• 반도체디스플레이기술학회지
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• 제13권4호
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• pp.65-70
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• 2014

This paper is to improve the problem of the LED dimming control system using the conventional PWM and DAC method. The conventional PWM method controls the average current to switch dimming signal. This method generates the flicker when controlling at a low current. In order to solve the problem, this system prevents the flicker with the DAC method. The LED is lit at micro-current flowing in the LED. And offset voltage is generated in the output of the DAC when the DAC output is very low voltage as 0V. This was resolved by the voltage drop of the output voltage to construct a negative offset circuit. In addition, the LED current can't flow as set values because of overheating of FET. In order to solve the problem, the 16 bits ADC in the microprocessor is a more accurate current control receives the LED current in comparison with the set value. Therefore, the LED dimming control system proposed in this paper showed the accurate and reliable more than conventional systems.

• 반도체디스플레이기술학회지
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• 제19권2호
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• pp.45-50
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• 2020

We investigated the Si_1-xGe_x surface properties when dry cleaning the films using NF₃ / H₂O remote plasma. After the dry cleaning process, it was found that about 80-250 nm wide bumps were formed on the SiGe surface regardless of Ge concentration in the rage of x = 0.1 ~ 0.3. In addition, effects of the dry cleaning processing parameters such as pressure, substrate temperature, and H₂O flow rates were examined. It was found that the surface bump is significantly dependent on the flow rate of H₂O. Based on these observations, we would like to provide additional guidelines for implementing the dry cleaning process to SiGe materials.

• Journal of Information Display
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• 제4권1호
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• pp.17-23
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• 2003

A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.

• Journal of Information Display
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• 제12권1호
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• pp.23-27
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• 2011

The correlation between the temporal and spatial variations of the elastic constant and temperature change was examined for a light guide plate (LGP) adopted in the edge-lit light-emitting-diode backlight for mobile applications, using the micro- Brillouin light scattering method. The velocity of sound and the elastic constant $C_{11}$ of an LGP made from bisphenol-A polycarbonate (PC) were investigated as functions of temperature, time, and position on the LGP. The temporal variation of $C_{11}$ exhibited an exponential decay, while the spatial variation of $C_{11}$ reflected the temperature distribution on the LGP. The glass transition temperature of the PC LGP was found to be located at $155^{\circ}C$. The result showed that systematic transformation between the elastic property and the temperature is possible and that the temperature distribution on the bulk LGP can be accurately probed via the present experiment method, without using any special temperature measurement equipment.

• 반도체디스플레이기술학회지
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• 제8권3호
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• pp.13-17
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• 2009

we have studied characterization of microbolometer based on the co-sputtered silicon-antimony ($Si_{1-x}Sb_x$) thin film for infrared microbolometer. We have investigated the resistivity and the temperature coefficient of resistance (TCR) with annealing. We deposited the films using co-sputtering method at $200^{\circ}C$ in the Ar environment. The Sb concentration has been adjusted by applying variable DC power from Sb targets. TCR of deposited $Si_{1-x}Sb_x$ films have been measured the range of -2.3~-2.8%/K. The resistivity of the film is low but TCR is higher than the other bolometer materials. Resistivity of the films has not been affected hugely according to the low annealing temperature however the resistivity has been dramatically decreased over $250^{\circ}C$. It is caused of a phase change due to the rearrangement of Si and Sb atoms during crystallization process of the films.

• 반도체디스플레이기술학회지
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• 제17권1호
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• pp.45-49
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• 2018

Portable microcontroller based measurement unit is demonstrated using digital-to-analog convertor module, analog-to-digital convertor module and additional preamplifier circuit with low-budget but excellent performances. Using the designed measurement unit, the measurement of current below 1 nA with applying voltage up to 5 V is successfully carried out. With the WiFi module in microcontroller, measured data is transferred to the user's computer. To evaluate the performance of the measurement unit, the transfer curve of a commercial N-type field effect transistor was measured with the measurement unit and the results is well consistent with that measured using commercial characterization system.

• 반도체디스플레이기술학회지
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• 제16권3호
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• pp.8-13
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• 2017

In this paper, the measurement of the inner diameter dimension of the circular hole by using a machine vision system was studied. This paper was focused on the theory and key technologies of machine vision inspection technology for the improvement of measurement accuracy and speed of the micro circular holes. A new method was proposed and was verified through the experiments on Gray conversion, binarization, edge extraction and Hough transform in machine vision system processes. Firstly, the Hough transform was proposed in order to improve the speed increase and implementation ease, it demonstrated the superiority of Hough transform and improvement through a comparative experiment. Secondly, we propose a calibration method of the system in order to obtain exactly the inner diameter of the circular hole. Finally, we demonstrate the reliability of the entire system as a MATLAB-based implementation of the GUI program, measuring the inner diameter of the circular hole through the circular holes of different dimensions measuring experiment.

• 반도체디스플레이기술학회지
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• 제18권2호
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• pp.58-62
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• 2019

Diffractive Optical Elements(DOEs) diffracts incident light using the diffraction phenomenon of light to generate a desired diffraction image. In recent years, the use of diffraction optics, which can replace existing refractive optical elements with flat plates, has been increased by implementing various optical functions that could not be implemented in refractive optical devices and by becoming miniaturized and compacted optical elements. Direct laser lithography is typically used to effectively fabrication such a diffractive optical element in a large area with a low process cost. In this study, the process conditions for fabricating patterns of diffractive optical elements in various shapes were found using direct laser lithographic system, and optical performance evaluation was performed through fabrication.

• 반도체디스플레이기술학회지
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• 제20권2호
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• pp.98-102
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• 2021

GaOOH is obtained via hydrothermal synthesis procedure. The formed GaOOH is turned into α-Ga₂O₃ at 500℃ annealing. As the annealing temperatures increase the α-Ga₂O₃ is in part turned into β-Ga₂O₃ and fully turned into β-Ga₂O₃ after 1100℃. XPS and PL results reveal that heterojunction interface between α-Ga₂O₃ and β-Ga₂O₃ become maxim at 500℃ annealing condition, which result in the highest photocatalytic activity. The presence of heterojunction interface slows down the recombination process by separating photogenerated electron-hole pairs and thereby enhance the overall photocatalytic activity.

• 반도체디스플레이기술학회지
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• 제19권4호
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• pp.139-144
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• 2020

Recently, the electronic equipment industry has become active due to the continuous increase in portable storage media with high-speed information communication, and in particular, the production of SSD(Solid State Drives) for miniaturization of mobile devices and high-speed information communication has increased rapidly. When the SSD is ejecting in the SSD test gender, the necessary ejecting force must be kept constant to have a lifespan applicable to the test device. When the ejecting force increased, it leads to wear of the link for ejecting, which causes a problem in that repeated durability decreases and the ejecting of the SSD becomes impossible. In this paper, the repeated durability test analysis according to the material and the reducing ejecting force design were performed to increase the life of the test gender for SSD inspection. The wear level of the pusher head and ejector was analyzed through repeated durability tests according to the material of the pusher head. The validity of the design was verified through the ejecting force test and repeated durability test of the Test gender, which was designed by carrying out the design to reduce the size and ejecting force of the test gender.