• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.5
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• pp.365-371
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• 2003

We prepared silicon on insulator(SOI) wafer pairs of Si/1800${\AA}$ -SiO$_2$ ∥ 1800${\AA}$ -SiO$_2$/Si using water direct bonding method. Wafer pairs bonded at room-temperature were annealed by a normal furnace system or a fast linear annealing(FLA) equipment, and the micro-structure of bonding interfaces for each annealing method was investigated. Upper wafer of bonded pairs was polished to be 50 $\mu\textrm{m}$ by chemical mechanical polishing(CMP) process to confirm the real application. Defects and bonding area of bonded water pairs were observed by optical images. Electrical and mechanical properties were characterized by measuring leakage current for sweeping to 120 V, and by observing the change of wafer curvature with annealing process, respectively. FLA process was superior to normal furnace process in aspects of bonding area, I-V property, and stress generation.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.555-556
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• 2007

This paper proposes a new concept's IDSFHA(Intelligent Digital Switchgear For Home Automation) which can obtain the safety, the reliability and the easy to correspond to the request of the general electric customer or electric power company under the ubiquitous-based home automation environments The IDSFHA is designed by analyzing their requirement functions, a 32-bit micro processor is adopted as main controller to support efficiently the designed functions. The single phase power IC(ADE7753) is utilized to collect the electric power information, and makes it possible to communicate as internet among the IDSFHA and their using the ethernet convertor. In the proposed IDSFHA, the several functions are implemented such as the earth leakage level display and waveform transmitting, the electric power using fee display, voltage management, load management and load control function. Finally, the prototype of the IDSFHA is made experimently based on the designed results.

• Tribology and Lubricants
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• v.27 no.6
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• pp.338-343
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• 2011

Laser surface texturing (LST) methods are widely applied now to reduce friction and improve reliability of machine components such as thrust bearings, mechanical face seals and piston rings, etc. In this paper, the effect of dimple shapes on the lubrication characteristics of parallel thrust bearing are studied using a commercial computational fluid dynamics (CFD) code, FLUENT. Pressure and streamline distributions, variations of supporting load, leakage flow rate and friction force, are compared for three different dimple sectional shapes such as circle, pyramid and rectangle type. The lubrication characteristics are highly affected by dimple shapes and number of dimples. The pyramid type dimple shape can support the highest load while the rectangle type is the best in friction reduction.

• Proceedings of the KACD Conference
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• 2003.11a
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• pp.572-572
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• 2003

There were attempts to reduce the micro leakage and surface roughness of resin composite. One of them is surface sealing. The purpose of this study was to compare the effect of materials, specifically developed for surface sealing, on microleakage and surface roughness in Class V composite restorations. Twenty five standardized Class V cavity preparations were made on the facial surface of extracted human premolars and were randomly assigned to 5 groups. The teeth were restored with Z-250 resin composite after applying Single Bond adhesive system.(중략)

• Proceedings of the KACD Conference
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• 2003.11a
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• pp.574-574
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• 2003

I. Objectives Newly all-in-one adhesives were developed for reducing the techique sensitivity and chair time, but lots of concerns were made on bondability, longevity, and microleakage. The object of this study was to measure micro leakage and marginal quality of all-in-one adhesives using electrochemical method and SEM analysis quantitatively. II. Materials and Methods After making Class V cavities, they were bulk filled with Heliomolar(＃A1) after surface treatment with three adhesives：Adper Prompt (Group 1), One up bond F (Group 2), Xeno III(Group 3).(omitted)

• Proceedings of the Korean Society of Plant Pathology Conference
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• 2003.10a
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• pp.64.1-64
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• 2003

Inoculation of primary pepper leaves with an avirulent strain of Xanthomonas campestris pv. vesicatoria induced systemic acquired resistance (SAR) in secondary leaves. This SAR response was accompanied by the systemic expression of defense-related genes, a systemic microoxidative burst generating H2O2, and the systemic induction of ion-leakage and callose deposition in the non-inoculated, secondary leaves. Some defense-related genes encoding PR-1, chitinase, peroxidase, PR10, thionin, defensin and zinc-finger protein were distiilctly induced in the systemic leaves. The systemically striking accumulation of H$_2$O$_2$and strong increase in peroxidase activity in pepper was suggested to contribute to the triggering of cell death In the systemic micro-HRs, leading to the induction of SAR. Treatment of non-inoculated, secondary leaves with diphenylene iodinium (DPI), an inhibitor of the oxidative burst, substantially reduced the induction of some defense-related genes and subsequently SAR.

