• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.101-102
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• 2000

The performance of ac plasma display panels (PDP) is influenced strongly by the surface glow discharge characteristics on the MgO thin films. This paper deals with the surface glow discharge characteristics and some physical properties of MgO thin films prepared by reactive RF planar unbalanced magnetron sputtering in connection with ac PDP. The samples prepared with the de bias voltage of -10V showed lower discharge voltage, lower erosion rate by ion bombardment, higher optic transparency and higher crack resistance in annealing process than those samples prepared by conventional magnetron sputtering or E-beam evaporation.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.687-691
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• 2005

We demonstrated stability-enhanced liquid crystal (LC) displays using pixel-iosolated LC mode in which LC molecules are isolated in pixel by horizontal polymer layer and vertical polymer wall. The device shows good electro-optic properties with external pressure and bending due to the polymer structures. The polymer wall acts as supporting structure from mechanical pressure and maintains the cell gap from bending. Moreover, the polymer layer acts as adhesive for tight attachment of two substrates. We presented various methods to produce the polymer structures by using anisotropic phase separation from LC and polymer composites or patterned micro-structures.

• Journal of Information Display
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• v.8 no.2
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• pp.5-9
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• 2007

We demonstrate novel soft-lithographic techniques for preparing patterned liquid crystal (LC) orientations at an alignment layer. By controlling patterning conditions such as wetting property and operating temperature depending on polymeric materials, multi-directional or modified LC alignment conditions can be simply achieved.

• Journal of the Semiconductor & Display Technology
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• v.6 no.3
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• pp.65-70
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• 2007

A method to focus the object in camera system by applying the Hill climb algorithm from optical lens moving device (VCM; Voice coil motor) is proposed. The focusing algorithm from VCM is focus on the object but in these criteria is a well-known drawback; the focus is good only at same distance objects but the focus is bad (blur image) at different distance objects because of the DOF (Depth of focus) or DOF (Depth of field) at the optical characteristic. Here, the new camera system that describes the Reflector of free curvature systems (or Diffractive Fresnel lens) and the partition of focusing window area is proposed. The method to improve the focus in all areas (different distance objects) is proposed by new optical system (discrete auto in-focus) using the Reflector of free curvature systems (or Diffractive Fresnel lens) and by applying the partition of all areas. The proposal is able to obtain good focus in all areas.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.05a
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• pp.219-223
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• 2005

Nowadays laser cutting is the most promising method of cutting FPD(Flat Panel Display) glass in mass-production line. And this method can also be used to cut other brittle materials such as quartz, sapphire, ceramic and semiconductor The concept of this method is shown in picture 1. Laser beam heats glass up to strain point, not to melting point and cooling system chills glass to induce maximun thermal stress in glass surface and then the thermal stress generates micro thermal crack, in other words blind depth of crack, along laser beam and cooling line.

• Journal of the Semiconductor & Display Technology
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• v.3 no.4
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• pp.45-49
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• 2004

We examined large particles and filter size effects of Central Chemical Supplying (CCS) system for STI-CMP on Light Point Defects (LPDs) after polishing. As manufacturing process recently gets thinner below 0.1 um line width, it is very important to keep down post-CMP micro-scratch and LPDs in case of STI-CMP. Therefore, we must control the size distribution of large particles in a slurry. With optimization of final filter size, CCS system is one of the solutions for this issue. The oxide and nitride CMP tests were accomplished using nano-ceria slurries made by ourselves. The number of large particles in a slurry and the number of LPDs on the wafer surface after CMP were reduced with decrease of the final filter size. Oxide removal rates slightly changed according to the final filter size, showing the good performance of self-made nano ceria slurries.

• Journal of the Semiconductor & Display Technology
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• v.6 no.2 s.19
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• pp.59-63
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• 2007

Radio Frequency Identification (RFID) is a common term for technologies using micro chips that are able to communicate over short-range radio and that can be used for identifying physical objects. RFID technology already has several application areas and more are being envisioned all the time. While it has the potential of becoming a really ubiquitous part of the information society over time, there are many security and privacy concerns related to RFID that need to be solved. This paper proposes a method which could protect private information and ensure RFID's identification effectively storing face feature information on RFID tag. This method improved linear discriminant analysis has reduced the dimension of feature information which has large size of data. Therefore, face feature information can be stored in small memory field of RFID tag. The proposed algorithm in comparison with other previous methods shows better stability and elevated detection rate and also can be applied to the entrance control management system, digital identification card and others.

• Journal of the Semiconductor & Display Technology
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• v.16 no.1
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• pp.29-33
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• 2017

This paper presents a development of vision aligner with three channels for the wafer and plate bonding machine in manufacturing of LED. The developed vision aligner consists of three cameras and performs wafer alignment of rotation and translation, flipped wafer detection, and UV Tape detection on the target wafer and plate. Normally the process step of wafer bonding is not defined by standards in semiconductor's manufacturing which steps are used depends on the wafer types so, a lot of processing steps has many unexpected problems by the workers and environment of manufacturing such as the above mentioned. For the mass production, the machine operation related to production time and worker's safety so the operation process should be operated at one time with considering of unexpected problem. The developed system solved the 4 kinds of unexpected problems and it will apply on the massproduction environment.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.356-359
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• 2007

Continuing improvements in integrated circuit chip density and functionality have mostly contributed toward a very large-scale integrated circuit(VLSI) and display device. In order to test (pass or fail) all of the high integrated semiconductor chip and display device, fine pitch probes are used. Fine pitch probes are manufactured by electroforming process of a Ni alloy in an electrolytic bath. In this paper, we expect that the electric field in bath with the Finite Element Method and applying the FEM result. So, we can obtained the probes that have high aspect ratio of 10 : 1

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.6
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• pp.33-42
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• 1997

In this paper, a new structure for a dC plasma display pane(PDP) with a wall-catode and a wall-auxilizry anode has been suggested. The wall-cathode with a sufficient discharge area maximizes the discharge volume. The auxiliary anode surrounding the discharge region makes the effective control of the charged particles possible. We have investigated the cahracteristics of the new cell structure with a 2-dimensional computer simulation and a micro gap discharge system, and compared experimentally with those of previous cell structure. The new cell structure with the wall-cathode and auxiliary wall-anode turned out to have improved luminance, discharge forming time and sustain voltage.