• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.191-194
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• 2002

In optical pick-up, optical components such as objective lens, collimator, mirror, laser diode and photo diode are mounted on the pick-up base. These components must keep their original position during operation for proper transmittance of information from laser diode to optical disk and back to photo diode. However, micro thermal deformation of pick-up base which is induced by thermal environment during operation can deteriorate the performance of optical pick-up. Therefore, it is important to measure and analyze the thermal deformation behavior of pick-up base under thermal environment. In the present study, a measurement system using holographic interferometry was designed to measure micro thermal deformation of pick up base. The measurement system was verified by using the deformation of cantilever with prescribed motion actuated by PZT with 1 nm resolution. Interferometric measurement was compared quantitatively with that induced by PZT actuator. Finally, micro thermal deformation of pick-up base under actual thermal environment was measured using the present holographic interferometry and the results were analysed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.767-768
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.477-478
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• 2006

This paper presents the results of miniaturized micro milling machine tool development for micro precision machining process. Finite element analysis has been performed to know the relationship between design dimensional variables and structural stiffness in terms of static, dynamic, thermal aspects. Design optimization has been performed to optimize the design variables of micro machine tool to minimize the volume, weight and deformation of machine tool structure and to maximize the stiffness in terms of static, dynamic, and thermal characteristics. This study presents the assessment of the technology incentive for the minimization of machine tool in the quantitative context of static, dynamic stiffness, thermal resistance and thus the accuracy implications.

• Proceedings of the KWS Conference
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• 2001.05a
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• pp.46-48
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• 2001

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.8 no.1
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• pp.48-56
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• 2009

This paper presents the results of miniaturized micro milling machine tool development for micro precision machining process. Finite element analysis has been performed to know the relationship between design dimensional variables and structural stiffness in terms of static, dynamic, thermal aspects. Design optimization has been performed to optimize the design variables of micro machine tool to minimize the volume, weight and deformation of machine tool structure and to maximize the stiffness in terms of static, dynamic, and thermal characteristics. This study presents the assessment of the technology incentive for the minimization of machine tool in the quantitative context of static, dynamic stiffness, thermal resistance and thus the accuracy implications. This study can also be provided a basic knowledge for further research of micro factory development.

• Advances in Computational Design
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• v.2 no.2
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• pp.107-119
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• 2017

The Micro circular diaphragm (MCD) is the mechanical actuator part used in the micro electro-mechanical sensors (MEMS) that combine electrical and mechanical components. These actuators are working under harsh mechanical and thermal conditions, so it is very important to study the mechanical and thermal behaviors of these actuators, in order to do with its function successfully. The objective of this paper is to determine the thermo-mechanical behavior of MCD by developing the traditional bulge test technique to achieve the aims of this work. The specimen is first pre-stressed to ensure that is no initial deflection before applied the loads on diaphragm and then clamped between two plates, a differential pressure (P) and temperature ($T_b$) is leading to a deformation of the MCD. Analytical formulation of developed bulge test technique for MCD thermo-mechanical characterization was established with taking in-to account effect of the residual strength from pre-stressed loading. These makes the plane-strain bulge test ideal for studying the mechanical and thermal behavior of diaphragm in both the elastic and plastic regimes. The differential specimen thickness due to bulge effect to describe the mechanical behavior, and the temperature effect on the MCD material properties to study the thermal behavior under deformation were discussed. A finite element model (FEM) can be extended to apply for investigating the reliability of the proposed bulge test of MCD and compare between the FEM results and another one from analytical calculus. The results show that, the good convergence between the finite element model and analytical model.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.145-148
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• 2006

Cold gas dynamic spray is a relatively new coating process by which coatings can be produced without significant heating during the process. Cold gas dynamic spray is conducted by powder sprayed by supersonic gas jet, and generally called the kinetic spray or cold-spray. Cold-spray was developed in Russia in the early 1980s to overcome the defect of thermal spray method. Its low process temperature can minimize thermal stress and also reduce the deformation of the substrate. Most researches on cold-spray have focused on micro scale coating, but our research team tried to apply this method to macro scale deposition. The macro scale deposition causes deformation of a thin substrate which is usually convex to the deposited side. In this research, the main cause of the deformation was investigated using 6061-T6 aluminum alloy and properties of deposited aluminum layer such as coefficient of thermal expansion, Elastic modulus, hardness, electric conductivity were measured. From the result of the analysis, it was concluded that compressive residual stress was the main reason of substrate deformation while CTE had little effect.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.101-102
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1140-1144
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• 2005

A plastic-based CE (capillary electrophoresis) microchip was fabricated by hot embossing process. A Si mold was made by wet etching process and a PMMA wafer was cut off from 1mm thick PMMA sheet. A micro-channel structure on PMMA substrate was produced by hot embossing process using the Si mold and the PMMA wafer. A vacuum assisted thermal bonding procedure was employed to seal an imprinted PMMA wafer and a blank PMMA wafer. The results of microscopic cross sectional images showed dimensions of channels were well preserved during thermal bonding process. In our procedure, the deformation amount of bonding process was below 1%. The entire fabrication process may be very useful for plastic based microchip systems.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.70-73
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• 2009

The aim of this research is to obtain a numerical material model for an amorphous glassy polymer, polycarbonate (PC), which can be used in finite element analysis (FEA) of the micro thermal imprint process near the glass transition temperature. An understanding of the deformation behavior of the PC specimens was acquired by performing tensile stress relaxation tests. The viscoelastic material model based on generalized Maxwell model was introduced for the material near Tg to establish the FE model based on the commercial FEA code ABAQUS/Standard with a suitable set of parameters obtained for this material model from the test data. Further validation of the model and parameters was performed by comparing the analysis of FE model results to the experimental data.