• Title/Summary/Keyword: Micro-Power

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Development of Distributed Micro Turbine Co-generation System (분산형 마이크로 터빈 열병합 발전시스템 개발)

  • Kwon, Gi-Hun;Kim, Seung-Woo;Lee, See Woo
    • 유체기계공업학회:학술대회논문집
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    • 2002.12a
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    • pp.320-327
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    • 2002
  • In concert with the growing emphasis placed on distributed power generation there will be a need, in the first decade of the 21th century, for a compact thermal energy system capable of providing the total energy needs of individual homes. A natural gas fueled co-generation micro-turbine with ultra low emission will meet this need. Market opportunities for a distributed micro turbine co-generation system are projected to increase dramatically. In this paper, It was determined that with current state of art component performance levels, metrallic materials, thermal efficiency goal of $28\%$ at sea level standard day conditions are attainable. Higher overall thermal efficiency of $78\%$ is attainable with micro-turbine combined with exhaust fired boilers.

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Micro joining using electron beam welding system (전자빔 용접장치를 이용한 미세접합)

  • Seo Jeong;Lee Je Hun;Kim Jeong O;Gang Hui Sin
    • Proceedings of the KWS Conference
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    • v.43
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    • pp.79-81
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    • 2004
  • In this study EB(Electron Beam) welder was modified to apply Ef welder to micro-joining for soldering and micro-brazing. The power and beam current of EB welder is 6kW, 100mA(60kV) and the minimum current was 1mA. The minimum current of EB welder was modified to decrease the amount of beam current to 0.0lmA and the monitoring system to observe materials was made up. The system is developed including teaching function for generating patterns. The control system and CAD/CAM software for EB direct writing was developed and the deflection beam was controlled without moving workpieces. the possibility of applying EB welder to micro-joining for soldering and brazing was studied through this experiments.

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Comparative Quantification of Contractile Force of Cardiac Muscle Using a Micro-mechanical Force Sensing System

  • Ryu, Seok-Chang;Park, Suk-Ho;Kim, Deok-Ho;Kim, Byung-Kyu
    • 제어로봇시스템학회:학술대회논문집
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    • 2005.06a
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    • pp.1179-1182
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    • 2005
  • To facilitate the cell based robot research, we presented a micro-mechanical force measurement system for the biological muscle actuators, which utilize glucose as a power source for potential application in a human body or blood vessels. The system is composed of a micro-manipulator, a force transducer with a glass probe, a signal processor, an inverted microscope and video recoding system. Using this measurement system, the contractile force and frequency of the cardiac myocytes were measured in real time and the magnitude of the contractile force of each cardiac myocyte on a different condition was compared. From the quantitative experimental results, we estimated that the force of cardiac myocytes is about $20{\sim}40\;{\mu}$N, and showed that there is difference between the control cells and the micro-patterned cells.

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Effect of Material Flow Direction on the Replication Characteristics of the Ultrasonic Patterning Process (초음파 패턴성형시 유동방향 구속에 따른 미세패턴의 성형특성 고찰)

  • Seo, Y.S.;Lee, K.Y.;Park, K.
    • Transactions of Materials Processing
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    • v.21 no.2
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    • pp.119-125
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    • 2012
  • The present study addresses a direct patterning process on a plastic film using ultrasonic vibration energy. In this process, a tool horn containing micro-patterns is attached to an ultrasonic power supply, and is used with ultrasonic vibration to replicate micro-patterns on the surface of a plastic film. To improve the replication characteristics of the micro-patterns, the effect of the die shape of the ultrasonic patterning process was investigated with respect to the flow direction control. Finite element analyses were performed to predict the flow characteristics of the polymer with variations in die design parameters. Experiments were conducted using the optimally-designed die, from which it was possible to attain much improved pattern replication.

Improvement of Printing Properties of PET Micro Filament Fabrics Using Low Temperature Plasma Technology(I) (저온 plasma 기술에 의한 PET 극세사직물의 날염성 개선(I))

  • 조규민;이종훈
    • Textile Coloration and Finishing
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    • v.7 no.1
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    • pp.1-9
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    • 1995
  • In order to improve dyeability of poly(ethylene terephthalate)(PET) micro filament fabrics, the effect of the prior oxygen low temperature plasma on the subsequent dyeing(deep dyeing, printing) was examined in various conditions. The apparent concentration of dyed PET micro filament fabrics was increased by $O_{2}$plasma treatment. Higher discharge power levels and higher reactor pressure values created more significant effect. The wettability was significantly increased by $O_{2}$ plasma treatment. Therefore, it is predicted that introducing hydrophilic group on the surface of material can improve the apparent concentration of PET micro filament fabrics.

