• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.448-452
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• 2005

Punching/blanking/shearing is among the oldest and most frequently used sheet metal forming process. We have developed the shear device for burrless cutting using the micro wire. Since the burr minimization and fine shear plane, this paper is a study on the effect of the shear angle and clearance of the cutter-cutter. And, we confirm the tendency of the shear plane. It is impossible to completely remove the burr in the shearing process. In order to minimize the burr size and fine shear plane, we have accomplished the various experiment conditions such as the shear angle and clearance. Despite the quality of shear plane is not good enough yet, it is possible to make the burr minimization and fine shear plane by the optimization of process parameters.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1294-1298
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• 2005

In this study, combined micro press and surface finishing process are proposed to fabricate the micro nozzle array on a stainless steel sheet metal. In micro hole punching process the burr occurs inevitably, but the burr must be minimized in order to improve the quality and accuracy of the product. For this reason, subsequent magnetic field-assisted finishing technique is applied to remove the burr which exists around the nozzles for ink-jet printer head and proved to be a feasible for deburring by experiment. The deburring characteristics of sheet metals were investigated changing with polishing time and magnetic abrasive size. After the deburring, the burr size has remarkably reduced and roundness of the hole also has improved.

• 한국전산구조공학회논문집
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• 제34권1호
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• pp.51-58
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• 2021

본 논문에서는 Needle-punched C/SiC 복합재료 해석을 위한 효율적인 멀티스케일 해석기법을 소개한다. 기존 Needle-punching으로 인해 복잡한 미소구조를 갖는 NP 복합재료는 기존의 제안된 복합재료 멀티스케일 기법으로 물성을 계산하는 것은 한계가 있어 왔다. 이를 극복하기 위해 micro-CT 이미지 촬영을 통해 NP 복합재료의 미소구조를 면밀히 파악할 수 있었고, 이미지 프로세싱을 바탕으로 실제구조와 직접적으로 대응할 수 있는 3D high fidelity 모델을 구축하였다. 또한 유한요소해석에 맞춰 요소크기를 조절할 수 있는 sub-region processing 소개를 바탕으로 효율적인 유한요소해석을 수행하였다. NP 복합재료의 미소구조 거동뿐만 아니라, macro-scale 구조해석의 적용을 위해 subcell 모델링을 제안하였다. Needle-punching에 의한 Z축 NP 섬유의 규칙적인 간격을 이용하여 모델링을 수행할 수 있었다. 제안한 두 종류의 모델은 균질화 기법을 이용하여 등가거동 및 등가물성을 파악하였으며, 추가적인 실험 결과와의 비교를 통해 검증을 수행하였다.

• 한국지반공학회논문집
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• 제28권4호
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• pp.55-65
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• 2012

본 연구는 지반조건에 따른 효과적인 마이크로 파일의 설치방법을 제안하기 위해 실트 또는 모래지반에서 모형시험을 수행하였다. 시험결과, 관입 전단파괴가 발생한 실트지반은 압축변위에 저항하도록 마이크로 파일을 엇갈리게 설치(${\theta}$ < $0^{\circ}$)하는 것이 효과적이며, 전면 또는 국부전단파괴가 발생한 모래인 경우 횡 방향 변위에 저항하도록 마이크로 파일을 경사지게 설치(${\theta}$ > $0^{\circ}$ 또는 ${\theta}$ < $0^{\circ}$) 하는 것이 효과적인 것으로 나타났다.

• 한국정밀공학회지
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• 제17권4호
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• pp.106-113
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• 2000

One of the recent changes in machining technology is rapid application of micro- and high precision grinding processes. A fine groove generation is necessary for the fabrication of optics, electronics and semiconductor parts. Slot grinding is very efficient for the generation of micro ordered groove with hard and brittle materials. In the process of slot grinding, chipping at the sharp edges and microcracks of the ground grooves are inevitable defects. Chipping should be reduced for the improvement of surface integrity. Mechanical contact with diamond grits causes microcracks at the grooves. This damage resides subsurface, and can be the cause of failure of the punch die. This paper deals with chipping generation at the sharp edges, surface integrity of side groove and fracture strength is related to the microcracks in the slot grinding.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.107-110
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• 2003

The sheet metal shearing process is normally used in the precision elements such as semi-conductor components. In precision elements, burrs usually reduce the quality of machined parts and cause interference, jamming and misalignment during assembly procedures and because of their sharpness, they can be safety hazard to personnel. Furthermore, not only burrs are hard to predict and avoid, but also deburring, the process of removing burrs, is time-consuming and costly. In order to get the burr-free parts, therefore, we developed the precise burr measuring system using the laser. Using the X-Y precious table, we used vertical measuring method. Through the laser measurement system, we gain the minute analog signal, so this signal was amplified by the electric circuit. Finally, we gained the realtime burr data using A/D converter, PC. By introducing the novel laser measuring method which employing vertical measurement mechanism, we could get fast and precious burr data. Through the experiments, the accuracy of the developed system is proved. The burr height measured during the punching process can be used for automatic deburring and in-situ aligning.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 제3회 금형가공 심포지엄
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• pp.260-265
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• 2004

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet and ceramic sheet and punch-to-die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor k is introduced to express effect of the process variables.

• Journal of Welding and Joining
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• 제33권3호
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.227-230
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• 2009

In order to predict failure behavior of advanced high-strength steel sheets (AHSS) in hole expansion tests, damage model was developed considering surface condition sensitivity (with specimens prepared by milling and punching: 340R, TRIP590, TWIP940). To account for the micro-damage initiation and evolution as well as macro-crack formation, the stress triaxiality dependent fracture criterion and rate-dependent hardening and ultimate softening behavior were characterized by performing numerical simulations and experiments for the simple tension and V-notch tests. The developed damage model and the characterized mechanical property were incorporated into the FE program ABAQUS/Explicit to perform hole expansion simulations, which showed good agreement with experiments.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 춘계학술대회논문집A
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• pp.792-796
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• 2000

With the development of micro machining, it becomes an important part to fabricate an electrode which has tens of ${\mu}m$ or less. There are two methods to get a narrow hole; non-contact type such as EDM(Electro-discharge machining) and contact type such as punching. A punch which has a tapered shape with a cylindrical tip is fabricated in this paper. To make this punch, a method which was used to fabricate a cylindrical shape by electrochemical process was applied. The control factors for the shape and their limits are verified through an experiment.