• Journal of the korean academy of Pediatric Dentistry
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• v.36 no.2
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• pp.189-198
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• 2009

As a part of an effort to minimize the polymerization shrinkage which is considered to be a major cause of failed bonds to tooth, newly designed 'Double LED system' was tested in the present study. Analyses were performed on the pattern of micro-leakage and the changes of strain which have occurred during the polymerization process. The results can be summarized as follows: 1. In the strain change, dramatic increase was observed with initiation of polymerization which was followed by subsequent gradual decrease with elapse of time in both the single LED system and double LED system. 2. The single LED system were shown to develop and maintain the maximum stress more than double LED system(p<0.05). 3. Less micro-leakage was found in the double LED system than in the single LED system(p<0.05). From the above-mentioned results, the double LED system can be a very useful tool in a sense of reducing polymerization shrinkage when compared to the single LED system. However, practical problems such as size of curing unit and its application method with its light intensity should be solved before its clinical application.

• Journal of Sensor Science and Technology
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• v.6 no.1
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• pp.72-80
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• 1997

One of the concerns in micro fluidic valve designs is that of reverse direction leakage. This paper designs and fabricates a new fluidic valve to achieve zero leakage. The design uses flapper and nozzle elements. In the forward direction the working fluid pushes the flapper upward to allow flow. In the reverse direction, the flapper pushes against the orifice seat, and thus, no flow can be generated, unless the flapper or nozzle element breaks. The nozzle element fabrication involves fabricating an orifice by wet etching of (100) wafer, The flapper element fabrication involves $20{\mu}m$ deep patterning of the negative image of the flapper, followed by wet etching from backside. Flow experiments were conducted with DI water as the working fluid, and the results are compared to analytical predictions. The results show that the developed flapper-nozzle valve achieves a true diodic flow characteristic.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.15 no.3
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• pp.271-277
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• 2004

A Si(Silicon) MEMS(Micro Electro Mechanical System) package using a doped lossy Si carrier for CPW(Coplanar Waveguide) MMICs(Microwave and Millimeter-wave Integrated Circuits) is proposed in order to reduce parasitic problems of leakage, coupling and resonance. The proposed chip-carrier scheme is verified by fabricating and measuring a GaAs CPW on the two types of carriers(conductor-back metal, doped lossy Si) in the frequency from 0.5 to 40 ㎓. The proposed MEMS package using the lightly doped lossy(15 Ω$.$cm) Si chip-carrier and the HRS(High Resistivity Silicon, 15 ㏀$.$cm) shows the optimized loss and parasitic problems-free since the doped lossy Si-carrier effectively absorbs and suppresses the resonant leakage. The Si MEMS package for CPW MMICs has an insertion loss of only - 2.0 ㏈ and a power loss of - 7.5 ㏈ at 40 ㎓.

• Restorative Dentistry and Endodontics
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• v.18 no.2
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• pp.447-462
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• 1993

To evaluate the marginal leakage in Class V cavity this study has been undertaken to compare the sandwich technique with the conventional method, and find out the effect of lining material, lining method, and polishing time on sandwich technique. Ninty extracted teeth were divided into eight test groups and a control group, and were prepared with a buccal Class V cavity. Four test groups were lined with Dentin Cement whereas the other four test groups were lined with Vitrabond. Half of the either group were lined 0.5mm short of the carvosurface margin and the rest were lined completely to the carvosurface margin. The four subgroups were further divided into specimens which were polished immediately and 24 hours after resin filling. The polished specimens were immersed in $37^{\circ}C$, 0.5% methylene blue solution for 24 hous after thermocycling at $5^{\circ}C$ and $55^{\circ}C$, 200 times and buccolingually sectioned. The sectioned specimens were examined dye penetration under the light microscope. The following results were obtained, 1. At the enamel margin, the conventional method showed a lower microleakage than the sandwich technique. The difference between the control and Vitrabond group was statistically significant(P<0.05), but no difference between the control and Dentin Cement group, and between the lining materials was observed. 2. At the dentinal margin, the sandwich technique showed a significant lower amount of microleakage (P<0.05), but there was no significant difference between the lining materials. 3. Regardless of the lining material, lining method, and polishing time used, values of microleakage were significantly higher at the dentinal margin compared to the enamel margin(P<0.05). 4. In specimens till the cavosurface margin, microleakage at the dentinal margin was less with the light-cured base than with the chemically-cured base, but there was no siginificantly difference between the lining materials regarding the lining method and polishing time. 5. The lining material, lining method, and polishing time did not affect the amount of micro leakage in the sandwich technique(P<0.05).