• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05e
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• pp.77-80
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• 2003

MEMS(Micro Electro Mechanical System) 기술에서 실리콘 식각기술의 중요성으로 플라즈마 식각기술의 개발이 꾸준히 진행되고 있다. 이중에서 ICP(Inductive Coupled Plasma)는 기존의 증착장치에 유도결합식 플라즈마를 추가로 발생시켜 증착막의 특성을 획기적으로 개선시키는 가장 최근에 개발된 기술이며, 이용에너지를 증가시키지 않고도 이용밀도를 높이고 이용업자들에 방향성을 가할 수 있는 새로운 플라즈마 기술로, 주로 MEMS 제조공정에 응용되고 있다. 본 연구에서는 STS-ICP $ASE^{HR}$을 이용하여 식각과 증착공정을 반복하여 식각을 하는 Bosch 식각에 관하여 연구하였다 STS-ICP $ASE^{HR}$ 장비의 Platen power, Coil power 및 Process pressure에 다양한 변화를 주어 각 변수에 따른 식각속도를 관찰하였다. 각 공정별 변수를 변화시킨 결과 Platen power 12W, Coil power 500W, 식각/Passivation Cycle 6/7sec 일 경우 식각속도는 $1.2{\mu}m$/min 이었고, Sidewall profile은 $90{\pm}0.7^{\circ}$로 나타나 매우 우수한 결과를 보였다.

• Journal of Power System Engineering
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• v.2 no.3
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• pp.49-54
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• 1998

This paper is investigated of hardness and adhesiveness of plasma sprayed coating steels by AE(Acoustic Emission) testing when loading a tensile. AE Parameters used are Event, Count, Energy and Amplitude. Test specimens are carbon steel(S45C) with sprayed coating layers of Ni-4.5wt.%Al(bond coating) and $TiO_2$(top coating), and carry out heat treatment at $800^{\circ}C\;and\;1000^{\circ}C$, respectively. The micro-hardness of the heat treatment specimen have been improved more than that of non-heat treatment. On the tensile test, the process and occurence of the exfoliation of the sprayed coating layer can be estimated by AE Characteristics of AE parameters, such as event, count, amplitude and energy, on the layer exfoliation are shown the similar aspects. The exfoliation of bond coating occure at about 20% of strain and top coating is about 5% of strain.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.2
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• pp.327-332
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• 2008

New RF matcher module has been proposed in this paper for improvement of RF matcher in plasma etcher system using in semiconductor and display panel manufacturing process. New designed warm gear was used instead of bevel gear in new driving module, and control system was re-arranged with one-chip micro-process technique. The matching performance of new match module was improved in various process condition with reduction of backlash and matching time, and flexible motion of motor compared commercial match module. However this new type RF match module will improve the productivity in etching process of the mass production line.

• Transactions on Electrical and Electronic Materials
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• v.6 no.3
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• pp.87-90
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• 2005

$SiO_2$ via-hole etching with a high aspect ratio is a key process in fabricating ULSI devices; however, accumulated charge during plasma etching can cause etching stop, micro-loading effects, and charge build-up damage. To alleviate this concern, charge-up damage sensor was fabricated for the ultimate goal of real-time monitoring of accumulated charge. As an effort to reach the ultimate goal, fabricated sensor was used for electrical potential measurements of via holes between two poly-Si electrodes and roughly characterized under various plasma conditions using statistical design of experiment (DOE). The successful identification of potential difference under various plasma conditions not only supports the evidence of potential charge-up damage, but also leads the direction of future study.

• Journal of the Korean institute of surface engineering
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• v.37 no.3
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• pp.169-174
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• 2004

MgO thin films were reactively deposited using an internal inductively coupled plasma assisted sputtering method varying reactive gas ratio to get stoichiometric film composition, and bipolar dc substrate bias to suppress micro arcs. The minimum frequency required for arc suppression was about 10KHz depending on ICP power. Their crystallinity was analyzed using X-ray diffraction and surface morphology using AFM. The surface was very smooth with rms roughness less than 0.42nm. The preferred orientation of the films were changing from (200) to bulk-like characteristics as Ar: $O_2$ratio was controlled to 10 : 2. Optical emission spectroscopy revealed that there were two distinct discharge modes: a blue one and a green one, where enhanced emission from Ar and Mg were observed. This cannot simply be understood by metallic or oxide mode of reactive sputtering due to ICP coupled to magnetron discharge.

