• 제목/요약/키워드: Micro Line

검색결과 620건 처리시간 0.038초

신간선 전두부 디자인의 형상 변천 (The Changes of Shinkansen Vehicles' Nose Shape)

  • 김광명;한석우
    • 한국철도학회논문집
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    • 제10권2호
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    • pp.124-130
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    • 2007
  • The emphasis of this paper is to find out the changes in length of nose in line with speed improvement and changes of the tendency in the shape of the nose in line with time series based on the Shinkansen vehicle. The length of the nose on the lines of high speed tends to get longer, however there is no proportion between the speed and the nose according to optimal design that was designed to reduce micro-pressure wave and air resistance. The Shinkansen vehicles, according to the shape, can be classified in to an Advanced Paraboloid shape, a Sharp-nosed shape, a Flat-nosed shape and an Organic Double-edged shape and is gradually changing in the trend of diversity and distinction. Hereafter, the design of the nose will be developed better into the design that will comprehend identity of manufacturer, region and culture on the basis of optimized aerodynamic shape.

전력선모뎀 및 조광제어 안정기를 이용한 400W Metal Halide Lamp의 조광제어 시스템 개발 (Development of Dimming control system for 400W Metal Halide Lamp by Electronic Ballast and Power Line Modem)

  • 박종연;최왕섭
    • 산업기술연구
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    • 제29권B호
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    • pp.193-198
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    • 2009
  • In this paper, we developed remote dimming control system of electronic ballast for 400W metal halide lamp. This ballast could limit ignition current and soft start-up technique by the inverter with LCsCp resonance tank. The dimming circuit can dim from 400W to 200W by varying of the inverter switching frequency. The PLM consists of coupling circuit, BPF(Band-Pass Filter), FSK(Frequency Shift Keying) Modem and ${\mu}$-controller(Micro Controller). By coupling electronic ballast with PLM, the system that able to dimming the lamp through PLM is demonstrated by experimental results.

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폴리머 적층 시스템을 이용한 다양한 3 차원 미세 구조물 제작에 관한 연구 (A Study on the Fabrication of Various 3D Microstructures using Polymer Deposition System)

  • 김종영
    • 한국정밀공학회지
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    • 제29권6호
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    • pp.686-692
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    • 2012
  • Solid free-form fabrication (SFF) technology was developed to fabricate three-dimensional (3D) scaffolds for tissue engineering (TE) applications. In this study, we developed a polymer deposition system (PDS) and created 3D microstructures using a bioresorbable polycaprolactone (PCL) polymer. Fabrication of 3D scaffolds by PDS requires a combination of several devices, including a heating system, dispenser, and motion controller. The system can process a polymer with extremely high precision by using a 200 ${\mu}m$ nozzle. Based on scanning electron microscope (SEM) images, both the line width and the piled line height were fine and uniform. Several 3D micro-structures, including the ANU pattern (a pattern named after Andong National University), $45^{\circ}$ pattern square, frame, cylindrical, triangular, cross-shaped, and hexagon, have been fabricated using the polymer deposition system.

레이저를 이용한 LCD 유리 절단 기술

  • 정재용;오대현;유기룡;이천;이우영
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2005년도 춘계 학술대회
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    • pp.219-223
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    • 2005
  • Nowadays laser cutting is the most promising method of cutting FPD(Flat Panel Display) glass in mass-production line. And this method can also be used to cut other brittle materials such as quartz, sapphire, ceramic and semiconductor The concept of this method is shown in picture 1. Laser beam heats glass up to strain point, not to melting point and cooling system chills glass to induce maximun thermal stress in glass surface and then the thermal stress generates micro thermal crack, in other words blind depth of crack, along laser beam and cooling line.

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Production Planning Method Using the Push-back Heuristic Algorithm: Implementation in a Micro Filter Manufacturer in South Korea

  • Sung, Shin Woong;Jang, Young Jae;Lee, Sung Wook
    • Industrial Engineering and Management Systems
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    • 제14권4호
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    • pp.401-412
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    • 2015
  • In this paper, we present a modeling approach to production planning for an actual production line and a heuristic method. We also illustrate the successful implementation of the proposed method on the production line. A heuristic algorithm called the push-back algorithm was designed for a single machine earliness/tardiness production planning with distinct due date. It was developed by combining a minimum slack time rule and shortest processing time rule with a push-back procedure. The results of a numerical experiment on the heuristic's performance are presented in comparison with the results of IBM ILOG CPLEX. The proposed algorithm was applied to an actual case of production planning at Woongjin Chemical, a leading manufacturer of filter products in South Korea. The seven-month execution of our algorithm led to a 24.5% decrease in the company's inventory level, thus demonstrating its practicality and effectiveness.

