• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.40-44
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• 2010

Laser drilling is an enabling technology for Through Silicon Via (TSV) interconnect applications. Recent advances in picoseconds laser drilling of blind, micron sized vias in silicon is presented here highlighting some of the attractive features of this approach such as excellent sidewall quality. In this study, we dealt with comparison of heat affection around drilled hole between a picosecond laser and a nanosecond laser process under the UV wavelength. Points which special attention should be paid are that picosecond laser process lowered experimentally recast layer, surface debris and micro-crack around hole in comparison with nanosecond laser process. These finding suggests that laser TSV process has possibility to drill under $10{\mu}m$ via. Finally, the laser drilling platform was constructed successfully.

• Laser Solutions
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• v.13 no.2
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• pp.1-5
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• 2010

A high speed laser texturing method that relies on laser scanner conditions, to form pattern shapes with micro-narrow surface detail such as dotted line features is demonstrated and analyzed. For example, this method may be used to piston ring and gear part for automotive. Data on friction characteristics of two laser patterns employed for STD61 steel will be shown. Comparison of pattern depths obtained by repetition overlapping process with laser scanner to the results on friction coefficient will be provide. It will be shown that friction characteristic in dotted line patterns can significantly depend upon interaction with the lubrication and laser pattern conditions. Laser pattern processing into a shallow depth provides only slight improvement in friction, while work into a deep shape indicates a significant improvement.

• Journal of the Korean Ceramic Society
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• v.50 no.6
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• pp.378-383
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• 2013

Continuous fiber-reinforced ceramic matrix composites (CFCCs) have a complex distribution of porosity, consisting of interfiber micro pores and interbundle/interply macro pores. Owing to the complex geometry of the pores and fiber architecture, it is difficult to obtain representative microstructural features throughout the specimen volume with conventional, destructive ceramographic approaches. In this study, we introduce X-ray computed microtomography (X-ray ${\mu}CT$) to nondestructively analyze the microstructures of disk shaped and tubular $SiC_f$/SiC composites fabricated by the chemical vapor infiltration (CVI) method. The disk specimen made by stacking plain-woven SiC fabrics exhibited periodic, large fluctuation of porosity in the stacking direction but much less variation of porosity perpendicular to the fabric planes. The X-ray ${\mu}CT$ evaluation of the microstructure was also effectively utilized to improve the fabrication process of the triple-layered tubular SiC composite.

• Publications of The Korean Astronomical Society
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• v.30 no.2
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• pp.109-112
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• 2015

We present [$Fe\;{\small{II}}$] ${\lambda}1.257{\mu}m$ spectra toward the interacting binary UY Aur with 0".14 angular resolution, obtained with the Near infrared Integral Field Spectrograph (NIFS) combined with the adaptive optics system Altair of the GEMINI observatory. In the [$Fe\;{\small{II}}$] emission, UY Aur A (primary) is brighter than UY Aur B (secondary). The blueshifted and redshifted emission between the primary and secondary show a complicated structure. The radial velocities of the [$Fe\;{\small{II}}$] emission features are similar for UY Aur A and B: ${\sim}-100km\;s^{-1}$ and ${\sim}+130km\;s^{-1}$ for the blueshifted and redshifted components, respectively. Considering the morphologies of the [$Fe\;{\small{II}}$] emissions and bipolar outflow context, we concluded that UY Aur A drives fast and widely opening outflows with an opening angle of ${\sim}90^{\circ}$ while UY Aur B has micro collimated jets.

• Convergence Security Journal
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• v.13 no.4
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• pp.27-32
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• 2013

In this paper, technologies applied to design urination detection device on diaper that issues an alarm signal to guardian within 10~20m are introduced. It features power saving that uses both low power bluetooth v4.0 chip and low-power program scheme that makes sensor and mirco-controller to be sleep mode while data is not receiving from sensor. Urination detection algorithm that utilizes the difference between previous sensing data and current values is used to improve the degree of the detection precision level. The device designed with the suggested technologies shows the performance that is 100ml of the minimum urine amount for detection, more than 90% of urination detection degree, and 100% of wireless communication success rate.

• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.7
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• pp.979-986
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• 2013

Recently, in the electric, electronic, robotic, and medical industries, a great attention has been paid to the development of MEMS-based smart devices with a compact size and highly intelligency. The MEMS technology is very effective in designing into a compact size and lightweight by combining into one the complex electrical, mechanical, chemical, and biological features which are required by smart devices, and at the same time, in bulk batch manufacturing. Therefore, this study, to prepare for upcoming new MEMS-based technological paradigm, analyzes MEMS processes and then considers its Applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.409-412
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• 1997

The phenomenon of water tree degradation of underground distribution power cables is taking place in polymeric insulation materials under the existence of water and application of electric stress, but water tree is not easy to observe, o water tree features in power cables are shown after cutting and dying with methyleneblue. In previous method, it is impossible to acquire continuous treeing data, and when the insulation material has been cut, the micro crack(water tree) has been damaged. In this paper, to overcome these deflects, the etching method is made use of making needle electrode about 170[${\mu}{\textrm}{m}$] diameter, and AgNO$_3$(silver nitrate) solution is used as liquid electrode to accelerate the growth of water trees. As a result of this study, water tree is observed in real-time with microscope. Electrical tree owing to water treeing is initiated at low electric field and grown with discontinuous. Namely, water tree is shown up a different characteristics of tree growth.

• Journal of Sensor Science and Technology
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• v.17 no.6
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• pp.406-413
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• 2008

We have been implemented simple statistical pattern recognition methods for harmful gases classification using gas sensors array fabricated by MEMS (Micro Electro Mechanical System) technology. The performance of pattern recognition method as a gas classifier is highly dependent on the choice of pre-processing techniques for sensor and sensors array signals and optimal classification algorithms among the various classification techniques. We carried out pre-processing for each sensor's signal as well as sensors array signals to extract features for each gas. We adapted simple statistical pattern recognition algorithms, which were PCA (Principal Component Analysis) for visualization of patterns clustering and MLR (Multi-Linear Regression) for real-time system implementation, to classify harmful gases. Experimental results of adapted pattern recognition methods with pre-processing techniques have been shown good clustering performance and expected easy implementation for real-time sensing system.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.20-23
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing(CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Chemical-Mechanical polishing(CMP) of conductors is a key process in Damascene patterning of advanced interconnect structure. The effect of alternative commercial slurries pads, and post-CMP cleaning alternatives are discuss, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. Electroplated copper deposition is a mature process from a historical point of view, but a very young process from a CMP perspective. While copper electro deposition has been used and studied for decades, its application to Cu damascene wafer processing is only now gaining complete acceptance in the semiconductor industry. The polishing mechanism of Cu-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. however it is important to understand the effect of oxidizer on copper passivation layer in order to obtain higher removal rate and non-uniformity during Cu-CMP process. In this paper, we investigated the effects of oxidizer on Cu-CMP process regarding the additional volume of oxidizer.

• Journal of Korean Society of Steel Construction
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• v.23 no.4
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• pp.465-474
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• 2011

In this study, a microgenetic algorithm was used to find the optimum cross-section and shape of dome structures. The allowable stress and Euler buckling stress were considered constraints when the weight of the trusses was minimum. The design optimization of the truss structures involved arriving at the optimum sizes of the cross-section and geometric coordinate. The features of the proposed method, which helped in the modeling of and application to the optimal design of truss structures, were demonstrated using the microgenetic algorithm, by solving sample problems.