• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2003년도 추계학술대회논문집
• /
• pp.93-96
• /
• 2003

Recently, various bulk metallic glasses (BMG's) haying good mechanical and chemical properties were developed. BMG's can easily be deformed in the supercooled liquid region, via viscous flow mechanism. In our previous work, we evaluated the deformation behavior and some other basic properties of Z $r_{41.2}$ $Ti_{13.8}$C $u_{12.5}$N $i_{10}$B $e_{22.5}$ alloy. In this study, we investigated the micro forming of Z $r_{41.2}$ $Ti_{13.8}$C $u_{12.5}$N $i_{10}$B $e_{22.5}$ alloy. The process condition was chosen based on the viscosity data from TMA, and superalloy and Si wafer with micro patterns on the surface were used as forming die. The alloy showed good replication of the patterns. However, some stripe patterns, resembling scratches, appeared on the deformed alloy surface. These scratches can be reduced or eliminated by polishing before forming.ing.ore forming.ing.

• Design & Manufacturing
• /
• 제14권1호
• /
• pp.36-41
• /
• 2020

Recently, due to the development of MEMS technology, researches for the production of effective micro structures and shapes have been actively conducted. However, the process technology based on chemical etching has a number of problems such as environmental pollution and time problems due to multi-process. Various processes to cope with this process are being studied, and one of the mechanical etching processes is the powder blasting process. This process is a method of spraying fine particles, which has the advantage of being an effective process in manufacturing hard brittle materials. However, it is also a process that adversely affects the material surface roughness and material properties due to the impact of the injection of fine particles. In this study, after fabricating micro-channels in fused silica glass with excellent optical properties among the hard brittle materials, we used the nano indentation system to analyze the micro parts using nano-particles as well as machinability and surface roughness analysis of the processed surface. The analysis was performed for the effective processing of powder blasting.

• Design & Manufacturing
• /
• 제14권1호
• /
• pp.63-68
• /
• 2020

Ultra-high brightness and thin displays need to optical micro-patterns which can uniformly diffuse the lights and low loss. The micro random patterns have characteristics to rise the optical efficiency such as light extraction, uniform diffusion. For this reason, various fabrication processes are studied for random patterns. In this study, the micro random patterns were machined by diamond turning which used a controlled cutting tool path with random cutting depth. The machined patterns had random shape and directionality along the circumferential direction. The average width and length of machined random pattern according to rotation radius were 40.13㎛~55.51㎛ and 37.25㎛~59.49㎛, and these results were compared with the designed result. Also, the machining error according to rotation radius in diamond turning using randomly controlled cutting depth was discussed.

• 소성∙가공
• /
• 제13권1호
• /
• pp.9-14
• /
• 2004

Recently, various bulk metallic glasses (BMG's) having good mechanical and chemical properties were developed. BMG's can easily be deformed in the supercooled liquid region, via viscous flow mechanism. By using the viscous flow, the very low pressure is needed to deform the materials. In this study, we investigated the structural transition and deformation behavior of Vitreloy 1 (Zr/sub 41.2/Ti/sub 13.8/Cu/sub 12.5/Ni/sub 10/Be/sub 22.5/) using TMA and DSC. We applied the results to the micro forming process. The forming condition was chosen based on the viscosity data from TMA, and Si wafer with micro patterns on the surface was used as a forming die. The deformed surface was analyzed by SEM and 3D Surface Profiling System. The alloy showed good replication of the patterns. Quantitative measurement of roughness was useful to evaluate the replication. Surface condition of the deformed surface was determined by the initial surface condition.

• Design & Manufacturing
• /
• 제14권3호
• /
• pp.57-62
• /
• 2020

In the drug delivery system industry, the technology with even split injection becomes important for maximizing efficiency and minimizing the side effects. In conventional drug delivery system, infection can occur due to pain and splashing. Also, various applications are impossible due to disposable use, and it is the reason to avoid to use this system because of the complexity of the driving method. Therefore, in this study, a painless drug delivery device is developed for non-pain with electrical insulation breakdown method. Finite elements analysis was used to evaluate the ejection characteristics of drugs according to the shape of the micro ejection nozzle. The effect of the number of holes in the micro nozzle, the length of the nozzle and the inner shape of the nozzle on the drug discharge characteristics were analyzed.

