• Title/Summary/Keyword: Micro display

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Design and Implementation of MDDI Protocol for Mobile System (모바일 시스템을 위한 MDDI 프로토콜 설계 및 구현)

  • Kim, Jong-Moon;Lee, Byung-Kwon;Jung, Hoe-Kyung
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.17 no.5
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    • pp.1089-1094
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    • 2013
  • In this study, we propose how th implement a MDDI(Mobile Display Digital Interface) protocol packet generation method in software. MDDI protocol is widely used in mobile display device. MDDI protocol packets are generated by software within micro processor. This method needs the minimum hardware configuration. In order to implementation of this method, we design a hardware platform with a high performance microprocessor and a FPGA. The packets generated by software within microprocessor are converted into LVDS signals, and transmitted by hardware within FPGA. This study suggests the benefits of the way how software can easily create a variety of packet. But, this proposed method takes more time in packet transmission compared to the traditional method. This weakness remains as a future challenge, which can be soon improved.

Data Acquisition of Thin-wall Injection Molding Cavity with Micro Pattern (미세 패턴을 가진 박판 사출 성형에서의 금형내 압력 온도 측정 및 분석)

  • Hwang E.J.;Yoo Y.E.;Jae T.J.;Choi D.S.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1601-1604
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    • 2005
  • The demand increasing of optical applications like as display devices derives interest for fabrication process. The product s development is apt to fabricate numerous thin and wide surfaces with micro pattern. Naturally that needs injection molding fabrication for the mass production. In existing manufacturing, the product quality is controlled by input fabrication condition from the outside. That can be called as a try and error method and not fundamentally solve the troubles; imperfect replication, war page, short shot, etc. To understand the cause and bring a solution, it is needed that check of changing in the cavity. This study can catch them. Data acquisition system about temperature and pressure distribution is settled and can get some data. From this research, other studies related with DAQ in cavity can start on the easier step.

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A Study on the Development of a Cantilever & Swing-Type Fast Tool Servo with Rotational Moment Hinge Design (회전모멘트 힌지 설계에 따른 캔틸레버형 횡방향 구동 Fast Tool Servo 연구 개발에 관한 고찰)

  • Lee, Seung Jun;Jeong, Jae Ho
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.19 no.8
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    • pp.43-49
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    • 2020
  • The growth of the AR/VR market due to the advent of the 4th Industrial Revolution begins with the development of the display industry. The development of OLED and flexible displays is further accelerated by the development of R2R technology. Micro-processing technology using a fast tool servo (FTS), the core technology in R2R processes, is making technological progress in increasingly diverse ways. This paper proposes a method to develop an FTS for horizontal driving and presents this method through experiments and analyses. To develop a swing-type FTS based on a seesaw motion, a rotational moment hinge structure was designed for each type, and research was conducted to determine an effective design method. A cantilever-based swing-type FTS was developed in two variations: one with single-side hinges and another with dual-side hinges. The parameters in the design of the swing-type FTS are rotational moment, natural frequency, and material selection. In conclusion, an FTS with a single-side hinge demonstrates the high performance required for micro processing.

Fabrication and Reliability Test of Device Embedded Flexible Module (디바이스 내장형 플렉시블 전자 모듈 제조 및 신뢰성 평가)

  • Kim, Dae Gon;Hong, Sung Taik;Kim, Deok Heung;Hong, Won Sik;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.31 no.3
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    • pp.84-88
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    • 2013
  • These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

Characteristics of $ZnGa_2O_4$ phosphor prepared by Precipitation method and Solid-state reaction method (침전법과 고상반응법으로 제조한 $ZnGa_2O_4$ 형광체의 특성)

  • Cha, Jae-Hyeok;Kim, Se-Jun;Kwak, Hyun-Ho;Choi, Hyung-Wook
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.383-384
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    • 2007
  • The nano and micro-sized $ZnGa_2O_4$ phosphor were prepared by precipitation method and solid-state method. The luminescence, formation process and structure of phosphor powders were investigated by means of XRD, SEM and PL. The result of XRD analysis showed that $ZnGa_2O_4$ spinel structure was formed at as-prepared in the case of precipitation method. However, micro-sized phosphor was required high heating treatment to have a satisfactory spinel structure. The CL intensity of nano-sized phosphor was about 4-fold higher than that of micro-sized phosphor. The emission spectra of all $ZnGa_2O_4$ phosphor show a self activated blue emission band at around 420 nm in the wide range of 300~600 nm.

