• 제목/요약/키워드: Micro strength

검색결과 1,212건 처리시간 0.027초

Removal of Pesticide (Endosulphan) from Water via Adsorption onto Activated Carbons Developed from Date Pits

  • Ashour, Sheikha.S.
    • Carbon letters
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    • 제8권2호
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    • pp.101-107
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    • 2007
  • Activated carbons were prepared by impregnation of crushed clean date pits in concentrated solutions of phosphoric acid or zinc chloride followed by carbonization in absence of air at $600^{\circ}C$. Steam-activated carbon was prepared by gasifying $600^{\circ}C$-carbonization product at $950^{\circ}C$ to a burn-off = 50%. KOH- activated carbon was prepared by impregnating date pitscarbonization product obtained at $450^{\circ}C$ in concentrated KOH solution followed by carbonization at $840^{\circ}C$. Textural properties of these carbons were determined from nitrogen adsorption at $-196^{\circ}C$ and the chemistry of the carbon surface was investigated by determination and of the surface carbon-oxygen (C-O) groups using bases of variable strength and dilute HCl. The adsorption of endosulphan at $27^{\circ}C$ on all the carbons prepared was undertaken. Adsorption of this pesticide at 32 and $37^{\circ}C$ was also undertaken for steam-activated and KOH-activated carbons. Phosphoric acid-activated carbons and steamactivated carbons are mainly microporous and have high surface concentration of C-O groups of acidic nature. Steamactivated and KOH-activated carbons exhibited surface areas > 1000 $m^2/g$ and contain micro and non-micrpores. The adsorption of endosulphan was related to the surface area of non-micropores and was retarded by the high concentration of surface C-O groups. The thermodynamic properties indicated the feasibility of the adsorption process and the possible regeneration of the carbon for further use.

고속 구리제트에 대한 알루미나-탄화규소 복합재료의 충돌 저항물성 (Impact Resistance of Al2O3-SiC Composites Against High Velocity Copper Jet)

  • 김창욱;이형복
    • 한국세라믹학회지
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    • 제43권10호
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    • pp.660-665
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    • 2006
  • The mechanical properties of $Al_2O_3$-SiC composites manufactured with adding various amount and size of SiC particles have been measured and analyzed. Generally, the elastic modulus of the composites shows about 50% less than that of PL-8 (45 wt% $Al_2O_3$-51 wt% $SiO_2$-4 wt% other oxides), but the flexural strength is similar with each other. The impact resistance property of $Al_2O_3$-SiC composite against high velocity copper jet was lower than that of PL-8 when SiC particles of approximately 3 $\mu$m diameter was added to. It is caused probably due to the micro-pores made by oxidation of SiC particles. However, in the case of the less-weighted $Al_2O_3$-SiC composite adding to 10 wt% SiC with average diameter of 10 $\mu$m and sintering at 1200$^{\circ}C$, the impact resistance property was improved up to 37 percent compared with that of PL-8.

Micro-Crack Healing on Soda-Lime Glass by Chemical Strengthening

  • Kim, Hyeong-Jun;Lee, Sung-Min;Maeng, Jeehun;Kim, Dong-hwan
    • 한국세라믹학회지
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    • 제56권5호
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    • pp.483-488
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    • 2019
  • We studied whether chemical strengthening can heal the flaws on soda-lime silicate glass. Artificial surface cracks were introduced on the glass by sharp indentation with various loads of 0.1 to 10 N. Then, the glasses with flaws were treated by ion-exchanging in KNO3 melt. The change in the dimension of the crack on glass was measured by a digital microscope and a scanning electron microscope. The chemical strengthening treatment enhances the strength of the glass with flaws. It is thought that the melted KNO3 not only forms the depth of the compressed layer of 7.5 ㎛, but also heals the cracks by infiltrating them and expanding the glass on both sides of the cracks. The critical length (2c) of the cracks on soda-lime glass that can be healed by chemical strengthening is 50 ㎛ or less.

