• Proceedings of the KWS Conference
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• 2004.05a
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• pp.97-99
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• 2004

NSOM(Near-field Scanning Optical Microscope)과 레이저를 이용한 가공 시스템은 근접장 효자를 이용하여 광원의 회절한계보다 작은 나노크기 수준의 점이나 선등의 패턴을 제작하기 위한 공정에 응용되고 있다. (중략)

• Proceedings of the KWS Conference
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• 2004.05a
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• pp.146-148
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• 2004

최근 전세계적으로 활발히 진행되고있는 화력발전소용 내열강의 연구는 화력발전소의 열효율 향상을 위한 주증기 조건의 고온ㆍ고압화를 실현하기 위해 고온 크리프 파단강도 개선에 모든 연구력이 집중되고있다. (중략)

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.65-67
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• 2006

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.354-356
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• 2007

• Proceedings of the KWS Conference
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• 2001.05a
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• pp.43-45
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• 2001

• Proceedings of the KWS Conference
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• 2001.05a
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• pp.46-48
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• 2001

• Journal of Welding and Joining
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• v.33 no.3
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• pp.47-53
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• 2015

By the trends of electronic package to be more integrative, the fine Cu trace pitch of organic PCB is required to be a robust design. In this study, the short circuit failure mechanism of PCB with a Cl element under the Temperature humidity bias test ($85^{\circ}C$/85%RH/3.5V) was examined by micro-structural study. A focused ion beam (FIB) and an electron probe micro analysis (EPMA) were used to polish the cross sections to reveal details of the microstructure of the failure mode. It is found that $CuCl_x$ were formed and grown on Cu trace during the $170^{\circ}C$/3hrs and that $CuCl_x$ was decomposed into Cu dendrite and $Cl_2$ gas during the $85^{\circ}C$/85%RH/3.5V. It is suggested that Cu dendrites formed on Cu trace lead to a short circuit failure between a pair of Cu traces.

• Journal of Welding and Joining
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• v.21 no.3
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• pp.92-98
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• 2003

This paper describes the numerical prediction of the thermal fatigue life of a $\mu$BGA(Micro Ball Grid Array) solder joint. Finite element analysis(FEA) was employed to simulate thermal cycling loading for solder joint reliability. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. The results show that Sn-3.5mass%Ag solder had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable ${\gamma}$, which was possible to use several lead free solder alloys for prediction of thermal fatigue life. Furthermore, when the contact angle of the ball and chip has 50 degrees, solder joint has longest fatigue life.

• Journal of Welding and Joining
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• v.19 no.6
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• pp.622-629
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• 2001

The aim of this experiment is to establish the method that obtains symmetrically two nuggets in microresistance series spot welding. The sheets of austenite stainless steel STS304 applied to various electronic parts were experimented by the inverter welding power source of polarity controllable type and by the twin head for left and right electrode force to be controlled separately. The experimental results were obtained as follows : 1) When series spot welding was carried out by DC 1 pulse as welding current with same electrode force at left and right, the asymmetry of nuggets was resulted from the larger nugget of the (-) pole because of the Peltier effect. The dynamic resistance of weld spot at left and right was appeared differently according to the growth of nuggets. 2) When AC 1 cycle by welding power source of polarity controllable type was applied, the nuggets were almost symmetrically formed. 3) In a twin head, if the electrode force of (-) pole was larger than that of (+) pole, the diameters of two nuggets became to same. It was confirmed that the dynamic resistance of (-) pole was decreased to the same level as it of (+) pole. 4) Although the forces of left and right electrode were same, and only DC 1 pulse was applied, symmetric nuggets were obtained if the conductivity of (+) pole was lower than it of (-) pole.

• Journal of Welding and Joining
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• v.29 no.1
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• pp.41-45
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• 2011

SnAgCu lead-free solder alloy is considered as the best alternative to eutectic tin-lead solder. However, the detailed material properties of SnAgCu solder are not available in public. Hence, this paper presents an estimation of mechanical properties of SnAgCu lead-free solder. In particular, the weight percent of Ag was varied as 1.0wt%, 2.5wt%, 3.0wt%, and 4.5wt% in order to estimate the effect of Ag in the Sn-xAg-0.5Cu ternary alloy system. For this purpose, four types of SnAgCu bars were first molded by casting and then standard specimens were cut out of molded bars. Micro-Vickers hardness, tensile tests were finally performed to estimate the variations in mechanical properties according to the weight percent of Ag. Test results reveal that the higher the weight percent of Ag is, the higher the hardness, yield strength, and ultimate tensile strength become. More material properties will be further investigated in the future work.