고유전율 필름을 이용한 적층형 유기기판에 내장된 방향성 결합기 (Fully Embedded Directional micro-Coupler into Organic Packaging Substrate with High Dielectric Film)

  • 천성종;박재영
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2007년도 제38회 하계학술대회
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    • pp.260-261
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    • 2007
  • 본 논문에서는 800MHz와 1.9GHz 대역의 시스템에 적용할 수 있는 20dB 방향성 결합기를 8층 PCB 기판에 내장하여 소형화 및 저가화 할 수 있도록 설계하였다. 방향성 결합기는 4층과 6층에 coupled line으로 적층함으로써, 다층 PCB기판을 최대한 활용하여 공간을 최소화하였다. 또한, 고유전율을 가진 필름을 이용하여, coupled line의 끝에 내장형 고용량 커패시터를 연결하여 설계하였다. 6 $\times$ 6 $\times$ 0.7 (height)$mm^3$ 크기로 설계된 방향성 800MHz 결합기의 경우 -20dB의 coupling 특성, -0.6dB의 transmission 특성, -25dB의 isolation 특성을 나타내었다. 패키징 기판에 내장된 방향성 결합기는 단말기 및 통신시스템의 소형화에 크게 기여할 수 있을 것이다.

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레이저를 이용한 LCO 유리 절단 (Laser Controllable Thermo-cleaving of LCD Glasses)

  • 이석준;콘드라텐코
    • 한국레이저가공학회:학술대회논문집
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    • 한국레이저가공학회 2004년도 추계학술대회논문집
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    • pp.50-61
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    • 2004
  • Nowadays Laser Controllable Thermo-cleaving is the most promising method of cutting FPD(Flat Panel Display) glass in mass-production line. And this method can be used to cut other brittle materials such as quartz, sapphire, ceramic and semiconductor. The concept of this method is shown in Picture 1. Laser beam heats glass up to strain point not to melting point and cooling system chills glass to make maximum thermal stress in glass and then the thermal stress generates micro thermal crack in other words blind crack. Laser Controllable Thermo-cleaving controls the thermal stress to optimize the blind crack up to level of mass-production line.

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Experimental investigation of Scalability of DDR DRAM packages

  • Crisp, R.
    • 마이크로전자및패키징학회지
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    • 제17권4호
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    • pp.73-76
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    • 2010
  • A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

연기선과 미세 수적을 이용한 두 가지 가시화 기법과 와류에의 적용 (Two Visualization Techniques Using Smoke-wire and Micro Water-droplets and Their Applications to Vortex Flows)

  • 손명환
    • 한국항공우주학회지
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    • 제44권12호
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    • pp.1017-1026
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    • 2016
  • 두 가지의 비표면 가시화 기법과 이들 기법의 와류 적용 예를 기술한다. 두 가지 가시화 기법 중 하나는 전통적인 연기선 기법이고, 또 다른 하나는 가정용 초음파 가습기에서 발생하는 미세 수적을 사용하는 기법이다. 연기선 기법은 공기 흐름 속도에 제한이 있으며(0.07 mm 지름의 연기선의 경우 약 5 m/sec), 오염의 문제점이 있지만 매우 정교하고 선명한 연기 유맥선 시트를 발생시킬 수 있다. 이 기법은 3차원 날개의 날개 끝 와류의 가시화에 적용되었다. 초음파 가습기 미세 수적 기법은 연기선 기법에 비하여 공기 흐름 속도를 보다 크게 할 수 있으며(10 m/sec 이상), 독성과 오염의 문제를 해결할 수 있다. 초음파 가습기 미세 수적 기법은 정점 스트레이크를 가지는 이중 삼각날개에서 발생하는 복잡한 와류 시스템의 가시화에 성공적으로 적용되었다.

선로제약을 고려한 복수개의 마이크로그리드 최적운영 기법에 관한 연구 (A Study on Optimal Operation Method of Multiple Microgrid System Considering Line Flow Limits)

  • 박시나;안정열
    • 한국산학기술학회논문지
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    • 제19권7호
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    • pp.258-264
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    • 2018
  • 본 논문은 마이크로 그리드 최적 운영을 위해 Differential Search (DS) 알고리즘을 적용하였다. DS 알고리즘은 이주하는 생물의 유사 브라운 운동 형태의 임의보행 (random-walk)을 모의하여 개발된 알고리즘이다. DS 알고리즘은 다른 최적화 알고리즘과 달리 한 개 이상의 개체를 동시에 사용 할 수 있고, 유사 최적해중에서 전역 최적 해를 선별하는 직진성 특성으로 multi-modal 함수들의 해법을 위한 성공적인 탐색 전력을 지니고 있으며, 높은 비선형성과 불연속성을 갖는 전력계통의 다른 분야에도 효율적으로 적용될 수 있다. 마이크로 그리드 시스템은 풍력 발전기, 디젤발전기, 연로전지 및 태양광 발전기로 구성된다. 풍력 발전기는 가변 출력특성을 이용하여 모델링 하였다. 연료비용과 연료가 전력으로 변환되는 경우의 효율을 포함시켜 시스템의 비용을 최소화 하였으며, 마이크로 그리드 단독 운용에 관해서만 분석하였다. 본 연구는 신재생 에너지원 기반의 마이크로 그리드의 최적 운영에 대해 코딩의 단순성, 빠른 수렴 속도, 정확성 및 효율성을 갖춘 DS 알고리즘을 적용하여 다른 알고리즘의 최적 값과 비교하였다.