alumina particles of $0.3{\mu}m$ in diameter. Oscillating friction tests were performed against heat-treated high speed steels under lubricated condition. The lubricant used was SAE 5W-30 automotive engine oil. Normal contact pressure and oscillating frequency was 0.28 MPa and 20 Hz, respectively. The tests were continued for 20 minutes, and friction plots were recorded for examination. Results revealed that the coefficient of friction was lowered regardless of texturing density. Moreover, the lowest coefficient of friction was obtained for 10% density texturing. It is attributed to increased lubricity due to the introduction of surface texturing. In addition, it is concluded that the optimum texturing density and pattern must be found for the best lubricity and low friction.

Droplet Geometry and Its Volume Analysis (기름방울 형상 및 그 체적 분석법)

  • Yoon, Moon-Chul
    • Tribology and Lubricants
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    • v.24 no.6
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    • pp.320-325
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    • 2008
  • The recent industrial application requires technical methods to get the cutting fluid droplet surfaces in particular from the viewpoint of topography and micro texture. To characterize the surface topography of droplet, the combination of the confocal laser scanning microscope (CLSM) and wavelet filtering is well suited for obtaining the droplet geometry encountered in tribological research. This technique indicates a better agreement in obtaining an appropriate droplet surface obtained by the CLSM over a detail range of surface accuracy (resolution: $2{\mu}m$). And the results allow an excellent accuracy in a measurement of a droplet surface. The combination of extended focal depth measurement configured and multi-scale wavelet filtering has proven that it can construct a droplet surface in a successive and accurate way. A multi-scale approach of wavelet filtering was developed based on the decomposition and reconstruction of droplet surface by 2D wavelet transform using db9 (a mother wavelet of daubechies). Also this technique can be extended to characterize the quantification of droplet properties and other field in a wide range of scales. Finally this method is verified to be a better droplet surface modeling in a micro scale arising in a mist machining.

Effect of Pressure on Edge Delamination in Chemical Mechanical Polishing of SU-8 Film on Silicon Wafer

  • Park, Sunjoon;Im, Seokyeon;Lee, Hyunseop
    • Tribology and Lubricants
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    • v.33 no.6
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    • pp.282-287
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    • 2017
  • SU-8 is an epoxy-type photoresist widely used for the fabrication of high-aspect-ratio (HAR) micro-structures in micro-electro-mechanical systems (MEMS). To fabricate highly integrated structures, chemical mechanical polishing (CMP) has emerged as the preferred manufacturing process for planarizing the MEMS structure. In SU-8 CMP, an oxidizer decomposes organic impurities and particles in the CMP slurry remove the chemically reacted surface of SU-8. To fabricate HAR microstructures using the CMP process, the adhesion between SU-8 and substrate material is important to avoid the delamination of the SU-8 film caused by the mechanical-dominant material removal characteristic. In this study, the friction force during the CMP process is measured with a CMP monitoring system to detect the delamination phenomenon and investigate the delamination of the SU-8 film from the silicon substrate under various pressure conditions. The increase in applied pressure causes an increase in the frictional force and wafer-edge stress concentration. The frictional force measurement shows that the friction force changes according to the delamination phenomenon of the SU-8 film, and that it is possible to monitor the delamination phenomenon during the SU-8 CMP process. The delamination at a high applied pressure is explained by the effect of stress distribution and pad deformation. Consequently, it is necessary to control the pressure of polishing, which can avoid the delamination in SU-8 CMP.

Friction Mechanisms of Silicon Wafer and Silicon Wafer Coated with Diamond-like Carbon Film and Two Monolayers

