• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1231-1235
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• 2004

The needs of micro scale thermal detecting technique are increasing in biology and chemical industry. For example, Thermal finger print, Micro PCR(polymer chain reaction), ${\mu}TAS$ and so on. To satisfy these needs, we developed a DTSA(Diode Temperature Sensor Array) for detecting and controlling the temperature on small surface. The DTSA is fabricated by using VLSI technique. It consists of 32 ${\times}$ 32 array of diodes (1,024 diodes) for temperature detection and 8 heaters for temperature control on a 8mm ${\times}$ 8mm surface area. The working principle of temperature detection is that the forward voltage drop across a silicon diode is approximately proportional to the inverse of the absolute temperature of diode. And eight heaters ($1K{\Omega}$) made of poly-silicon are added onto a silicon wafer and controlled individually to maintain a uniform temperature distribution across the DTSA. Flip chip packaging used for easy connection of the DTSA. The circuitry for scanning and controlling DTSA are also developed

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.12
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• pp.17-23
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• 2003

A sensor array (3${\times}$5$\textrm{mm}^2$ in diaphragm dimension) of 12 sensing clements with different operating temperatures was optimized with respect to thermal operation. This sensor array with single heater on a glass diaphragm over back-etched silicon bulk realizes a novel concept of a sensor array: an array of sensor clements operated at different temperatures can yield more information than single measurement. The proposed micro sensor array could provide well-integrated array structure because it had only single heater at the center of the diaphragm and used the various sensing properties of two kinds of metal oxide layers with various operating temperatures.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.21-24
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• 2002

A sensor array (35mm'! in diaphragm dimension) of 12 sensing elements with different operating temperatures was optimized with respect to thermal operation. This sensor array with single heater on a glass diaphragm over back-etched silicon bulk realizes a novel concept of a sensor array: an way of sensor elements operated at different temperatures can yield more information than single measurement. The proposed micro sensor array could provide well-integrated way structure because it has only single heater at the center of the diaphragm and used the various sensing properties of two kinds of metal oxide layers with various operating temperatures.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.727-730
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• 2003

Thin tin oxide film with nano-size particle was prepared on silicon substrate by hydrothermal synthetic method and successive sol-gel spin coating method. The fabrication method of tin oxide film with ultrafine nano-size crystalline structure was tried to be applied to fabrication of micro gas sensor array on silicon substrate. The tin oxide film on silicon substrate was well patterned by chemical etching upto 5${\mu}{\textrm}{m}$width and showed very uniform flatness. The tin oxide film preparation method and patterning method were successfully applied to newly proposed 2-dimensional micro sensor fabrication.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.4
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• pp.472-477
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• 2011

This paper shows the method of fabrication of a micro lens array comprised of a Nipkow disk used in a large-area, high-speed confocal microscopy. A Nipkow disk has two components, a micro lens array disk and a pinhole array disk. The microlens array focuses illumination light onto the pinhole array disk and redirects reflected light from a surface to a sensor. The micro lens which are positioned in order on a disk have a hemispheric shape with a few tens of micron in diameter, and can be fabricated by a variety of methods like mechanical machining, semiconductor process, replication process like imprinting process. This paper shows how to fabricate the micro lens array which has a long focal length by reflow and imprinting process.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.9 s.252
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• pp.1160-1165
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• 2006

In this paper, the 2-dimensional uniaxial force sensors array is introduced to detect the distributed force using fiber Bragg gratings. Uniaxial force transducer was designed to avoid the chirping and micro bending which degrade the performance of the sensor. The Brags wavelength shift of the sensor was estimated using the finite element analysis. Using this uniaxial force sensor, the uniaxial force sensors array $(3{\times}3)$ was fabricated, and the Performance of this sensors array was evaluated. The Presented sensors may has very simple configuration and its wiring is very simple compared with any other force sensors arrays.

• JSTS:Journal of Semiconductor Technology and Science
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• v.6 no.4
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• pp.293-298
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• 2006

Thermopiezoelectric method, using poly silicon heater and a piezoelectric sensor, was proposed for writing and reading in a probe based data storage system. Resistively heated tip writes data bits while scanning over a polymer media and piezoelectric sensor reads data bits from the self-generated charges induced by the deflection of the cantilever. 34${\times}$34 array of thermopiezoelectric nitride cantilevers were fabricated by a single step wafer level transfer method. We analyzed the noise level of the charge amplifier and measured the noise signal. With the sensor and the charge amplifier 20mn of deflection could be detected at a frequency of 10KHz. Reading signal was obtained from the cantilever array and the sensitivity was calculated.

• Journal of Sensor Science and Technology
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• v.20 no.6
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• pp.428-433
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• 2011

We report on the building of a micro sensor array based on typical semiconductor fabrication processes aimed at monitoring selectively a specific gas in ambient of other gases. Chemical sensors can be applied for an electronic nose and/or robots using this technique. Microsensor array was fabricated on the same chip using 0.6${\mu}m$ CMOS technology, and unique gas sensing patterns were obtained by principal component analysis from the array. $SnO_2$/Pt sensor for CO gas showed a high selectivity to buthane gas and humidity. $SnO_2$ sensor for hydrogen gas, however, showed a low selectivity to CO and buthane gas. We can obtain more distinguishable patterns that provide the small sensing deviation(the high seletivity) toward a given analyte in the response space than in the chemical space through the specific parameterization of raw data for chemical image formation.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.100-103
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• 2007

A microlens array has been required to improve light conversion efficiency in image sensors. A microlens array can be usually fabricated by photoresist reflow, hot-embossing, micro injection molding, and UV-imprinting. Among these processes, a UV-imprinting, which is operated at room temperature with relatively low applied pressure, can be a desirable process to integrate microlens array on image sensors, because this process provides the components with low thermal expansion, enhanced stability, and low birefringence, furthermore, it is more suitable for mass production of high quality microlens array. In this study, to analyze the optical properties of the wafer scale microlens array integrated image sensor, another wafer scale simulated image sensor chip array was designed and fabricated. An aspherical square microlens was designed and integrated on a simulated image sensor chip array using a UV-imprinting process. Finally, the optical performances were measured and analyzed.

• 정보저장시스템학회:학술대회논문집
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• 2005.10a
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• pp.17-21
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• 2005

High-density image sensors have microlens array to improve photosensitivity. It is conventionally fabricated by reflow process. The reflow process has some weak points. UV imprinting process can be proposed as an alternative process to integrate microlens array on photodiodes. In this study, the UV imprionting process to integrate microlens array on image sensor was developed using W transparent flexible mold and simulated image sensor substrate. The UV transparent flexible mold was fabricated by replicating master pattern using siliconacrylate photopolymer. The releasing property and shape accuacy of siliconacrylate mold was analysed. After UV imprinting process, replication quality and align accuracy was analysed.