• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 춘계학술대회 논문집
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• pp.60-63
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• 2009

Manufacturing technologies of micro spur gear and micro mold by micro PIM were studied with stainless steel feedstock. For molding of gears, micro mold with gear cavity of 1.2 mm in diameter was produced by wire EDM. The proper injection pressure was selected to 70bar by observation and measuring of shapes and shrinkage of gears before/after sintering. For fabrication of micro mold, a tiny polymer gear was produced by injection into the mold. Then, 316L feedstock was again injected/compressed on the polymer gear and debinded together with polymer gear followed by sintering. As a result, another metal mold with gear cavity reduced to about 20% was fabricated and through repetition of this process chain, micro gear mold with cavity about below 800 um was finally obtained. In reduction of size by injection/compression molding, height of gear tooth was shrunk more and the effort for decrease of roughness of micro cavity were carried out ultrasonic polishing and as a result, the roughness in cavity decreased from 3-4 um to about 200 nm.

• Design & Manufacturing
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• 제10권3호
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• pp.8-13
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• 2016

Despite technological advance, there have been several troubles in photo reaction injection molding (photo RIM) to produce ultra thin light guide panels (LGPs). In this study, micro leakage problem at cavity edge during photo RIM was investigated numerically. In order to obtain optimal processing conditions, we regulated inlet pressure of injected resin at the cavity edge and figured out micro leakage behaviors. At low inlet pressure (less than 100 Pa), though the micro leakage problem was not occurred, another problem, short shot due to not enough driving force, was appeared More than 1,000 Pa of the inlet pressure, injected resin was rapidly leaked through the micro gap at the cavity edge. Finally, we obtained optimal inlet pressure around 600 ~ 1,000 Pa. At this region, injected resin fully filled the cavity without micro leakage behavior. Based on the present study, further comparative investigations with experimental photo RIM should be performed to find optimal processing conditions for produce ultra thin LGPs.

• 한국기계가공학회지
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• 제18권1호
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• pp.101-108
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• 2019

In this study, the hole-cavity resonance technology and the micro pore stainless chip sintering technology were fused to develop silencers with excellent noise attenuation performance even at fluid pressures exceeding 30 bar for the first time at home and abroad. As a result of this study, the noise attenuation performance was greatly improved as reflection, loss, and resonance were made to occur thousands of times simultaneously when fluids pass through the sintered micro pore stainless steel chip sound absorber. The noise of the gas emitted from the bomb without the silencer was shown to be 125dB. And noise test conducted after installation of the silencer showed the noise of 67dB. Given the study results, the amount of noise was greatly reduced in the sintered silencer.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 춘계학술대회 논문집
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• pp.258-262
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• 2008

Micro forming is a suited technology to manufacture very small metallic parts(several $mm{\sim}{\mu}m$). In this study, the micro forming property was studied, using Al5083 superplastic alloy with micro grain, suitable for the micro forming process and Zr-BMG amorphous with pseudo-superplastic phenomena in the supercooled liquid state. Micro forming experiments under stastic load status showed that distortion by slip and spin of the grain system and slip inside the grain was observed in the Al5083 superplastic alloy. In case of Zr-BMG, because there is no grain, the distribution of the forming property was similar to the load distribution between punch and metal.

• 반도체디스플레이기술학회지
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• 제21권3호
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• pp.119-124
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• 2022

Top emission organic light-emitting diode (TEOLED) is commonly used because of high efficiency and good color purity than bottom - emission organic light-emitting device (BEOLED). Unlike BEOLED, TEOLED contain semitransparent metal cathode and capping layer. Because there are many characteristics to consider just simple thickness change, optimizing organic thickness of TEOLED for microcavity is difficult. So, in this study, we optimized Device capping layer at unoptimized micro-cavity structure TEOLED device. And we compare only capping layer with unoptimized microcavity structure can overcome optimized micro-cavity structure device. We used previous our optimized micro-cavity structure to compare each other. As a result, it has been found that the efficiency can be obtained almost the same or higher only capping layer, which is stacked on top of the device and controls only the thickness and refractive index, without complicated structural calculations. This means that higher efficiencies can be obtained more easily in laboratories with limited organic materials or when optimizing new structures etc.

