• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.05a
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• pp.71-73
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• 2006

This research aims to develop a multiple channel electrochemical DNA chip using micro- fabrication technology. At first, we fabricated a high integrated type DNA chip array by lithography technology. Several probe DNAs consisting of thiol group at their 5-end were immobilized on the gold electrodes. Then target DNAs were hybridized by an electrical force. Redox peak of cyclic-voltammogram showed a difference between target DNA and mismatched DNA in the anodic peak current. Therefore. it is able to detect a various genes electrochemically after immobilization of a various probe DNA and hybridization of label-free DNA on the electrodes simultaneously. It suggested that this DNA chip could recognize the sequence specific genes.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1526-1531
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• 2007

Data transmission capacity that is required in 2010 is forecasted that increase by optical communication capacity more than present centuple, and is doing increased demand of optical communication related industry product present. Specially, Lid glass' application that is one of optical communication parts is used in optical communication parts manufacture of Fiber array, Ferrule array, Fanout Black, Silica optical waveguide chip and splitter etc. Also, it is used widely for communication network system, CATV, ATM-PON, FTTH and system. But, Lid glass need much processing times and becomes cause in rising prices of optical communication parts because production cost is expensive. The objectives, of this work is to suggest the micro concave and convex pattern manufacturing technology on borosilicate plate using high temperature and compression molding method. As a result, could developed micro pattern Mold more than 5 pattern, and reduce Lid Glass manufacture cycle time.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.12
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• pp.853-857
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• 2013

We design, develope and test a parallel active polymer pen lithography (PPL) device, which consists of individually addressable elastomeric probe tips. The PPL array chip is fabricated using soft lithography method with polydimethylsiloxane (PDMS) material. Individual probe can be pneumatically actuated via a computer controlled interface. We demonstrate parallel writing with 16 individually addressed pens, with each pen producing a different pattern in the same run. The largest proof-of-concept array fabricated is $4{\times}4$ with a spacing of $250{\mu}m$ in both x and y axes.

• Proceedings of the KIEE Conference
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• 1987.07b
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• pp.1256-1259
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• 1987

This paper gives a new SRF (Sonic Range Finder) Array formation on the mobile robot. This SRF Array formation obtaine the mobile robot's environmental informations wider and faster than the other systems and detects the obstacles in the robot's path. It is processed and controlled by 8031, on-chip micro-computer. SRF Array sensors are drived by the LM1812 transceiver and selected by the 8-channel channel multiplexer. In this paper, it detects the obstacles in wider range and gives them to the MAIN to design the shortest modify path.

• Journal of Sensor Science and Technology
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• v.20 no.6
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• pp.428-433
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• 2011

We report on the building of a micro sensor array based on typical semiconductor fabrication processes aimed at monitoring selectively a specific gas in ambient of other gases. Chemical sensors can be applied for an electronic nose and/or robots using this technique. Microsensor array was fabricated on the same chip using 0.6${\mu}m$ CMOS technology, and unique gas sensing patterns were obtained by principal component analysis from the array. $SnO_2$/Pt sensor for CO gas showed a high selectivity to buthane gas and humidity. $SnO_2$ sensor for hydrogen gas, however, showed a low selectivity to CO and buthane gas. We can obtain more distinguishable patterns that provide the small sensing deviation(the high seletivity) toward a given analyte in the response space than in the chemical space through the specific parameterization of raw data for chemical image formation.

