• Asian Pacific Journal of Cancer Prevention
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• v.17 no.3
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• pp.1351-1355
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• 2016

Background: Multiple myeloma (MM) is influenced by genetic and micro-environmental changes. Malignant plasma cells produce an abnormal monoclonal immunoglobulin, as well as cytokines, such as IL-10 and IL-6 which stimulate cells of the bone marrow microenvironment (BMM) and cause dysfunction and failure of many organs. B cell activating factor (BAFF), IL6 and IL10 are known to influence the growth and survival of malignant clones. Aim: The objectives of the present study were to investigate the circulating levels of BAFF, IL-10 and IL-6, correlate them with well-known parameters of disease activity in patients with MM, and to detect their impact on patients' survival. Materials and Methods: This study was conducted on 89 newly diagnosed MM patients and seventy apparently healthy volunteers as a normal control group. BAFF, IL6, IL10 were measured by ELISA for both groups and survival analysis was performed for all patients. Results: Studied markers were higher in the MM patients compared to the normal control subjects. Patients survival was improved by high serum BAFF levels. Conclusions: High levels of BAFF were found to improve patients' survival. BAFF and IL-6 can be considered probable diagnostic markers for MM.

• Journal of Sensor Science and Technology
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• v.13 no.2
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• pp.85-89
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• 2004

This paper represents the development of high sensitivity photo-sensor for the fluorescence detection in the integrated biological analysis system. The finger-type PIN photodiodes were fabricated as the photo-sensor, and had a high sensitivity ($I_{light}/I_{dark}$ = 8720). The interference filter consisted of $TiO_{2}$ and $SiO_{2}$ was directly deposited on the photodiodes. Deposited filter with 95.5% reflection under 532 nm and 98% transmission over 580 nm exceedingly decreased the magnitude of background signal in the detection. The PDMS micro-fluidic channels are bonded on the photodiode by $O_{2}$ plasma treatment. The detection current was proportional to two primary parameters (light intensity, concentration), and the on-chip detection system could detect fluorescence signals down to 100 nM concentration (LOD = Limit of detection of rhodamine).

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.47-47
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• 1999

2.45 GHz 마이크로웨이브를 이용하는 electron cyclotron resonance plasma enhanced chemical vapor deposition(ECR-PECVD)방법으로 다이아몬드성 탄소박막(diamond-like carbon, DLC)을 증착하였다. DLC 박막의 산업 응용을 위해서는 높은 경도와 밀착력이 필요하다. 그래서 본 실험에서는 DLC 박막의 산업 응용을 위하여 ECR-PECVD 방법으로 증착된 DLC 박막의 분석결과로부터 DLC 박막의 물성과 증착조건의 관계를 조사하였다. 기판으로는 실리콘 웨이퍼와 실험용 SUS 판을 사용하였다. 아르곤 가스를 주입하여 ECR 마이크로 웨이브 플라즈마와 negative DC bias로 기판을 플라즈마 세척한 후, 수소와 메탄가스를 반응기체로 하여 DLC 박막을 증착하였다. 박막 증착시에 13.56MHz RF 전원 공급장치로 기판에 전원을 공급하였다. DLC 박막 증착의 변수는 반응기체의 호합율, 마이크로웨이브 파워, 프로세스 압력 및 RF 전원공급장치에서 유도되는 negative self DC bias 등이다. 이때 사용된 반응기체의 혼합율(메탄/수소)은 10~50%이고, 수소 가스 흐름율은 100sccm, 메탄은 10~50sccm이다. 마이크로웨이브의 크기는 360~900W, negative self DC bias는 -500~-10 V였다. 그리고 본 실험에서는 높은 증착율을 고려하여 프로세스 압력을 10~30mTorr까지 조절하였다. ER-PECVD 방법으로 증착된 DLC 박막은 SEM으로 단면, $\alpha$-Step으로 두께, Raman 분광계로 탄소 결합구조, FTIR 분광계로 탄소와 수소 결합구조, Micro-Hardness로 경도 그리고 Scratch Tester로 밀착력 등을 분석하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.133-133
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• 1999

비정질 탄소막 제조에 있어서 수소가 포함된 반응성 가스를 사용할 경우 제작된 탄소막 내부에는 수소가 포함되게 되며, 이러한 수소원자들은 막의 특성에 중요한 영향을 주는 것으로 알려져 있다. 따라서, 본 연구에서는 비정질 탄소막(a-C:H) 내부에 존재하는 수소가 탄소막의 특성에 미치는 영향을 알아보고, 막 내부에 포함된 수소의 함량과 공정조건 사이의 함수계를 조사함으로써 수소의 함량을 인위적으로 통제할 수 있는 가능성을 제시하고자 한다. 수소가 포함된 비정질 탄소막은 2.45 GHz의 전자기파를 사용하는 electron cyclotron resonance plasma enhanced chemical vapor deposition (ECR-PECVD) 방법과 DC magnetron sputtering 법을 사용하여 제작하였다. 기판으로는 Si(001) wafer를 사용하였으며, 아세톤과 에탄올을 사용하여 표면의 유기성분을 제거하고, 진공챔버속에서 Ar 플라즈마를 발생시켜 sputter etching 방법으로 표면을 세척하였다. ECR-PECVD 방법에서는 반응가스로 메탄(CH4)과 수소(H2)의 혼합가스를 사용하였으며, 혼합가스의 비는 5~50% 범위내에서 변화를 주었다. 수소가스의 유량은 100SCCM으로 고정하였으며, 마이크로웨이브의 power는 360~900W였고, 기판에 가해준 negative DC bias 전압은 0~-500V이었다. DC magnetron sputtering 방법에서는 반응가스로 아세틸린(C2H2) 가스를 사용하였으며, 플라즈마 발생을 용이하게 하기 위해서 Ar 가스와 혼합하여 사용하였다. Ar 가스의 유량은 10SCCM으로 고정하였으며, 아세틸렌 가스의 유량은 5~20SCCM 범위내에서 주입하였다. 이때, 기판에 가해준 negative DC bias 전압은 0~-100V이었다. 제작된 탄소막의 수소 함량을 조사하기 위하여 Fourier Transform Infrared (FTIR) 분광법과 Elastic Recoil Detection Analysis (EFDA) 법을 사용하였으며, 증착율은 SEM 단면촬영과 a-step을 이용하여 측정하였고, 막의 경도는 Micro-Hardness Testing 법을 사용하여 측정하였다.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1350-1351
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• 2008