건조수축 저감형 유동화제를 사용한 콘크리트의 현장적용 (Field Application of Concrete Using Drying Shrinkage-Reducing Superplasticizer)

  • 신재경;오치현;최진만;이성연;한민철;한천구
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2006년도 추계 학술논문 발표대회 논문집
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    • pp.13-16
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    • 2006
  • This study investigates filed application in Daebul Free Trade Zone of a flowing method using drying shrinkage-reducing superplasticizer(SRS) and an insulating curing method using double bubble sheets. Test showed that fresh concrete satisfied target slump and air content. A structure adding SRS significantly decreased the total bleeding capacity and accelerated the setting time. As for the crack occurrence, the structure applying the flowing method and double bubble sheets simultaneously exhibited the most favorable crack endurance, while conventional concrete showed more than 1mm size of crack in overall, and a structure applying only the flowing method partially presented micro crack. For the area proportion of crack occurrence, the structure using the double bubble sheets indicated 9.8%, while others applying flowing method was 28%, compared with 100% of conventional one. Standard curing specimens had about $3{\sim}6%$ higher compressive strength than that of specimens cured at adjacent field construction. In addition, using SRS improved about $5{\sim}7MPa$, than that of conventional concrete at 91 days elapse.

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Study of Via-Typed Air-Gap for Logic Devices Applications below 45 nm Node

  • Kim, Sang-Yong;Kim, Il-Soo;Jeong, Woo-Yang
    • Transactions on Electrical and Electronic Materials
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    • 제12권4호
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    • pp.131-134
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    • 2011
  • Back-end-of-line using ultra low-k (ULK; k < 2.5) has been required to reduce resistive capacitance beyond 45 nmtechnologies, because micro-processing units need higher speed and density. There are two strategies to manufacture ULK inter-layer dielectric (ILD) materials using an air-gap (k = 1). The former ULK and calcinations of ILD degrade the mechanical strength and induce a high cost due to the complication of following process, such as chemical mechanical polishing and deposition of the barrier metal. In contrast, the air-gap based low-k ILD with a relatively higher density has been researched on the trench-type with activity, but it has limited application to high density devices due to its high air-gap into the next metal layer. The height of air-gap into the next metal layer was reduced by changing to the via-typed air-gap, up to about 50% compared to that of the trench-typed air-gap. The controllable ULK was easily fabricated using the via-typed air-gap. It is thought that the via-type air-gap made the better design margin like via-patterning in the area with the dense and narrow lines.

Adopting flexibility of the end-plate connections in steel moment frames

  • Ghassemieh, M.;Baei, M.;Kari, A.;Goudarzi, A.;Laefer, D.F.
    • Steel and Composite Structures
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    • 제18권5호
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    • pp.1215-1237
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    • 2015
  • The majority of connections in moment resisting frames are considered as being fully-rigid. Consequently, the real behavior of the connection, which has some level of flexibility, is ignored. This may result in inaccurate predictions of structural response. This study investigates the influence of flexibility of the extended end-plate connections in the steel moment frames. This is done at two levels. First, the actual micro-behavior of extended end-plate moment connections is explored with respect to joint flexibility. Then, the macro-behavior of frames with end-plate moment connections is investigated using modal, nonlinear static pushover and incremental dynamic analyses. In all models, the P-Delta effects along with material and geometrical nonlinearities were included in the analyses. Results revealed considerable differences between the behavior of the structural frame with connections modeled as fully-rigid versus those when flexibility was incorporated, specifically difference occurred in the natural periods, strength, and maximum inter-story drift angle.