  • Singh R. Arvind;Yoon Eui-Sung;Han Hung-Gu;Kong Ho-Sung
    • Journal of Mechanical Science and Technology
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    • v.20 no.6
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    • pp.738-747
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    • 2006
  • The friction behaviour of Si-wafer, diamond-like carbon (DLC) and two self-assembled monolayers (SAMs) namely dimethyldichlorosilane (DMDC) and diphenyl-dichlorosilane (DPDC) coated on Si-wafer was studied under loading conditions in milli-newton (mN) range. Experiments were performed using a ball-on-flat type reciprocating micro-tribo tester. Glass balls with various radii 0.25 mm, 0.5 mm and 1 mm were used. The applied normal load was in the range of 1.5 mN to 4.8 mN. Results showed that the friction increased with the applied normal load in the case of all the test materials. It was also observed that friction was affected by the ball size. Friction increased with the increase in the ball size in the case of Si-wafer. The SAMs also showed a similar trend, but had lower values of friction than those of Si-wafer In-terestingly, for DLC it was observed that friction decreased with the increase in the ball size. This distinct difference in the behavior of friction in DLC was attributed to the difference in the operating mechanism. It was observed that Si-wafer and DLC exhibited wear, whereas wear was absent in the SAMs. Observations showed that solid-solid adhesion was dominant in Si-wafer, while plowing in DLC. The wear in these two materials significantly Influenced their friction. In the case of SAMs their friction behaviour was largely influenced by the nature of their molecular chains.

A Study on the Micro-lapping process of Sapphire Wafers for optoelectronic devices (광반도체용 사파이어웨이퍼 기계연마특성 연구)

  • 황성원;신귀수;김근주;서남섭
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.2
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    • pp.218-223
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    • 2004
  • The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by Micro-lapping process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of crystalline sapphire wafer at surface has a full width at half maximum of 250 arcsec. This value at the surface sapphire wafer surfaces indicated 0.12${mu}m$ sizes. Surfaces of sapphire wafers were mechanically affected by residual stress and surface default. As a result, the value of surface roughness of sapphire wafers measured by AFM(Atom Force Microscope) was 2.1nm.

A Study on the Micro-lapping process of Sapphire Wafers for optoelectronic devices (광반도체용 사파이어웨이퍼 기계연마특성 연구)

  • 황성원;김근주;서남섭
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.82-85
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    • 2003
  • The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by Micro-lapping process. The sapphire crystalline wafers were characterized by DCXD(Double Crystal X-ray Diffraction). The sample quality of crystalline sapphire wafer at surface has a FWHM(Full Width at Half Maximum) of 250 arcsec. This value at the sapphire wafer surfaces indicated 0.12${\mu}{\textrm}{m}$ sizes. Surfaces of sapphire wafers were mechanically affected by residual stress and surface default. Also Surfaces roughness of sapphire wafers were measured 2.1 by AFM(Atom Force Microscope).

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Feasibility Study on Design of Thrust Bearing for Micro Gas Turbine/Generator (초소형 가스 터빈/제너레이터용 스러스트 베어링의 설계 및 타당성에 관한 연구)

  • 곽현덕;이용복;김창호;장건희
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2001.11a
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    • pp.273-281
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    • 2001
  • Feasibility study of gas-lubricated bearing in micro gas turbine was performed. Based on Reynolds equation, finite difference method with coupled boundary was developed to analyze bearing characteristics, such as load-carrying capacity, mass flow rates and stiffness. By the bearing force and mass flow rates analysis with the variation of supply pressure, bearing clearance and capillary radius, acceptable range of design parameters were suggested in terms of load capacity and stiffness of bearings. Additionally, coupled boundary effect on pressure distribution was investigated and it is stated that coupling could reduce all excitation force due to narrow pressure distribution.

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On the Relationship between Material Removal and Interfacial Properties at Particulate Abrasive Machining Process (연마가공에서의 접촉계면 특성과 재료제거율간의 관계에 대한 연구)

  • Sung, In-Ha
    • Tribology and Lubricants
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    • v.25 no.6
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    • pp.404-408
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    • 2009
  • In this paper, the relationship between the material removal rate and the interfacial mechanical properties at particle-surface contact situation, which can be seen in an abrasive machining process using micro/nano-sized particles, was discussed. Friction and stiffnesses were measured experimentally on an atomic force microscope (AFM) by using colloidal probes which have a silica colloid particle in place of tip to simulate a particle-flat surface contact in an abrasive machining process. From the experimental investigation and theoretical contact analysis, the interfacial contact properties such as lateral stiffness of contact, friction, the material removal rate were presented with respect to some of material surfaces and the relationship between the properties as well.