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A comprehensive study of spin coating as a thin film deposition technique and spin coating equipment

  • Tyona, M.D.
    • Advances in materials Research
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    • v.2 no.4
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    • pp.181-193
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    • 2013
  • Description and theory of spin coating technique has been elaborately outlined and a spin coating machine designed and fabricated using affordable components. The system was easily built with interdisciplinary knowledge of mechanics, fluid mechanics and electronics. This equipment employs majorly three basic components and two circuit units in its operation. These include a high speed dc motor, a proximity sensor mounted at a distance of about 15 mm from a reflective metal attached to the spindle of the motor to detect every passage of the reflective metal at its front and generate pulses. The pulses are transmitted to a micro-controller which process them into rotational speed (revolution per minute) and displays it on a lead crystal display (LCD) which is also a component of the micro-controller. The circuit units are a dc power supply unit and a PWM motor speed controlling unit. The various components and circuit units of this equipment are housed in a metal casing made of an 18 gauge black metal sheet designed with a total area of 1, $529.2cm^2$. To illustrate the use of the spin-coating system, ZnO sol-gel films were prepared and characterized using SEM, XRD, UV-vis, FT-IR and RBS and the result agrees well with that obtained from standard equipment and a speed of up to 9000 RPM has been achieved.

Statistical Approach to 3-Dimensional Shape Inspection of Micro Solder Balls (통계적 방법에 의한 마이크로솔더볼의 3차원형상검사)

  • Kim, Jee Hong
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.4
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    • pp.19-23
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    • 2021
  • A statistical approach to inspection of the 3-D shape of micro solder balls is proposed, where an optical method with spatially arranged LED and specular reflection is used. The reflected image captured by a vision system was analyzed to calculate the relative displacements of LED's in the image. Also, the statistics of displacements for the solder balls contained in a captured image are used to detect existing defects, and the usefulness of the proposed method is shown via experiments.

Trends of Researches and Technologies of Electronic Packaging Using Graphene (그래핀을 이용한 전자패키징 기술 연구 동향)

  • Ko, Yong-Ho;Choi, Kyeonggon;Kim, Sang Woo;Yu, Dong-Yurl;Bang, Junghwan;Kim, Taek-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.2
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    • pp.1-10
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    • 2016
  • This paper reports the trends of researches and technologies of electronic packaging using graphene. Electronic packaging is to provide the signal and electrical current among electronic components, to remove the heat in electronic systems or components, to protect and support the electronic components from external environment. As the required functions and performances of electronic systems or components increase, the electronic packaging has been intensively attracted attention. Therefore, technologies such as miniaturization, high density, Pb-free material, high reliability, heat dissipation and so on, are required in electronic packaging. Recently, graphene, which is a single two-dimensional layer of carbon atoms, has been extensively investigated because of its superior mechanical, electrical and thermal properties. Until now, many studies have been reported the applications using graphene such as flexible display, electrode, super capacitor, composite materials and so on. In this paper, we will introduce and discuss various studies on recent technologies of electronic packaging using graphene for solving the required issues.

A Study on the Effect of Optical Characteristics in 2 inch LCD-BLU by Aspect Ratio of Optical Pattern : I. Optical Analysis and Design (휴대폰용 2인치 LCD-BLU의 광특성에 미치는 광학패턴 세장비의 영향 연구 : I. 광학 해석 및 설계)

  • Hwang, C.J.;Ko, Y.B.;Kim, J.S.;Yoon, K.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2006.05a
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    • pp.239-242
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    • 2006
  • LCD-BLU (Liquid Crystal Display - Back Light Unit) is one of kernel parts of LCD unit and it consists of several optical sheets(such as prism, diffuser and protector sheets), LGP (Light Guiding Plate), light source (CCFL or LED) and mold frame. The LGP of LCD-BLU is usually manufactured by forming numerous dots with $50{\sim}200$ um in diameter on it by etching process. But the surface of the etched dots of LGP is very rough due to the characteristics of the etching process during the mold fabrication, so that its light loss is high along with the dispersion of light into the surface. Accordingly, there is a limit in raising the luminance of LCD-BLU. In order to overcome the limit of current etched dot patterned LGP, optical pattern design with 50um micro-lens was applied in the present study. The micro-lens pattern fabricated by modified LiGA with thermal reflow process was applied to the optical design of LGP. The attention was paid to the effects of different aspect ratio (i.e. $0.2{\sim}0.5$) of optical pattern conditions to the brightness distribution of BLU with micro-lens patterned LGP. Finally, high aspect ratio micro-lens patterned LGP showed superior results to the one made by low aspect ratio in average luminance.

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A Compound Sensor and a Portable System for the Measurement of Urea-and-Glucose Concentration in Blood (혈중요소-혈당농도 측정 복합센서 및 휴대용 시스템)

  • 유재택;이동하;민남기
    • Proceedings of the IEEK Conference
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    • 2003.07c
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    • pp.2871-2874
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    • 2003
  • The development of a portable system to be used by diabetes patients and renal discase patients is needed to monitor their urea concentration and their glucose concentration in blood. This paper reports a compound sensor composed of a urea sensor, a glucose sensor and a micro-channel. This paper also reports the development of a portable measurement system to measure the concentrations, display the values, and save the values to be used by doctors.

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