• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.963-966
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• 2000

Abrasive jet machining(AJM) process is similar to the sand blasting, and effectively removes hard and brittle materials. AJM has applied to rough working such as deburring and rough finishing. As the needs for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro groove cutting of glass. Diameter of hole and width of line in this groove cutting is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro groove cutting in glass, but the size of machined groove was increased about 2~4${\mu}{\textrm}{m}$. therefore, this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD parts.

• 대한기계학회논문집B
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• 제33권10호
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• pp.789-796
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• 2009

Microdroplet deposition in a micro-groove is studied numerically. The droplet shape is determined by a level-set method which is improved by incorporating a sharp-interface modeling technique for accurately enforcing the matching conditions at the liquid-gas interface and the no-slip and contact angle conditions at an immersed solid surface. The computations are carried out to investigate the droplet behavior derived by the interfacial characteristics between the liquid-gas-solid phases. The effects of contact angle, impact velocity and groove geometry on droplet deposition in a micro-groove are quantified.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2001년도 춘계학술대회 논문집(한국공작기계학회)
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• pp.294-299
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• 2001

The old technique of sandblasting which has been used for decoration of glass surface has recently been developed into a powder blasting technique for various materials, capable of producing micro structures larger than 100 m. This paper describes the performance of powder blasting technique in micro-line grooving of glass and the effect of the number of nozzle scanning on the depth and width of line groove. Experimental results showed that increasing the no. of nozzle scanning resulted in the increase of depth and width in grooves. Increase of width which may cause several problems in the precision machining results from wear of mask film.

• 대한기계학회논문집A
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• 제26권7호
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• pp.1280-1287
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• 2002

The old technique of sandblasting which has been used for decoration of glass surface has recently been developed into a powder blasting technique for brittle materials such as glass, silicon and ceramics, capable of producing micro structures larger than $100{\mu}$ m. This paper describes the performance of powder blasting technique in micro-line grooving of glass and the effect of the number of nozzle scanning on the depth and width of line groove. Experimental results showed that increasing the no. of nozzle scanning resulted in the increase of depth and width in grooves. Increase of width which may cause several problems in the precision machining results from wear of mask film. Therefore, well-controlled masking process is the most important factor for micro machining of glass with accuracy.

• 한국정밀공학회지
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• 제18권10호
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• pp.178-183
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• 2001

Abrasive jet machining(AJM) process is similar to the sand blasting and effectively removes hard and brittle materials. AJM has applied to rough working such as debarring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM is developed, and has become the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro grooving of glass. Diameter of hole and width of line in grooving is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro grooving of glass, but the size of machined groove increased about 2~4${\mu}{\textrm}{m}$. With the fine tuning of masking process and compensation of film wear. this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD.

• 한국정밀공학회지
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• 제21권5호
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• pp.38-45
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• 2004

As optical communication is being substituted for telecommunication, the demand of a large variety of fiber optic components is increasing. V-groove substrates, one of the module components, are used to connect optical fibers to optical planar circuits and to arrange fibers. Their applications are multi-channel optical connectors and optical waveguide fiber coupling, etc. Because these substrates are a critical part of the splitter in a multiplexer and a multi fiber connector, precise and reliable fabrication process is required. For precisely aligning core pitch between fibers, machined core pitch tolerance should be within sub-microns. Therefore, these are generally produced by state-of-the-art micro-fabrication like MEMS. However, most of the process equipment is very expensive. It is also difficult to change the process line for custom designs to meet specific requirements using various materials. For various design specifications such as different values of the V angle and low-priced process, the fabrication method should be flexible and low cost. To achieve this goal, we have suggested a miniaturized machine tool with high accuracy positioning system. Through this study, it is shown that this cutting process can be applied to produce V-groove subtracts. We also show the possibility of using a miniaturized machining system for producing small parts.

• 한국생산제조학회지
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• 제22권3호
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• pp.408-413
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• 2013

Micro-features such as grooves and lenses, which perform optical functions in flat displays, should be manufactured with a good form accuracy because this is directly related to their optical performance. As the size of the display increases, it is very difficult to maintain a high relative accuracy because of the inherent geometric errors such as the waviness of a large-area plate. In this paper, the optical effect of these geometric errors is investigated, and surface-referenced micro-grooving to measure and compensate for such geometric errors on line is proposed to improve the form accuracy of the micro-grooves. A PZT-based fast depth adjustment servo system is implemented in the tool holder to maintain a uniform groove depth in reference to the wavy surface. Through experiments, the proposed method is shown to be an efficient way to produce high-quality micro- grooves on a wavy die surface.

• 한국정밀공학회지
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• 제22권7호
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• pp.27-37
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• 2005

Direct writing technology on the silicon wafer surface is used to reduce the size of the chip as the miniature trend in electronic circuit. In order to improve the productivity and efficiency, the real time quality estimation is very important in each semiconductor process. In laser marking, marking quality is determined by readability which is dependant on the contrast of surface, the line width, and the melting depth. Many researchers have tried to find theoretical and numerical estimation models fur groove geometry. However, these models are limited to be applied to the real system. In this study, the estimation system for the line width during the laser marking was proposed by process monitoring method. The light intensity emitted by plasma which is produced when irradiating the laser to the silicon wafer was measured using the optical sensor. Because the laser marking is too fast to measure with external sensor, we build up the coaxial monitoring system. Analysis for the correlation between the acquired signals and the line width according to the change of laser power was carried out. Also, we developed the models enabling the estimation of line width of the laser marking through the statistical regression models and may see that their estimating performances were excellent.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1597-1600
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• 2005

Recently, the trends of TFT-LCD are large scale and thin thickness, so, the demands of Light Guide Panel(LGP) which is able to substitute for prism sheets are appeared. Functions of LGP obtaining polarization of light of the prism sheet as well as the incidence and reflection of light are demanded. This prismless type LGP to complete functions of the existing LGP and polarization at once must be supported by micro machining technology of LGP surface. In this research, we have used the STAMPER method for the mass product and In-Line process, and the optimized conditions are established by analyzing the cutting force and conditions according to the material and processing properties when the prismless type LGP mold is fabricated. Parameters of the cutting condition were the workpiece and cutting depth.

• 소성∙가공
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• 제13권4호
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• pp.326-333
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• 2004

The nanoprobe based on lithography, mainly represented by SPM based technologies, has been recognized as a potential application to fabricate the surface nanosctructures because of its operational versatility and simplicity. However, nanoprobe based on lithography itself is not suitable for mass production because it is time a consuming method and not economical for commercial applications. One solution is to fabricate a mold that will be used for mass production processes such as nanoimprint, PDMS casting, and others. The objective of this study is to fabricate the silicon stamper for PDMS casting process by a mastless fabrication technique using the combination of nano/micro machining by Nanoindenter XP and KOH wet etching. Effect of the Berkovich tip alignment on the deformation was investigated. Grooves were machined on a silicon surface, which has native oxide on it, by constant load scratch (CLS), and they were etched in KOH solutions to investigate chemical characteristics of the machined silicon surface. After the etching process, the convex structures was made because of the etch mask effect of the mechanically affected layer generated by nanoscratch. On the basis of this fact, some line patterns with convex structures were fabricated. Achieved groove and convex structures were used as a stamper for PDMS casting process.