• 한국생산제조학회지
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• 제20권2호
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• pp.187-192
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• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• 한국자동차공학회논문집
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• 제24권4호
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• pp.425-431
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• 2016

The usage of Friction Stir Welding(FSW) technology has been increasing in order to reduce the weight in automobile industries. Previous studies that investigated on the FSW have focused on the aluminum alloy. In this study, Al6061-T6 alloy plates having 5 mm of thickness were welded under nine different conditions from three tool rotation speeds: 900, 1000 and 1100 rpm, and three feed rates: 270, 300 and 330 mm/min. Specimen size of Micro Shear Punch(MSP) test was $10{\times}10{\times}0.5mm$. The mechanical properties were evaluated by MSP test and Analysis of Variance (ANOVA). The specimens were classified by advancing side(AS), retreating side(RS), and center(C) of width of tool shoulder. The optimal welding condition of FSW based on micro strengh was obtained when the tool rotation speed was 1100 rpm and the feed rate was 300 mm/min. The maximum load measured AS, RS, and C in the weldment was measured 554.7 N, 642.9 N, and 579.2 N, respectively.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 추계학술발표대회 개요집
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• pp.83-85
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• 2003

This paper is investigated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which would be surely applicable to the electronic packages. As a result, in case of Max. shear strength, Sn-4Ag-0.5Cu has the highest value and Sn-37Pb has the lowest value on every condition of experiment temperature. Also, In case of Pb-free solder joint specimens, it was found that Pb-free solder alloys have higher value of shear strength than eutectic Sn-Pb solder alloy and Sn-4Ag-0.5Cu has the highest value.