• 반도체디스플레이기술학회지
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• 제21권1호
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• pp.91-94
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• 2022

Top emission organic light-emitting diode is commonly used because of high efficiency and good color purity than bottom - emission organic light-emitting device. Unlike BEOLED, TEOLED contain semi-transparent metal cathode. Because of semi-transparent cathode, micro cavity effect occurs in TEOLED. We optimized this effect by changing the thickness of hole injection layer. Device consists of is indium-tin-oxide / N,N'-Di-[(1-naphthyl)-N,N'-diphenyl]-1,1'-biphenyl-4,4'-diamine (x nm) / tris-(8-hydroxyquinoline) aluminum (50nm) / LiF(0.5nm) / Mg:Ag (1:9), and we changed NPB thickness which is used as HTL in our device in order to study how micro cavity effects are changed by optical path. As the results, NPB thickness at 35nm showed the current efficiency of 8.55Cd/A.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 춘계학술대회 논문집
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• pp.43-46
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• 2005

Micro molding technology is a promising mass production technology for polymer based microstructures. Mass production technologies such as the micro injection/compression molding, hot embossing, and micro reaction molding are already in use. In the present study, we have developed a numerical analysis system to simulate three-dimensional non-isothermal cavity filling for hot embossing, with a special emphasis on the free surface capturing. Precise free surface capturing has been successfully accomplished with the level set method, which is solved by means of the Runge-Kutta discontinuous Galerkin (RKDG) method. The RKDG method turns out to be excellent from the viewpoint of both numerical stability and accuracy of volume conservation. The Stokes equations are solved by the stabilized finite element method using the equal order tri-linear interpolation function. To prevent possible numerical oscillation in temperature Held we employ the streamline upwind Petrov-Galerkin (SUPG) method. With the developed code we investigated the detailed change of free surface shape in time during the mold filling. In the filling simulation of a simple rectangular cavity with repeating protruded parts, we find out that filling patterns are significantly influenced by the geometric characteristics such as the thickness of base plate and the aspect ratio and pitch of repeating microstructures. The numerical analysis system enables us to understand the basic flow and material deformation taking place during the cavity filling stage in microstructure fabrications.

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권1호
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• pp.23-28
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• 2014

In this paper, we discuss on the optimal design scheme of the bilayer OLED (Organic Light Emitting Diodes) with micro-cavity structure. We carried out the optical simulation on the OLED device and calculated optimal scale of devices with taking the micro-cavity effect into account. Our emission model is based upon an ensemble of radiating dipole antennas. Consequently, we applied Maxwell's equation to this sequence, followed by the analysis on the electrical behaviors of OLED device using Poisson's equation. It contains carrier injection and transportation mechanism. In this process, we found out the thickness of each layer can affect the recombination rate at the emission layer. Therefore, we optimized the thickness of each layer to improve the efficiency of the device.

• 전기전자학회논문지
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• 제1권1호
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• pp.1-10
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• 1997

It is well-known that rectangular bulk-Si sensors prepared by etch or epi etch-stop micromachining technology are already in practical use today, but the conventional bulk-Si sensor shows some drawbacks such as large chip size and limited applications as silicon sensor device is to be miniaturized. We consider a circular-shape SOI(Silicon-On-Insulator) micro-cavity technology to facilitate multiple sensors on very small chip, to make device easier to package than conventional sensor like pressure sensor and to provide very high over-pressure capability. This paper demonstrates the cross-functional results for stress analyses(targeting $5{\mu}m$ deflection and 100MPa stress as maximum at various applicable pressure ranges), for finding permissible diaphragm dimension by output sensitivity, and piezoresistive sensor theory from two-type SOI structures where the double SOI structure shows the most feasible deflection and small stress at various ambient pressures. Those results can be compared with the ones of circular-shape bulk-Si based sensor$^{[17]}. The SOI micro-cavity formed the sensors is promising to integrate with calibration, gain stage and controller unit plus high current/high voltage CMOS drivers onto monolithic chip.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 춘계학술대회 논문집
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• pp.64-67
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• 2009

Vibrational micro-forming of pyramidal shape patterns was conducted for an Al superplastic alloy, Al 5083 and a Zr-based bulk metallic glass, $Zr_{62}Cu_{17}Ni_{13}Al_8$. A vibrational micro-forming system was specially designed for generating vibrational load by combining a PZT actuator with a signal generator. Single crystal Si micro dies with wet-etched pyramidal patterns were used as master dies for vibrational micro-forming. The micro-formed pattern height was increasing with increasing the frequency of the vibrational load. In particular, the vibrationally-microformed pattern height was similar or even higher than the statically-microformed pattern height when the load frequency exceeded about 125 kHz. It was also observed that the crystal grains affect the surface quality of the microformed pattern and the distribution of the pattern height in the die cavity array.