대기압 플라즈마를 발생시키는 것은 종래의 저기압 플라즈마를 발생시키는 것 보다 대단히 어렵다. 하지만, 대기압 플라즈마는 진공장치가 필요 없고, 제작방식이 비교적 간편하며 살균, 의료, 표면처리 등 다양한 응용이 가능해서 그 잠재력이 매우 크다. 본 연구에서는 유전체가 없는 두 전극사이에서 대기압 저온 마이크로 플라즈마를 발생시켰으며, submicrosecond pulse 파형으로 glow discharge를 유지할 수 있었다. 플라즈마 소스의 전극 간격은 200[${\mu}m$]이고 방전개시전압은 약 450${\sim}$600[V]이다. 플라즈마를 발생시키기 위한 feeding gas는 He 100%이다. 본 연구에서 개발된 대기압 플라즈마는 소비전력이 2[W]미만으로 온도는 조건에 따라 40$^{\circ}C$미만으로 발생 가능하다. 또한 스펙트럼 분석 시 777nm인 산소원자의 peak이 다른 원자 혹은 분자들의 peak보다 월등히 높다.

• Journal of Surface Science and Engineering
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• v.44 no.5
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• pp.190-195
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• 2011

Diamond-like carbon (DLC) has many outstanding properties such as low friction, high wear resistance and corrosion resistance. However, it is difficult to achieve enough adhesion on the metal substrates because of weak bonding between DLC film and the metal substrate. The purpose of this study is to enhance an adhesion of DLC film. For improving adhesion, the substrate was treated by active screen plasma nitriding before DLC film deposing. Nitrided substrates were investigated by Glow Discharge Spectrometer (GDS), Micro-Vickers Hardness. DLC films were deposited on several metals by linear ion source, and characteristics of the films were investigated using nano-indentation, Field Emission Scanning Electron Microscope (FESEM). The adhesion was measured by scratch tester. The adhesion of DLC films was increased when nitriding layer was formed before DLC deposition. Therefore, the adhesion of DLC film can be enhanced as increasing the hardness of materials.

• The Journal of Advanced Prosthodontics
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• v.4 no.3
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• pp.134-138
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• 2012

PURPOSE. The study was conducted to evaluate the efficacy of implant supported tooth replacement in diabetic patients. MATERIALS AND METHODS. The study involved placement of implants (UNITI implants, Equinox Medical Technologies, Zeist, Holland, diameter of 3.7 mm and length 13 mm) in five diabetic patients (three females and two males) of age ranging from 35-65 years with acceptable metabolic control of plasma glucose. All patients included in the study were indicated for single tooth maxillary central incisor replacement, with the adjacent teeth intact. The survival of the restored implants was assessed for a period of three months by measurement of crestal bone heights, bleeding on probing and micro flora predominance. Paired t-test was done to find out the difference in the microbial colonization, bleeding on probing and crestal bone loss. P values of less than 0.05 were taken to indicate statistical significance. RESULTS. Results indicated that there was a significant reduction in bleeding on probing and colonization at the end of three months and the bone loss was not statistically significant. CONCLUSION. The study explores the hypothesis that patients with diabetes are appropriate candidates for implants and justifies the continued evaluation of the impact of diabetes on implant success and complications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.387-390
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for 2 inch SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECVD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using IR camera and SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of $5.3 kgf/cm^2$ to $15.5 kgf/cm^2$

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.4
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• pp.354-361
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• 2008

The dielectric characteristics of low-k interlayer dielectric materials was fabricated by plasma enhanced chemical vapor deposition (PECVD). BTMSM precursor was evaporated and introduced with the flow rates from 16 sccm to 25 sccm by 1sccm step in the constant flow rate of 60 sccm $O_2$ in process chamber. Manufactured samples are analyzed components by measuring FT/IR absorption lines. Decomposition each Microscopic structures through two-dimensional correlation analysis about mechanisms for the formation of SiOCH in $SiOCH_3$, Si-O-Si and Si-$CH_3$ bonding group and analyzed correlation between the micro-structure of each group. It is a tendency that seems to be growing of Si-O-Ci(C) bonding group and narrowing of Si-O-$CH_3$ bonding group relative to the increasing flow-rate BTMSM. The order of changing sensitivity about changes of flow-rate in Si-O-Si(C) bonding group is cross link mode$(1050cm^{-1})$ $\rightarrow$ open link mode$(1100cm^{-1})\rightarrow$ cage link mode $(1140cm^{-1})$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.8
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• pp.700-704
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• 2003

This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 ％ and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.