• Transactions on Electrical and Electronic Materials
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• v.6 no.3
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• pp.87-90
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• 2005

$SiO_2$ via-hole etching with a high aspect ratio is a key process in fabricating ULSI devices; however, accumulated charge during plasma etching can cause etching stop, micro-loading effects, and charge build-up damage. To alleviate this concern, charge-up damage sensor was fabricated for the ultimate goal of real-time monitoring of accumulated charge. As an effort to reach the ultimate goal, fabricated sensor was used for electrical potential measurements of via holes between two poly-Si electrodes and roughly characterized under various plasma conditions using statistical design of experiment (DOE). The successful identification of potential difference under various plasma conditions not only supports the evidence of potential charge-up damage, but also leads the direction of future study.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.2
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• pp.159-164
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• 2012

In this paper, it tried to develop the core sensor for detection of micro magnetic field in electric wires. The sensor is non contact type and is consisted of ferrite core for low price. To investigate their properties for variations of current, it changed the number of winding and the length of sample core, it examined, to check the live wire situation in built-in wires, electrical characteristics due to difference between electric wires and core sensor. As the results, it verified live wire situation at the number of winding(5,000) and within length of 6[cm]. Also, it obtained magnetic field magnitude decreased inverse proportion ratio to a square about difference between electric wires and core sensor.

• Journal of Industrial Technology
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• v.32 no.A
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• pp.109-114
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• 2012

In this paper, We studied LED(Light Emitted Diode) sensor lights system using PIR(Pyroelectric Infrared Ray) sensor, CdS and MCU(Micro Controller Unit). And applied the valley fill circuit to improve the power factor. We designed the amplifier for each sensor and the LED driver for constant current which is the buck converter. Also, we proposed the algorithm of LED control by each sensors using MCU. Experimental results showed that power factor is 92% with valley fill circuit.

• IEMEK Journal of Embedded Systems and Applications
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• v.4 no.3
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• pp.103-111
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• 2009

Software update has been regarded as one of fundamental functions in wireless sensor networks. It can disseminate a delta-image between a current software image operating on a sensor node and its new image in order to reduce an update image(transmission data) size, resultantly saving energy. In addition, code-banking capability of micro-controllers can decrease the update image size. In order to maximize the efficiency of the software update, the proposed scheme exploits both the delta-image and the code-banking at the same time. Besides, it additionally delivers a recovery delta-image to properly handle abnormal conditions, such as message corruptions and unexpected power-off during the update.

• Transactions on Electrical and Electronic Materials
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• v.7 no.4
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• pp.184-188
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• 2006

This work describes efforts in the fabrication and testing of robust microelectromechanical systems (MEMS). Robustness is typically achieved by investigating non-silicon substrates and materials for MEMS fabrication. Some of the traditional MEMS fabrication techniques are applicable to robust MEMS, while other techniques are drawn from other technology areas, such as electronic packaging. The fabrication technologies appropriate for robust MEMS are illustrated through laminated polymer membrane based pressure sensor arrays. Each array uses a stainless steel substrate, a laminated polymer film as a suspended movable plate, and a fixed, surface micromachined back electrode of electroplated nickel. Over an applied pressure range from 0 to 34 kPa, the net capacitance change was approximately 0.14 pF. An important attribute of this design is that only the steel substrate and the pressure sensor inlet is exposed to the flow; i.e., the sensor is self-packaged.

• Journal of Sensor Science and Technology
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• v.24 no.5
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• pp.281-286
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• 2015

The importance of air quality monitoring is rapidly increasing. Even though state-of-the-art air quality monitoring technologies such as mass spectrometry, gas chromatography, and optical measurement enable high-fidelity measurement of air pollutants, they cannot be widely used for portable or personalized platforms because of their high cost and complexity. Recently, personalized and localized environmental monitoring, rather than global and averaged environmental monitoring, has drawn greater attention with the advancement of mobile telecommunication technologies. Here, micro- and nano-technologies enable highly integrated and ultra-compact sensors to meet the needs of personalized environmental monitoring. In this paper, several examples of MEMS-based gas sensors for compact and personalized air quality monitoring are explained. Additionally, the principles and usage of functional nanomaterials are discussed for highly sensitive and selective gas sensors.

• Transactions of the Society of Information Storage Systems
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• v.2 no.2
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• pp.91-95
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• 2006

High-density image sensors rave microlens array to improve photosensitivity. It is conventionally fabricated by reflow process. The reflow process has some weak points. UV imprinting process can be proposed as an alternative process to integrate microlens array on photodiodes. In this study, the UV imprionting process to integrate microlens array on image sensor was developed using UV transparent flexible mold and simulated image sensor substrate. The UV transparent flexible mold was fabricated by replicating master pattern using siliconacrylate photopolymer. The releasing property and shape accuacy of siliconacrylate mold was analysed. After UV imprinting process, replication quality and align accuracy was analysed.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.34-34
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• 2003

Piezoelectric or magnetostrictive materials, known as smart materials, have been researched widely for sensors or actuators in micro system technology. In our research, thick sol-gel lead zirconate titanate(Pb(Zr$\sub$1-x/Ti$\sub$x/)O$_3$) films were fabricated and their characteristics were investigated f3r angular rate sensor applications. The thickness of the PZT films is 1.5${\mu}$m, which is required by a vibration angular rate sensor for a good actuation and sensing. The remnant polarization of the PZT flms is 12.0 ${\mu}$C/$\textrm{cm}^2$. The electromechanical constants of PZT thin film showed the value of susceptance(B) of 4800${\mu}$ s at capacitance of 790pF. The PZT films were applied to the vibration angular rate sensor structure and the vibration of 1.78 ${\mu}$m in amplitude at the resonant frequency of 35.8㎑ was obtained by driving voltage of 5V$\sub$p-p/ of bulk piezoelectric materials with out of phase signal through voltage and inverting amplifier.

• Proceedings of the Korea Society of Information Technology Applications Conference
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• 2005.11a
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• pp.81-84
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• 2005

Various design schemes for network using wireless sensor nodes have been widely studied on the several application areas ranging from the real world information collection to environmental monitor. Currently, the schemes are focused on the design of sensor network for low power consumption, power-aware routing protocol, micro miniature operating system and sensor network middleware. The indoor localization system that identifies the location of the distributed nodes in a wireless sensor network requires features dealing with mobility, plurality and other environmental constraints of a sensor node. In this paper, we present an efficient location system to cope with mobility of multiple mobile nodes by designing a location handler that processes location information selectively depending on the nodes' density in a specific region. In order to resolve plurality of multiple mobile nodes, a routing method for the location system is also proposed to avoid the occurrence of overlapped location data.

• Journal of KIISE:Information Networking
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• v.35 no.3
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• pp.207-214
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• 2008

There are lots of studies on application systems using wireless sensor networks. As the application systems are adapted to industrial field, the reliability of these systems becomes new key feature. The lack of reliability is an obstacle to extension of wireless sensor networks. In this paper, we propose the monitoring system framework that can offer the reliability of wireless sensor networks using a micro camera module and wireless sensor network nodes. And also we propose the efficient transfer method for image information over low rate wireless networks. Using these system framework and transfer method, we implement WiSN(Wireless image Sensor Network) based fire monitoring system.