• Proceedings of the KIEE Conference
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• 2004.11a
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• pp.293-295
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• 2004

PLS(Plasma Light System) is one of the electrodeless lamp discharged by micro wave. In this new lamp has high efficacy and CRI(Color Rendering Index). It is mainly composed of microwave part and optical part. Microwave parts consist of magnetron, wave-guide and cavity-mesh, while optical parts consist of bulb, mirror and reflector. In this paper, we studied experimentally the heat-resistance and temperature distribution characteristics of bulb in PLS.

• Journal of the Korean institute of surface engineering
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• v.25 no.3
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• pp.133-143
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• 1992

Titanium nitride(TiN) films have been prepared by HCD plasma enhanced reactive ion plating. Density and temperature of the plasma generated by the HCD were investigated. It was shown that parameters such as the substrate bias voltage(0 350V) and N2 flow rate(10 180SCCM) influenced the growth, the growth, the microstructure and the color tone of the film mostly. In order to study the interface region, surface analysis by AES combined with sputter depth profiling was performed. Microhardness of the coated TiN films were measured by micro Vickers hardness tester. Also, the effect of coating parameters on composition, coating surface and fracture morphology, grain size and growth rate were examined.

• The Bulletin of The Korean Astronomical Society
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• v.46 no.1
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• pp.58.4-59
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• 2021

This presentation introduces Korea's SNIPE (Small scale magNespheric and Ionospheric Plasma Experiment) mission, formation flying CubeSat constellation. Observing particles and waves on a single satellite suffers from inherent space-time ambiguity. To observe spatial and temporal variations of the micro-scale plasma structures on the topside ionosphere, four 6U CubeSats (~ 10 kg) will be launched into a polar orbit of the altitude of ~500 km in 2021. The distances of each satellite will be controlled from 10 km to more than 100 km by formation flying algorithm. The SNIPE mission is equipped with identical scientific instruments, solid-state telescope, magnetometer, and Langmuir probe. All the payloads have a high temporal resolution (sampling rates of about 10 Hz). Iridium modules provide an opportunity to upload changes in operational modes when geomagnetic storms occur. SNIPE's observations of the dimensions, occurrence rates, amplitudes, and spatiotemporal evolution of polar cap patches, field-aligned currents (FAC), radiation belt microbursts, and equatorial and mid-latitude plasma blobs and bubbles will determine their significance to the solar wind-magnetosphere-ionosphere interaction and quantify their impact on space weather.

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.32-37
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• 2019

Titanium dioxide ($TiO_2$) is a promising dielectric material in the semiconductor industry for its high dielectric constant. However, for utilization on Si substrate, $TiO_2$ film meets with a difficulty due to the large leakage currents caused by its small conduction band energy offset from Si substrate. In this study, we propose an in-situ plasma oxidation process in plasma-enhanced atomic layer deposition (PE-ALD) system to form an oxide barrier layer which can reduce the leakage currents from Si substrate to $TiO_2$ film. $TiO_2$ film depositions were followed by the plasma oxidation process using tetrakis(dimethylamino)titanium (TDMAT) as a Ti precursor. In our result, $SiO_2$ layer was successfully introduced by the plasma oxidation process and was used as a barrier layer between the Si substrate and $TiO_2$ film. Metal-oxide-semiconductor ($TiN/TiO_2/P-type$ Si substrate) capacitor with plasma oxidation barrier layer showed improved C-V and I-V characteristics compared to that without the plasma oxidation barrier layer.

• Journal of Powder Materials
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• v.20 no.2
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• pp.120-124
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• 2013

This study is carried out to develop the new process for the fabrication of ultra-fine electrodes on the flexible substrates using superhydrophobic effect. A facile method was developed to form the ultra-fine trenches on the flexible substrates treated by plasma etching and to print the fine metal electrodes using conductive nano-ink. Various plasma etching conditions were investigated for the hydrophobic surface treatment of flexible polyimide (PI) films. The micro-trench on the hydrophobic PI film fabricated under optimized conditions was obtained by mechanical scratching, which gave the hydrophilic property only to the trench area. Finally, the patterning by selective deposition of ink materials was performed using the conductive silver nano-ink. The interface between the conductive nanoparticles and the flexible substrates were characterized by scanning electron microscope. The increase of the sintering temperature and metal concentration of ink caused the reduction of electrical resistance. The sintering temperature lower than $200^{\circ}C$ resulted in good interfacial bonding between Ag electrode and PI film substrate.