• Proceedings of the Microbiological Society of Korea Conference
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• 2002.10a
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• pp.22-26
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• 2002

There are a number of ways in which environmental microbiology and microbial ecology will benefit from DNA micro array technology. These include community genome arrays, SSU rDNA arrays, environmental functional gene arrays, population biology arrays, and there are clearly more different applications of microarray technology that can be applied to relevant problems in environmental microbiology. Two types of the applications, bacterial identification chip and functional gene detection chip, will be presented. For the bacterial identification chip, a new approach employing random genome fragments that eliminates the disadvantages of traditional DNA-DNA hybridization is proposed to identify and type bacteria based on genomic DNA-DNA similarity. Bacterial genomes are fragmented randomly, and representative fragments are spotted on a glass slide and then hybridized to test genomes. Resulting hybridization profiles are used in statistical procedures to identify test strains. Second, the direct binding version of microarray with a different array design and hybridization scheme is proposed to quantify target genes in environmental samples. Reference DNA was employed to normalize variations in spot size and hybridization. The approach for designing quantitative microarrays and the inferred equation from this study provide a simple and convenient way to estimate the target gene concentration from the hybridization signal ratio.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.11
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• pp.7-13
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• 2002

BSCT 320${\times}$240 IRFPA detector module is implemented, which is a key component in uncooled thermal imaging systems. The detector module consists of two parts, infrared sensitive pixel array and read-out integrated circuit(ROIC). The BSCT 320${\times}$240 pixels are made by laser scribe process and 10-${\mu}m$ micro-bump to satisfy 50-${\mu}m$ pitch and 95-% fill-factor. The ROIC has been designed to electrically address the pixels sequentailly and to improve signal-to-noise ratio with single transistor amplifier, HPF, tunable LPF and clamp circuit. The fabricated hybrid chip of detector and ROIC has been mounted on the TEC built-in ceramic package for more stable operation and tested for lots of electrical and optical properties. The IRFA sample has shown successful properties and met with good results of fill-factor, detectivity and responsivity.

• Proceedings of the KIEE Conference
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• 2002.11a
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• pp.51-53
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• 2002

This research aims to develop a multiple channel electrochemical DNA chip using micro-fabrication technology. At first, we fabricated a high integrated type DNA chip array by lithography technology. Several probe DNAs consisting of thiol group at their 5-end were immobilized on the sold electrodes. Then target DNAs were hybridized by an electrical force. Redox peak of cyclic-voltammogram showed a difference between target DNA and mismatched DNA in the anodic peak current. Therefore, it is able to detect a various genes electrochemically after immobilization of a various probe DNA and hybridization of label-free DNA on the electrodes simultaneously. It suggested that this DNA chip could recognize the sequence specific genes.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.59-65
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• 2011

According to the trends of electronic package to be smaller, thinner and more integrative, Flip Chip Ball Grid Array (FCBGA) become more used for mobile phone. However, the flip chip necessarily generate the heat by the electrical resistance and generated heat is increased due to reduced distribution area of the heat in accordance with the miniaturization trend of the package. Thermal issues can result in problems of devices that are sensitive to temperature and stress. Then the heat can generate problems to the system. In this paper, in order to improve the thermal issues of FCBGA, thermal characteristics of FCBGA was analyzed qualitatively by using the general heat transfer module of Comsol 3.5a and In order to solve thermal issues, flip chip with new micro structure is proposed by the simulation. and also by comparing existing model and analyzing variables such as pitch, height of the pattern and shape of the heat spreader, the improvement of heat dissipation characteristics about 18% was confirmed.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.218-224
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• 2003

This paper describes a novel MEMS integration technique on a CMOS chip. MEMS integration on CMOS circuit has many advantages in view of manufacturing cost and reliability. The surface topography of a CMOS chip from a commercial foundry has 0.9 ${\mu}{\textrm}{m}$ bumps due to the conformal coating on aluminum interconnect patterns, which are used for addressing each MEMS element individually. Therefore, it is necessary to achieve a flat mirror-like CMOS chip fer the microelectromechanical system (MEMS) such as micro mirror array. Such CMOS chip needs an additional thickness of the dielectric passivation layer to ease the subsequent planarization process. To overcome a temperature limit from the aluminum thermal degradation, this study uses RF sputtering of silicon nitride at low temperature and then polishes the CMOS chip together with the surrounding dummy pieces to define a polishing plane. Planarization reduces 0.9 ${\mu}{\textrm}{m}$ of the bumps to less than 25 nm.