• Journal of Korean Society for Atmospheric Environment
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• v.24 no.E1
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• pp.54-62
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• 2008

Microbeam PIXE, often called micro-PIXE, is one of powerful tools for analyzing a wide range of elements for various samples. Moreover, it has important applications of interest to the atmospheric science. In the present study, a qualitative elemental imagination for various atmospheric environmental species was attempted using micro-PIXE. Especially, in combination with a novel individual droplet collection method and the micro-PIXE analytical technique, the chemical specification of various individual atmospheric samples could be carried out. Here, we briefly introduce the results of an application of micro-PIXE to the study of atmospheric environment. The detailed spatial resolution of multiple elements for various samples like individual ambient particles, individual raindrops, individual fog droplets, and individual snow crystals could be successfully achieved by scanning 2.6 MeV $H^+$ micro beam ($1{\sim}2{\mu}m$) accelerated by 3 MeV single-end accelerator.

• Transactions of Materials Processing
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• v.11 no.5
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• pp.439-446
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• 2002

This study presents a new computational model to analyze the grain deformation in a polycrystalline aggregate in a discrete manner and based directly in the underlying physical micro-mechanisms. When scaling down a metal forming process, the dimensions of the workpiece decrease but the microstructure of the workpiece remains the similar. Since the dimensions of the workpiece are very small, the microstructure especially the grain size will play an important role in micro forming, which is called size effects. As a result, specific characteristics have to be considered for the numerical analysis. The grains and grain boundary elements are introduced to model individual grains and grain boundary facets, respectively, to consider the size effects in the micro forming. The constitutive description of the grain elements accounts for the rigid-plastic and the grain boundary elements for visco-elastic relationships. The capability of the proposed approach is demonstrated through application of grain element and grain boundary element in the micro forming.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.7
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• pp.114-119
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• 2003

The aligning between the punch and die governs no only the burr formation characteristics but also the life time of the punch and die in the sheet metal blanking process. There are many ways to adjust the two elements in the general punching systems but in the case of micro punch system, the punch size is reduced to a few tenth of micrometer range and the general aligning methods are almost impossible to apply. The image processing is the most widely used method in micro punch aligning, but in order to apply the method, it needs quite a large space for visionary system to approach the punch-die aligning zone. In this paper, the new punch-die aligning method with using the total capacitance between the punch and die hole is proposed. In this method, the tip surface of the punch tool locates at the same plane of the die surface and the capacitance variation between the two elements are measured. When the center of the two elements are coincided, the capacitance is minimized, but when the align is changed to any direction, the capacitance between the two elements increase. In order to verify the feasibility of this method, the aligning and punching tests was performed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.1049-1052
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• 2002

The aligning between the punch and die governs no only the burr formation characteristics but also the life time of the punch and die in the sheet metal blanking process. There are many ways to adjust the two elements in the general punching systems but in the case of micro punch system, the punch size is reduced to a few tenth of micrometer range and the general aligning methods are almost impossible to apply. The image processing is the most widely used method in micro punch aligning, but in order to apply the method, it needs quite a large space for visionary system to approach the punch-die aligning zone. In this paper, the new punch-die aligning method with using the total capacitance between the punch and die hole is proposed. In this method, the tip surface of the punch tool locates at the same plane of the die surface and the capacitance variation between the two elements are measured. When the center of the two elements are coincided, the capacitance is minimized, but when the align Is changed to any direction, the capacitance between the two elements increase. In order to verify the feasibility of this method, the aligning and punching tests was performed.

• Proceedings of the Korea Air Pollution Research Association Conference
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• 2005.11a
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• pp.67-74
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• 2005

Microbeam PIXE, often called micro-PIXE, is a powerful tool tot analyzing a wide range of elements for various samples, as well as, it has important applications of interest to the atmospheric science. In this study, qualitative elemental imagination for various atmospheric environmental species was attempted using micro-PIXE. Here, we present the results of an application of micro-PIXE to the study of atmospheric environment. The detailed spatial resolution of multiple elements lot various samples like individual ambient particles, individual raindrops, individual fog droplets, and individual snow crystals could be successfully achieved by scanning 2.6 MeV H+ micro beam (1-2 ${\mu}m$) accelerated by 3 MV single-end accelerator.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.439-442
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• 2003

This study presents a new computational model to analyze the grain deformation in a polycrystalline aggregate in a discrete manner and based directly in the underlying physical micro-mechanisms. As a result, specific characteristics have to be considered for the numerical analysis. The grains and grain boundary elements are introduced to model individual grains and grain boundary facets, respectively, to consider the size effects in the micro forming. The constitutive description of the grain elements accounts for the rigid-plastic and the grain boundary elements for elastic relationships. The capability of the proposed approach is demonstrated through application of grain element and grain boundary element in the micro forming.

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.400-404
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• 2001

A micro-PIV(particle image velocimetry) measurement has been conducted to investigate flow fields in such microfluidic devices as microchannels and micronozzle. The present study employs a state-of-art micro-PIV system which consists of epi-fluorescence microscope, 620nm diameter fluorescent seed particles and an 8-bit megapixel CCD camera. Velocity vector fields with a resolution of $6.7\times6.7{\mu}m$ has been obtained, and the attention has been paid on the effect of varying measurement conditions of particle diameter and particle concentration on the resulting PIV results. In this study, the microfluidic elements were fabricated on plastic chips by means of MEMS processes and a subsequent molding process. Flow fields in a variety of microchannels as well as micronozzle have been investigated.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2004.05a
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• pp.332-336
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• 2004

To position precision machines accurately, linear motion (LM) guides having rolling elements can be used. For ultra-accurate positioning control of the precision machines, the understanding of the dynamic behavior of the LM guide at the macro and/or micro scales is most critical, but the research on this subject is rare. The objective of the present research is to observe the vibration phenomena of the LM guide. Bails are used as the rolling elements in this work. Several experiments show the nonlinear characteristics of the LM guide such as hysteresis behavior and force-dependent natural frequencies phenomena.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.14 no.10
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• pp.1029-1034
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• 2004

Linear motion ( LM) guides having rolling elements have been used to position precision machines accurately. For ultra-accurate Positioning control of Precision machines, the understanding of the dynamic behavior of the LM guide at the macro and/or micro scales is most critical, but the research on this subject is rare. The objective of the present research is to investigate the vibration phenomena of the LM guide where balls are used as the rolling elements. Several experiments show the nonlinear characteristics of the LM guide such as hysteresis behavior and force-dependent natural frequencies phenomena.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.139-144
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• 2005

A rigorous research is underway in our team, for the design and development of high figure of merits (ZT= 1.5${\sim}$2.0) micro-thermoelectric coolers. This paper discusses the fabrication process that we are using for developing the $Sb_2Te_3-Bi_2Te_3$ micro-thermoelectric cooling modules. It describes how to obtain the mechanical properties of the thin film TEC elements and reports the results of an equation-based multiphysics modeling of the micro-TEC modules. In this study the thermoelectric thin films were deposited on Si substrates using co-sputtering method. The physical mechanical properties of the prepared films were measured by nanoindentation testing method while the thermal and electrical properties required for modeling were obtained from existing literature. A finite element model was developed using an equation-based multiphysics modeling by the commercial finite element code FEMLAB. The model was solved for different operating conditions. The temperature and the stress distributions in the P and N elements of the TEC as well as in the metal connector were obtained. The temperature distributions of the system obtained from simulation results showed good agreement with the analytical results existing in literature. In addition, it was found that the maximum stress in the system occurs at the bonding part of the TEC i.e. between the metal connectors and TE elements of the module.