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In-Process Monitoring of Micro Resistance Spot Weld Quality using Accelerometer (가속도계를 이용한 마이크로스폿용접의 인프로세스 모니터링)

  • Chang, Hee-Seok;Kwon, Hyo-Chul
    • Journal of Welding and Joining
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    • v.29 no.1
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    • pp.115-122
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    • 2011
  • This study is to propose an in-process monitoring system for micro resistance spot welding processes using minute accelerometer. A minute accelerometer is mounted on the upper moving electrode tip holder. With its high sensitivity and frequency response characteristics, accelerometer output signal has been successfully recorded and integrated twice to reflect electrode expansion during micro spot welding processes. The analysis of electrode expansion pattern was attempted to find its correlation with spot weld quality. Major previous findings1-6) regarding spot weld quality assessment with the electrode expansion signal in large scale resistance spot welding processes were proved to be true in this in-process monitoring system.

Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging (3D 웨이퍼 전자접합을 위한 관통 비아홀의 충전 기술 동향)

  • Ko, Young-Ki;Ko, Yong-Ho;Bang, Jung-Hwan;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.32 no.3
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    • pp.19-26
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    • 2014
  • Through Silicon Via (TSV) technology is the shortest interconnection technology which is compared with conventional wire bonding interconnection technology. Recently, this technology has been also noticed for the miniaturization of electronic devices, multi-functional and high performance. The short interconnection length of TSV achieve can implement a high density and power efficiency. Among the TSV technology, TSV filling process is important technology because the cost of TSV technology is depended on the filling process time and reliability. Various filling methods have been developed like as Cu electroplating method, molten solder insert method and Ti/W deposition method. In this paper, various TSV filling methods were introduced and each filling materials were discussed.

Implemantation of Micro-Web Server Using ARM Processor and Linux (ARM 프로세서와 LINUX를 이용한 마이크로 웹서버 구현)

  • Lee, Dong-Hoon;Han, Kyong-Ho
    • Proceedings of the KIPE Conference
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    • 2002.07a
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    • pp.697-700
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    • 2002
  • In this paper, we proposed the micro web-server Implementation on Strong ARM processor with embedded Linux. The parallel port connecting parallel I/O is controlled via HPPT protocol and web browser program. HTTP protocol is ported into Linux and the micro web server program and port control program are installed on-board memory using CGI to be accessed by web browser, such as Internet Explore and Netscape. 8bit LED and DIP switches are connected to the processor port and the switch input status is monitored and the LED output is controlled from remote hosts vie internet. The result of the proposed embedded micro-web server can be used in automation systems, remote distributed control via internet using web browser.

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A Study on the One-chip Design of Low Cost for Micro-stepping Drive of 5-Phase Stepping Motor Having Pentagon Type Winding (5상 펜타곤 결선방식 스테핑 모더의 마이크로스텝 구동을 위한 저가형 전용 칩 설계에 관한 연구)

  • Kim Myung-Hyun;Ahn Ho-Kyun;Park Seung-Kyu;Son Young-chul
    • Proceedings of the KIPE Conference
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    • 2002.07a
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    • pp.451-454
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    • 2002
  • In this paper, studied on the one-chip design of low cost for the micro-stepping drive having 5-phase Pentagon Type winding. Micro-stepping method in order to eliminate effectively the resonant phenomena and to Increase the positional resolution. This paper proposed trapezoidal current wave- form for current control and provided design- method by using only one-chip of low cost. Therefore the drive will be simple and small size. Also the drive will have a lot of advantage at commercial business. Finally the above study has been implemented on the VHDL. Simulation has been performed to verify the PWM for micro-stepping drive.

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The Effect of SiC Nanopaticles on Interface of Micro-bump manufactured by electroplating (나노입자가 전해도금으로 형성된 미세범프의 계면에 미치는 영향)

  • Sin, Ui-Seon;Lee, Se-Hyeong;Lee, Chang-U;Jeong, Seung-Bu;Kim, Jeong-Han
    • Proceedings of the KWS Conference
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    • 2007.11a
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    • pp.245-247
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    • 2007
  • Sn-base solder bump is mainly used in micro-joining for flip chip package. The quantity of intermetallic compounds that was formed between Cu pad and solder interface importantly affects reliability. In this research, micro-bump was fabricated by two binary electroplating and the intermetallic compounds(IMCs) was estimated quantitatively. When the micro Sn-Ag solder bump was made by electroplating, SiC powder was added in the plating solution for protecting of intermetallic growth. Then, the intermetallic compounds growth was decrease with increase of amount of SiC power. However, if the mount of SiC particle exceeds 4 g/L, the effect of the growth restraint decrease rapidly.

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