• Journal of the Semiconductor & Display Technology
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• v.15 no.3
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• pp.6-11
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• 2016

Silicon wafer is one of main materials in solar cell. Micro-cracks in silicon wafer are one of reasons to decrease efficiency of energy transformation. They couldn't be observed by human eye. Also, their shape is not only various but also complicated. Accordingly, their shape classification is absolutely needed for manufacturing process quality and its feedback. The performance of typical classification techniques which is principal component analysis(PCA), neural network, fusion model to integrate PCA with neural network, and support vector machine(SVM), are evaluated using pattern features of micro-cracks. As a result, it has been confirmed that the SVM gives good results in micro-crack classification.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.229-233
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• 2004

The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its use in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. This paper was carried out some experiments of the micro plasma electrode fabrications using FIB. The sputtering of FIB has one major problem that is redeposited by sputtered material including $Ga^+$ ion source. Therefore we have verified the effect of the reposition by EDX. And the optimal condition is suggested to machine the micro plasma electrode.

• Transactions of Materials Processing
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• v.14 no.6 s.78
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• pp.509-513
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• 2005

This paper is concerned with manufacturing technology of thin foil tensile specimen using CIP(Cold Isostatic Press) and measurement of precision mechanical properties using micro tensile testing. We can get a burr free micro metallic thin foil specimen using this technology. For testing mechanical property of this micro thin foil, we use a nano scale material testing machine that was developed by KITECH. In this paper, micro tensile specimens of nickel and copper thin foil are fabricated with CIP and precision mechanical properties of these materials could be measured. We will expect precision mechanical property of micro/nano material and component.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1559-1563
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• 2007

This paper presents a virtual machine design simulation program. Kinematics of various mechanisms can be modeled with 3 dimensional geometry and actuators. CAD data for any machine component can be easily imported in STL format. Machine components are assembled with kinematic joints simply by drag and drop function in virtual graphic simulator. Interference and collision of any component with other components can be identified during the motion simulation. Graphic user interface program is developed using Microsoft Direct X code. A precision micro stage system is demonstrated with the proposed virtual machine design simulator.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.376-381
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• 2003

Ultra precision diamond cutting is a very efficient manufacturing method for optical parts such as HOE, Fresnel lenses, diffraction lenses, and others. During micro cutting, the rake angle is likely to become negative because the tool edge radius is considerably large compared to the sub-micrometer-order depth of cut. Depending on the ratio of the tool edge radius to the depth of cut, different micro-cutting mechanism modes appear. Therefore, the tool edge sharpness is the most important factor affecting the qualities of machined parts. That is why diamond especially mono-crystal diamond, which has the sharpest edge among all other materials is widely used in micro-cutting. The question arises, given a diamond tool, what is the minimum (critical) depth of cut to get continuous chips while in the cutting process\ulcorner In this paper, the micro machinability around the critical depth of cut is investigated in micro grooving with a diamond tool, and introduce the minimizing method of cutting depth using vibration cutting. The experimental results show the characteristics of micro cutting in terms of cutting force ratio (Fx/Fy), chip shape, surface roughness, and surface hardeing around the critical depth of cut.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.294-297
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• 2004

RTP(Rapid Thermal Pressing) is to fabricate desired pattern on polymer substrate by pressing patterned mold against the substrate heated around glass transition temperature. For a successful RTP process, the whole process including heating, molding, cooling and demolding should be conducted 'rapidly' as possible. As the RTP process is effective in replicating patterns on flat large surface without causing shape distortion after cooling, it is being widely used for fabricating various micro/bio application components, especially with channel-type microstructures on surface. This investigation finally aims to develop a RTP process machine for mass-producing micro/bio application components. As a first step for that purpose, we intended to examine the technological difficulties for realizing mass production by RTP process. Therefore, in the current paper, 4 kinds of RTP machines were examined and then the RTP process was conducted experimentally for PMMA film by using one of the machines, HEX 03. The micro-patterned molds used for RTP experiment was fabricated from silicon wafer by semi-conduct process. The replicated micro patterns on PMMA films were examined using SEM and the causes of defect observed in the replicated patterns were discussed.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.18 no.1
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• pp.36-41
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• 2009

This paper presents the development of a micro punching system with modified cymbal mechanism. To realize the micro punching, we introduced the hybrid system with a macro moving part and micro punching part. The macro moving part consists of a ball screw, a linear guide and the micro step motor and micro punching part includes the PZT actuators and displacement amplification device with modified cymbal mechanism. The PZT actuator is capable of producing very large force, but they provide only limited displacements which are several micro meters. Thus the displacement amplification device is necessary to make those actuators more efficient and useful. For this purpose, a cymbal mechanism in series is proposed. The finite element method was used to design the cymbal mechanism and to analyze the mode shape of the one. The displacement and mode shape error between the FEM results and experiments are within 10%. A considerable design effort has been focused on optimizing the flexure hinge to increase the output displacement and punching force.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.4
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• pp.251-255
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• 2017

Burr generation is inevitable during the machining of a micro-pattern, and it is difficult to distinguish between the pattern and burr because they have a very small dimensions. In this study, a micro-pattern with a pitch of $60{\mu}m$and height of $1{\mu}m$ was fabricated on a cylindrical surface using a turning machine. The structure of a burr and its generation mechanism were determined, and a magnetic abrasive deburring process was used to improve the accuracy of the pattern. As a result, when fabricating a micro-pattern, it was shown that the direction of the burr was determined by the feed direction of the tool. The measured pattern height was $1.018{\mu}m$ when the magnetic flux density and spindle speed were respectively 40 mT and 1600 rpm, respectively, during magnetic abrasive deburring, which were determined to be the optimal conditions for processing.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1543-1546
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• 2005

This paper presents a method to measure a large surface shape using atomic force microscopy, which has been used mostly for measuring over very tiny surfaces. Experiments are performed to measure a step height and a slope of a test sample. The proposed method is rigorously compared with the coordinate measuring machine. The repetition accuracy and the effects of the set point are also studied. The experimental results show that the proposed method is reliable and should be effective to measure both the nano-accuracy surface profile as well as the micro-accuracy global shape of a macro/micro parts using atomic force microscope.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.10
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• pp.1454-1460
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• 2012

In order to develop an new electric insulation material for heavy electric equipments, epoxy/micro/nano composite (EMNC) was prepared by mixing micro-silica with nano layered silicate, where the nano layered silicate was synthesized by our electric field dispersion method, EMNSC was prepared by treating the EMNC with a silane coupling agent. Thermal properties such as glass transition temperature (Tg) and thermal expansion coefficient, and DMA characteristics were studied, and mechanicla properties such as tensile and flexural tests were performed. AC electrical insulation strength was also tested. All properties of EMNSC were modified by treating EMNC with silane coupling agent and it was confirmed that our new developed composites could be used in the heavy electric equipments.