• Journal of the Korean Society for Precision Engineering
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• v.32 no.10
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• pp.911-916
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• 2015

In the nano/micro scale, material properties are dependent on the size-scale of a structure. However, conventional micro-scale tensile tests have limitations to obtain reliable values of nano-scale material properties owing to residual stress and elastic slippage in the gripping/aligning process. The indenter-driven nano-scale tensile test provides prominent advantages simple testing device, high-quality nano-scale metallic specimen with negligible residual stress. In this paper, two-types of specimens (a specimen with multi-testing parts and a specimen with a single-testing part) are discussed. Focused ion beam (FIB) is employed to fabricate a nano-scale specimen from a thin nickel film. Using the specimen with a single-testing part, we obtained a nano-scale stress-strain curve of electroplated nickel film.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.6
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• pp.119-126
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• 2004

The welding characteristics of Inconel 600 Alloy using a continuous wave Nd:YAG laser are experimentally investigated. The major process parameters studied in the present laser welding experiment were the positions of focus, laser power and travel speed of laser bean We measured the fusion zone size and its shape using an optical microscope for the observation of cross-sectional area. We performed two tests regarding the tension and the micro hardness for welding quality estimation. Then we measured residual stress in welds by electronic speckle pattern interferometry(ESPI). In conclusion the optimum butt welding process parameters were 0.5mm focus position, 1.6kW laser power, 1m/min travel speed and 5.5$\ell$/min assist gas discharge.

• Journal of the Korean Society for Nondestructive Testing
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• v.22 no.2
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• pp.193-197
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• 2002

The frequency dependency of the Rayleigh surface wave was investigated indirectly by measuring the angular dependency of the backward radiation of the incident ultrasonic wave in the abrasion specimens, which was explained in view of the residual stress distribution. The peak intensity of the backward radiation profile decreased and the right half width of the profile increased with an increase of the variational rate of residual stress for the scuffing specimen. The peak intensity was also affected by the surface wave scattering during the propagation around the micro-damages. The peak angle might depend on not only the amount of residual stress but also the micro-structure. The result observed in this study demonstrates the high potential of the backward radiated ultrasound as a tool for the nondestructive evaluation of the subsurface gradients of materials.

• Journal of the Korean Ceramic Society
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• v.40 no.8
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• pp.770-776
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• 2003

#140 mesh and #600 mesh wheels were adopted to grind (111) and (100) oriented single crystalline silicon wafer and the grinding induced change of the surface integrity was investigated. For this purpose, microroughness, residual stress and phase transformation were analyzed for the ground surface. Microroughness was analyzed using AFM (Atomic Force Microscope) and crystal structure was analyzed using micro-Raman spectroscopy. The residual stress and phase transformation were also analyzed after thermal annealing in the air. As a result, microroughness of (111) wafer was larger than that of (100) wafer after grinding. It was observed using Raman spectrum that the silicon was transformed from diamond cubic Si-I to Si-III(body centered tetragonal) or Si-XII(rhombohedral). Residual stress relaxation was also shown in cavities which were produced after grinding. The thermal annealing was effective for the recovery of the silicon phase to the original phase and the residual stress relaxation.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.326-331
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• 2000

In this study, residual stress was investigated experimentally to evaluate damaged layer in high-sped machining. In machining difficult-to-cut material, residual stress remaining in machined surface was mainly speared as compressive stress. The scale of this damaged layer depends upon cutting speed, feed per tooth and radial cutting depth. Damaged layer was measured by optical microscope. The micro-structure of damaged layer was a mixed maternsite and austenite. depth of damaged layer is increased with increasing of cutting temperature, cutting force and radial depth. On the other hand, that is slightly decreased with decreasing of cutting force. The increase of tool wear causes a shift of the maximum residual stress in machined surface layer.

• Journal of the Korean Society for Heat Treatment
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• v.13 no.3
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• pp.170-176
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• 2000

A novel method for improving the adhesion of diamond films on cemented carbide tool inserts has been investigated. This method is based on the formation of a compositionally graded interface by developing a microrough surface structure using a pulsed laser process. Residual stresses of diamond films deposited on laser modified cemented carbides were measured as a function of substrate roughness using micro-Raman spectroscopy. The surface morphology and roughness of diamond films and cemented carbides were also investigated at different laser modification conditions. It was found that the increasing interface roughness reduced the average residual stress of diamond films, resulting in improved adhesion of diamond films on cemented carbides.

• Proceedings of the KIEE Conference
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• 1998.07g
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• pp.2521-2523
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• 1998

Freestanding flexible microstructures fabricated from deposited thin films become mechanically unstable when internal stresses exceed critical values. The residual stress and stress gradient of aluminum thin film were examined to make sure of fabricating the reproduceable aluminium structure. For good shape of micro mirror array and microstructures, the experiment was done varying thickness and deposition rate. As the aluminium film thickness increased from 0.8${\mu}m$ to 1.6${\mu}m$, the stress gradient decreased from 11.62MPa/${\mu}m$ to 2.62MPa/${\mu}m$. The residual stress values are from 42.4MPa to 62.24MPa of tensile stresses.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.252-257
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• 2004

Nanometer-sized structures are being applied to many devices including micro/nano electronics, optoelectronics, quantum devices, MEMS/NEMS, biosensors, etc. Especially, the thin film with submicron thickness is a basic structure for fabricating these devices, but its mechanical behaviors are not well understood. The mechanical properties of the thin film are different from those of the bulk structure and are difficult to measure because of its handling inconvenience. Several techniques have been applied to mechanical characterization of the thin film, such as nanoindentation test, micro/nano tensile test, strip bending test, etc. In this study, we focus on the strip bending test because of its high accuracy and moderate specimen preparation efforts, and measure Au thin film, which is a very popular material in micro/nano electronic devices. Au film is deposited on Si substrate by evaporation process, of which thickness is 100nm. Using the strip bending test, we obtain elastic modulus, yield and ultimate tensile strength, and residual stress of Au thin film.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.163-170
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• 2006

By removing sacrificial layer through ashing process, movable MEMS structure on substrate can be fabricated in surface micromachining. However, MEMS structure includes, during the ashing process, the warping or buckling effects due to stress gradient along the vertical direction of thin film. In this study, we presented method for counteracting the unwanted deflection of MEMS structure and designed using character of deposit process to overcome limited design conditions. Unit cell patterns were designed with character of deposit shape, and their final shapes were adopted using Finite Element Method. Finally, RF MEMS switch was fabricated by surface micro machining as test vehicles. We checked out that alleviation effect for deformation of switch improved by 35%.

• Journal of the Korean Society for Nondestructive Testing
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• v.22 no.4
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• pp.333-346
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• 2002

The continuous indentation techniques are one of the most effective methods to nondestructively estimate mechanical properties. There are many applications in various dimensions of materials from macro-scale, through micro-scale, even to nano-scale range. The macro-range technology of kgf-load level is now focused on the evaluation of tensile properties and residual stress of bulk materials, for example, used in conventional load-bearing structures and in-use pipelines. The technology and the apparatus were successfully developed by a domestic research group. The micro-range technology of gf-load level can be applied to investigate some property-gradient materials such as weldment. Because it has better spatial resolution than the macro-range technology. The nano-range technology (called nanoindentation technique) of mgf-load level is basically used to evaluate hardness and modulus of micro- and nano-materials. Moreover, many researches are going on to measure tensile properties and residual stress. The nanoindentation technology is easy to be applied to the various fields, such as semiconductor devices, multiphase materials, and biomaterials, though other methods are too difficult to be applied due to dimensional or environmental limitations. On the basis of these accomplishments, the international and the domestic standards are being established.