• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.4
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• pp.355-360
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• 2013

A wireless intraocular (IOP) pressure sensor based on micro electro mechanical system (MEMS) technology is proposed. The proposed IOP sensor uses variable inductance according to the external pressure. The proposed sensor is composed of two flexible membranes: a ferrite bottom part, an inductor, and a capacitor. The inductance of the sensor varies according to the external pressure. The resonance frequency of the sensor is also varied, and this frequency is detected using an external coil. The external coil is designed with an FR-4 printed circuit board. The feasibility of the proposed sensor structure using variable inductance to detect the external pressure is successfully demonstrated.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.11 s.176
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• pp.165-172
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• 2005

In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.39 no.11
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• pp.40-46
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• 2002

A MEMS(Micro Electro Mechanical System) package using a doped-silicon(Si) carrier for coplanar microwave and millimeter-wave integrated circuits is proposed in order to reduce parasitic problems of leakage, coupling and resonance. The proposed carrier scheme is verified by fabrication and measuring a GaAs CPW(Coplanar Waveguide) on the three types of Si-carriers(gold-plated high resistivity, lightly doped, high resistivity). The proposed MEMS package using the lightly doped(15 ${\Omega}{\cdot}$) Si-carrier shows parasitic-free performance since the lossy Si-carrier effectively absorbs and suppresses the resonant leakage.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.1
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• pp.61-69
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• 2014

In this paper, we have researched semiconductor optical filters to solve the problem of the high failure rate that are recognize bad of financial account, jam of financial account and the ATM service interruption due to failure of accurate location information among the operation of the ATM (automatic teller machine) systems. A semiconductor optical filters that have high resolution and less diffuse, high transmittance are able to detect the information of financial account surface accurately. Therefore, it is a stable filter that is able to minimize the incidence of disability. In this paper, we drew the determinants by element for implement an excellent semiconductor optical filters. Based on this, we had to be able to implement the semiconductor optical filter that is able to be mounted on the actual ATM system through future studies.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.2
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• pp.180-187
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• 2005

This paper is focused on the development of the flexible electrode for disc-type polymer actuators using Segmented Polyurethane(SPU). This paper consists of two parts. The one is about the mechanical property such as elastic modulus. these parameters mainly affect behaviors of polymer actuators and the other is about the electro-chemical property such as the surface resistance of the composite electrode affects the strength of electrostatic force, results in the deformation of polymer actuators. The Young's modulus was measured by UTM. As result, by increasing the modulus of a body of polymer actuators, the maximum displacement of polymer actuators are decreased. The surface resistance of the electrode was measured by 4 point probe system. Compared with the conductive silver grease, the displacement of polymer actuators using carbon black(CB) composite electrodes is comparably small but CB composite electrode should be the practical approach for the improvement of the performance of all-solid actuators, compared with another types of electrode materials.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.387-390
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for 2 inch SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECVD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using IR camera and SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of $5.3 kgf/cm^2$ to $15.5 kgf/cm^2$

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.8
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• pp.700-704
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• 2003

This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 ％ and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.23 no.11
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• pp.1364-1370
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• 2019

Tilt sensors are mainly used to measure the collapse of structures such as buildings, bridges and tunnels. Recently, due to the ease of use and low price, many tilt sensors using MEMS sensors have been used, but the measurement angle range is limited, and thus, they do not have high precision for 360 degree. This is due to the inherent offset and scale errors of MEMS sensors. In this paper, we proposed an algorithm for the calculation of precision angles to reduce the mechanical error of MEMS sensors, and produced a MEMS sensor module and a transmission module to compare the angle accuracy of sensor modules before calibration and the angle measurement accuracy after calibration. Experimental results show that the proposed technique has a precision of ± 0.015 degrees for all 360-degree.

• Spatial Information Research
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• v.19 no.5
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• pp.87-96
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• 2011

Recently mobile users can access to internet using smart phone at any place and any time, through which they can search and share information. In addition, as the sensors with high-tech functions become cheaper and miniaturized along with the development of MEMS (micro-electo mechanical systems) technology, the extent to utilize smart phone is increasing. Smart phone is equipped with various sensors such as high-resolution camera, GPS, gyroscope and magnetic sensor, which is an appropriate system configuration for remote monitoring research using camera. The remote monitoring system requires camera for video and internet network to send video, for which it has a limitation that it is influenced by the monitoring location. This study is aimed to design and develop the monitoring app. which can be remotely monitored using smart phone technology. The developed monitoring app was designed to take images of ROI (region of interest) within the specified time and to automatically send the images to the server. The developed app. is also possible to be remotely controlled by SMS (short message service). The monitoring proposed in this study can take high-resolution images using CMOS built in the smart phone and send the images and information to the server automatically at any place and any time using 3G and Wi-Fi networks.

• Journal of Korean Society for Geospatial Information Science
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• v.20 no.1
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• pp.65-72
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• 2012

With the development of MEMS, small and low-priced sensors integrating IMU and GPS have produced and exploited for diverse field. In this research, we have judged that MEMS-based IMU/GPS sensor is suitable for light-weighted mobile mapping system and carried out experiments to analyze the characteristics of MTi-G, which was developed from XSens company. From a sensor which fixed to dashboard, coordinates results with no post-processing were achieved for test area. On the whole, the results show satisfactory performances but some errors also were discovered from parts of the road due to sensor properties, XKF characteristics and GPS reception environment. We could confirm the potential of light-weighted mobile mapping system. Experiments considering various GPS reception environments and road condition and more detailed level of accuracy analysis will be performed for further research.