• Design & Manufacturing
• /
• 제11권3호
• /
• pp.51-55
• /
• 2017

Micro fuel cells have high reliability and long usage time. Among them, PEMFC (polymer Electrolyte Membrane Fuel Cell) is suitable as a portable power source because it is easy to fix electrolyte and simple structure. The bipolar plate, a key component of the fuel cell, is produced by cutting. In the case of micro fuel cell separator, burr is very small and the flow channel size in the separator is very small. Therefore, it is difficult to remove burrs in the usual way such as a brushing or ultra-sonic method. Therefore, this study proposed electrolytic polishing process and analyzed the characteristics of each condition by introducing the concept of roughness reduction rate. In addition, the ultrasonic process was added to analyze the effect of ultrasonic addition.

• 소성∙가공
• /
• 제13권5호
• /
• pp.429-434
• /
• 2004

Manufacturing process for milli components has recently gained researcher's focus with the increasing tendency toward highly integrated and micro-scaled parts for electronic devices. The milli-components need more precise manufacturing process than the conventional manufacturing process since the parts require higher dimensional accuracy than the conventional ones. In order to enhance the forming accuracy and productivity, various forming procedures proposed and studied by many researchers. In this paper, forming analysis of milli-components has been studied with a new micro-former. In modeling of progressive dies, multi-stage forming sequence has been analyzed with finite element analysis by LS-DYNA3D. The analysis proposes the sequential die and part shapes with the corresponding punch force and dimensional accuracy. The analysis also considers the effect of elastic dies on the dimensional accuracy of the formed parts. The analysis result demonstrates that the elastic analysis in the milli-forming process is indispensable for accurate forming analysis. The analysis procedure in the paper will provide good information in design of a new micro-former and milli-component

• 마이크로전자및패키징학회지
• /
• 제17권4호
• /
• pp.73-76
• /
• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2009년도 춘계학술대회 논문집
• /
• pp.64-67
• /
• 2009

Vibrational micro-forming of pyramidal shape patterns was conducted for an Al superplastic alloy, Al 5083 and a Zr-based bulk metallic glass, $Zr_{62}Cu_{17}Ni_{13}Al_8$. A vibrational micro-forming system was specially designed for generating vibrational load by combining a PZT actuator with a signal generator. Single crystal Si micro dies with wet-etched pyramidal patterns were used as master dies for vibrational micro-forming. The micro-formed pattern height was increasing with increasing the frequency of the vibrational load. In particular, the vibrationally-microformed pattern height was similar or even higher than the statically-microformed pattern height when the load frequency exceeded about 125 kHz. It was also observed that the crystal grains affect the surface quality of the microformed pattern and the distribution of the pattern height in the die cavity array.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2005년도 ISMP
• /
• pp.67-88
• /
• 2005

Mold-Flow 3 Die Stack CSP of Mold array packaging with different Gate types. As high density package option such as 3 or 4 die stacking technologies are developed, the major concerning points of mold related qualities such as incomplete mold, exposed wires and wire sweeping issues are increased because of its narrow space between die top and mold surface and higher wiring density. Full 3D rheokinetic simulation of Mold flow for 3 die stacking structure case was done with the rheological parameters acquired from Slit-Die rheometer and DSC of commercial EMC. The center gate showed severe void but corner gate showed relatively better void performance. But in case of wire sweeping related, the center gate type showed less wire sweeping than corner gate types. From the simulation results, corner gate types showed increased velocity, shear stress and mold pressure near the gate and final filling zone. The experimental Case study and the Mold flow simulation showed good agreement on the mold void and wire sweeping related prediction. Full 3D simulation methodologies with proper rheokinetic material characterization by thermal and rheological instruments enable the prediction of micro-scale mold filling behavior in the multi die stacking and other complicated packaging structures for the future application.