• Journal of the Korean Society for Precision Engineering
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• v.15 no.10
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• pp.128-139
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• 1998

In this paper, a finite element method for predicting the temperature and stress distributions in micro-machining is presented. The work material is oxygen-free-high-conductivity copper(OFHC copper) and its flow stress is taken as a function of strain, strain rate and temperature in order to reflect realistic behavior in machining process. From the simulation, a lot of information on the micro-machining process can be obtained; cutting force, cutting temperature, chip shape, distributions of temperature and stress, etc. The calculated cutting force was found to agree with the experiment result with the consideration of friction characteristics on chip-tool contact region. Because of considering the tool edge radius, this cutting model using the finite element method can analyze the micro-machining with the very small depth of cut, almost the same size of tool edge radius, and can observe the 'size effect' characteristic. Also the effects of temperature and friction on micro-machining were investigated.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.75-78
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• 2007

Recently, the need for micro mold or micro mechanical parts has been rapidly increased. As feature size decreases, conventional machining processes show their limitation. Micro electrical discharging machining (EDM) and electrochemical machining (ECM) have many advantages in micro machining. They can be used to make structures of micro scale, or even nano scale size. In this paper, the application of micro EDM and ECM has been investigated.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.12
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• pp.177-184
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• 2001

C3M(chemical mechanical micro machining) is applied for diminishing the size of burr and fabricating the massless patterning for aluminium wafer(thickness of 1${\mu}m$). It is difficult to perform the micro size machining with the radically increased shear stress. While the miniaturization and function-orientation of parts has been needed in the many field such as electronics, optics and medicine. etc., it is not enough to satisfy the industry needs in the machining technology. In this paper feasibility test of diminishing burr and fabricating maskless pattern was experimented and analyzed. In the experiment oxide layer was farmed on the aluminium with chemical reaction by ${HNO_3}$(10wt%), then the surface was grooved with tungsten carbide tool for the different condition such as the load and fred rate. The result was compared with the conventional machining to show the improvement of C3M with SEM for burr diminish and XPS for atomic existence, AFM for more precise image.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.10
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• pp.178-183
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• 2001

Abrasive jet machining(AJM) process is similar to the sand blasting and effectively removes hard and brittle materials. AJM has applied to rough working such as debarring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM is developed, and has become the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro grooving of glass. Diameter of hole and width of line in grooving is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro grooving of glass, but the size of machined groove increased about 2~4${\mu}{\textrm}{m}$. With the fine tuning of masking process and compensation of film wear. this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.1
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• pp.101-107
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• 2011

Analytical solution of micro-scale milling process is presented in order to suggest available machining conditions. The size effect should be considered to determine cutting characteristics in micro-scale cutting. The feed per tooth is the most dominant cutting parameter related to the size effect in micro-scale milling process. In order to determine the feed per tooth at which chips can be formed, the finite element method is used. The finite element method is employed by utilizing the Johnson-Cook (JC) model as a constitutive model of work material flow stress. Machining experiments are performed to validate the simulation results by using a micro-machining stage. The validation is conducted by observing cutting force signals from a cutting tool and the conditions of the machined surface of the workpiece.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1897-1901
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• 2003

Recently, with the development of semiconductor technology the miniaturization of products as well as parts and the products with high precision are being required. In addition as a national competitive power is increasingly effected by micro part development through micro machining and the secure of micro machining technology, the study of micro machining technology is being conducted in many countries. The goal of this study is to fabricate micro tool under the size of 30$\mu\textrm{m}$ and machine micro holes through micro tool fabrication by grinding, the application of ELID to grinding wheel and the measurement of surface roughness for micro tool.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.3
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• pp.181-187
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• 2014

Micro patterns are used to maximize the performance and efficiency of the product in many industries such as energy, display, printing, biology, etc. Nowadays, the fabrication technology for micro patterns has been developed in various ways such as photolithography, laser machining, electrical discharge machining and mechanical machining. Recently, mechanical machining the size of smaller than 1 micrometer could be tried, because the technology related to the machining was developed brilliantly. This paper shows the experiments using cutting processes in order to fabricate the micro pattern. Micro patterns of the size of several micrometers were machined by the diamond tools of two different shape, the deformation and generation of burr were investigated.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.12
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• pp.191-197
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• 2003

As mechanical components are miniaturized, the demand on micro die and mold is increasing. Micro mechanical components usually have high hardness and good conductivity. So micro electrical discharge machining (MEDM) is an effective way to machine those components. In micro cavity fabrication using MEDM, it is observed that the bottom surface of cavity is distorted. Electric charges tend to be concentrated at the sharp edge. At the center of the bottom surface, debris can not be drawn off easily. These two phenomena make the bottom surface of the electrode and workpiece distort. As machining depth increases, the distorted shape of electrode approaches hemisphere. This process is affected by capacitance and the size of electrode. By using a smaller electrode than the desired cavity size and appropriate tool movement, bottom shape distortion can be prevented.

• International Journal of Precision Engineering and Manufacturing
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• v.6 no.4
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• pp.44-48
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• 2005

As mechanical components are miniaturized, the demands on micro die/mold are increasing. Micro mechanical components usually have high hardness and good conductivity. Micro electrical discharge machining (MEDM) can thus be an effective way to machine those components. In micro cavity fabrication using MEDM, it is observed that the bottom surface of the cavity is distorted. Electric charges tend to be concentrated at the sharp edge, and debris cannot be drawn off easily at the center of the bottom surface. These two phenomena make the bottom surface of electrode and workpiece distort. As machining depth increases, the distorted shape of the electrode approaches hemisphere. This process is affected by both capacitance and the size of electrode. By using a smaller electrode than the desired cavity size and appropriate tool movement, bottom shape distortion can be prevented.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.963-966
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• 2000

Abrasive jet machining(AJM) process is similar to the sand blasting, and effectively removes hard and brittle materials. AJM has applied to rough working such as deburring and rough finishing. As the needs for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro groove cutting of glass. Diameter of hole and width of line in this groove cutting is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro groove cutting in glass, but the size of machined groove was increased about 2~4${\mu}{\textrm}{m}$. therefore, this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD parts.