• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1246-1247
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• 2008

With recent advanced in portable electric devices, wireless sensor, MEMS and bio-Mechanics device, the new typed power supply, not conventional battery but self-powered energy source is needed. Particularly, the system that harvests from their environments are interests for use in self powered devices. For very low powered devices, environmental energy may be enough to use power source. Therefore, in other to made piezoelectric energy harvesting device, PMN-PZT thick film was formed by the screen printing method on the Ag/Pd coated alumina substrate. The layer was 8 layers and slurry where a-terpineol, ethycellulose, ferro B-75001 as Vehicle, PMN-PZT powder used are fabricated by ball mill. The output power quality was be also investigated by changing the load resistance, weight and frequency. The made piezoelectric energy harvesting device was resulted from the conditions of 33$k{\Omega}$, 0.25g, 197Hz respectively. The thick film was prepared at the condition of 2.75Vrms, and its power was 230${\mu} W$ and its thickness was 56${mu}m$. The piezoelectric energy harvesting device output voltage was increased, when the load weight, load resistance was increasing and resonance frequency was diminishing. The other side, resonance frequency was diminished, when the weight was increasing. And output power was continuously it changed by load resistance, output voltage, weight and resonance frequency.

• Journal of the Korea institute for structural maintenance and inspection
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• v.27 no.3
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• pp.21-29
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• 2023

In this study, the stress characteristics of temporary fixed steel rods were analyzed in the "temporary fixing system using internal prestressing tension", which is mainly applied to the construction of superstructures by FCM. It was difficult to confirm the changes in initial tensile force in this system because the steel rod was internally connected to the pier and the PSC BOX. Therefore, measurement was performed before and after the completion of each segment using an FBG sensor to measure the change in the micro length of the steel rod. The results of the analysis showed that 75% to 90% of the maximum vertical contraction of the steel rod that occurred until the completion of the cantilever segment occurred in the fixing ~ 1segment, and the maximum loss of initial prestressing force was 39%. Such excessive loss of tension force to 1 segment means that tension is needed to improve the precision of construction during the fixation, and re-tension is needed to secure stability for conduction of cantilever segments after the completion of 1segment. In the 2 ~ last segment, the stress of the steel rod decreased gradually, and in the summer, the decrease in stress tended to partially recover due to the increase in the length of the steel rod corresponding to the increase in the vertical volume of PSC BOX. The dominant factor in the stress change in 2~ last segment in this phenomenon is judged to be the change in the length of the steel rod according to the temperature. Unlike the change in length, the relaxation was 1.2-2.7%, which was mostly offset by the opposite stress corresponding to the temperature stress. Therefore, a plan was proposed to improve the internal stress, such as adjusting the fixation time.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.12
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• pp.1805-1810
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• 2010

We present a simple, cost-effective, and fast fabrication process for three-dimensional (3D) microstructures; this process is based on multi-step electrochemical etching of metal foils which facilitates the mass production of 3D microstructures. Compared to electroplating, this process maintains uniform and well-controlled material properties of the microstructure. In the experimental study, we perform single-step electrochemical etching of aluminum foils for the fabrication of 2D cantilever arrays. In the single-step etching, the depth etch rate and bias etch rate are measured as $1.50{\pm}0.10 {\mu}m/min$ and $0.77{\pm}0.03 {\mu}m/min$, respectively. Using the results of single-step etching, we perform two-step electrochemical etching for 3D microstructures with probe tips on cantilevers. The errors in height and lateral fabrication in the case of the fabricated structures are $15.5{\pm}5.8% $ and $3.3{\pm}0.9%$, respectively; the surface roughness is $37.4{\pm}9.6nm$.

• Journal of the Korean Ceramic Society
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• v.52 no.6
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• pp.410-416
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• 2015

Recently, a new $Y_2O_3$ coating deposited using the EB-PVD method has been developed for erosion resistant applications in fluorocarbon plasma environments. In this study, surface crack formation in the $Y_2O_3$ coating has been analyzed in terms of residual stress and elastic modulus. The coating, deposited on silicon substrate at temperatures higher than $600^{\circ}C$, showed itself to be sound, without surface cracks. When the residual stress of the coating was measured using the Stoney formula, it was found to be considerably lower than the value calculated using the elastic modulus and thermal expansion coefficient of bulk $Y_2O_3$. In addition, amorphous $SiO_2$ and crystalline $Al_2O_3$ coatings were similarly prepared and their residual stresses were compared to the calculated values. From nano-indentation measurement, the elastic modulus of the $Y_2O_3$ coating in the direction parallel to the coating surface was found to be lower than that in the normal direction. The lower modulus in the parallel direction was confirmed independently using the load-deflection curves of a micro-cantilever made of $Y_2O_3$ coating and from the average residual stress-temperature curve of the coated sample. The elastic modulus in these experiments was around 33 ~ 35 GPa, which is much lower than that of a sintered bulk sample. Thus, this low elastic modulus, which may come from the columnar feather-like structure of the coating, contributed to decreasing the average residual tensile stress. Finally, in terms of toughness and thermal cycling stability, the implications of the lowered elastic modulus are discussed.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.7
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• pp.831-841
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• 2010

The conventional vertical probe has the thin and long signal path that makes transfer characteristic of probe worse because of the S-shaped structure. So we propose the new vertical probe structure that has branch springs in the S-shaped probe. It makes closed loop when the probe mechanically connects to the electrode on a wafer. We fabricated the proposed vertical probe and measured the transfer characteristic and mechanical properties. Compared to the conventional S-shaped vertical probe, the proposed probe has the overdrive that is 1.2 times larger and the contact force that is 2.5 times larger. And we got the improved transfer characteristic by 1.4 dB in $0{\sim}10$ GHz. Also we developed the simulation model of the probe card by using full-wave simulator and the simulation result is correlated with measurement one. As a result of this simulation model, the cantilever probe and PCB have the worst transfer characteristic in the probe card.