Biocompatibility of Nanoscale Hydroxyapatite-embedded Chitosan Films

  • Sun, Fangfang;Koh, Kwangnak;Ryu, Su-Chak;Han, Dong-Wook;Lee, Jaebeom
    • Bulletin of the Korean Chemical Society
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    • 제33권12호
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    • pp.3950-3956
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    • 2012
  • In order to improve the bioactivity and mechanical properties of hydroxyapatite (HAp), chitosan (Chi) was in situ combined into HAp to fabricate a composite scaffold by a sublimation-assisted compression method. A highly porous film with sufficient mechanical strength was prepared and the bioactivity was investigated by examining the apatite formed on the scaffolds incubated in simulated body fluid. In addition, the cytotoxicity of the HAp/Chi composite was studied by evaluating the viability of murine fibroblasts (L-929 cells) exposed to diluted extracts of the composite films. The apatite layer was assessed using scanning electronic microscopy, inductively coupled plasma-optical emission spectrometry and weight measurement. Composite analysis showed that a layer of micro-sized, needle-like crystals was formed on the surface of the composite film. Additionally, the WST-8 assay after L-929 cells were exposed to diluted extracts of the composite indicated that the HAp/Chi scaffold has good in vitro cytocompatibility. The results indicated that HAp/Chi composites with porous structure are promising scaffolding materials for bone-patch engineering because their porous morphology can provide an environment conductive to attachment and growth of osteoblasts and osteogenic cells.

A meso-scale approach to modeling thermal cracking of concrete induced by water-cooling pipes

  • Zhang, Chao;Zhou, Wei;Ma, Gang;Hu, Chao;Li, Shaolin
    • Computers and Concrete
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    • 제15권4호
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    • pp.485-501
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    • 2015
  • Cooling by the flow of water through an embedded cooling pipe has become a common and effective artificial thermal control measure for massive concrete structures. However, an extreme thermal gradient induces significant thermal stress, resulting in thermal cracking. Using a mesoscopic finite-element (FE) mesh, three-phase composites of concrete namely aggregate, mortar matrix and interfacial transition zone (ITZ) are modeled. An equivalent probabilistic model is presented for failure study of concrete by assuming that the material properties conform to the Weibull distribution law. Meanwhile, the correlation coefficient introduced by the statistical method is incorporated into the Weibull distribution formula. Subsequently, a series of numerical analyses are used for investigating the influence of the correlation coefficient on tensile strength and the failure process of concrete based on the equivalent probabilistic model. Finally, as an engineering application, damage and failure behavior of concrete cracks induced by a water-cooling pipe are analyzed in-depth by the presented model. Results show that the random distribution of concrete mechanical parameters and the temperature gradient near water-cooling pipe have a significant influence on the pattern and failure progress of temperature-induced micro-cracking in concrete.

고변형속도 조건에서 섬유 혼합비가 하이브리드 섬유보강 시멘트복합체의 인장특성에 미치는 영향 (Fiber blending Ratio Effect on Tensile Properties of Hybrid Fiber Reinforced Cement-based Composites under High Strain Rate)

  • 손민재;김규용;이보경;이상규;김경태;남정수
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2017년도 추계 학술논문 발표대회
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    • pp.147-148
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    • 2017
  • In this study, the tensile properties of mono and hybrid fiber reinforced cement-based composite according to fiber blending ratio under the high strain rate was evaluated. Experimental results, the HSF1.5PVA0.5 shown the highest tensile strength because the PVA fiber suppressed the micro cracks in the matrix around the hooked steel fiber and improved the pull-out resistance of hooked steel fiber. Thus, DIF of strain capacity and fracture toughness of HSF1.5PVA were greatly improved. Also, the fracture toughness was greatly improved because the tensile stress was slowly decreased after the peak stress by improvement of the pull-out resistance of hooked steel fiber at strain rate 101/s.

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Anisotropic Conductive Film (ACF) Prepared from Epoxy/Rubber Resins and Its Fabrication and Reliability for LCD

  • Kim, Jin-Yeol;Kim, Eung-Ryul;Ihm, Dae-Woo
    • Journal of Information Display
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    • 제4권1호
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    • pp.17-23
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    • 2003
  • A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.