• Restorative Dentistry and Endodontics
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• 제28권3호
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• pp.209-221
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• 2003

The objectiveness of this study was to evaluate whether low-viscosity composite can bond effectively to dentin surface without bonding resin. The low-viscosity composites being 50wt% filler content were made by the inclusion of bonding resin of two self-etching systems(Cleafil SE Bond, Unifil Bond) varied with contents as 0, 10, 20, 30, 40, 50wt%. Exposed dentin surfaces of extracted 3rd molars are used. Dentin bond strengths were measured. The tests were carried out with a micro-shear device placed testing machine at a CHS of 1mm/min after a low-viscosity composite was filled into an iris cut from micro tygon tubing with internal diameter approximately 0.8mm and height of 1.0mm. 1 Flexural strength and modulus was increased with the addition of bonding resin. 2. Micro-shear bond strength to dentin was improved according to content of bonding resin irrespective of applying or not bonding resin in bonding procedure, and that of Clearfil SE Bond groups was higher than Unifil Bond. 3. There were no significant difference whether use of each bonding resin in bonding procedure for S-40, S-50, U-50(p＞0.05). 4. In SEM examination, resin was well infiltrated into dentin after primed with self-etching primer only for S-50 and U-50 in spite of the formation of thinner hybrid layer. Low viscosity composite including some functional monomer may be used as dentin bonding resin without an intermediary bonding agent. It makes a simplified bonding procedure and foresees the possibility of self-adhesive restorative material.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1277-1280
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• 2005

A high-aspect-ratio and high-resolution stainless steel shadow mask for organic thin-film transistors (OTFTs) circuit has been fabricated by a new method which combines photochemical machining, micro-electrical discharge machining (micro-EDM), and electrochemical etching (ECE). First, connection lines and source-drain holes are roughly machined by photochemical etching, and then the part of source and drain holes is finished by the combination of micro-EDM and ECE processes. Using this method a $100\;\mu{m}$ thick stainless steel (AISI 304) shadow mask for inverter can be fabricated with the channel length of $30\;\mu{m}\;and\;10\;\mu{m}\;respectively.\;The\;width\;of\;connection line\;is\;150\;\mu{m}$. The aspect ratio of the wall is about 5 and 15, respectively. Metal lines and source-drain electrodes of OTFTs were successfully deposited through the fabricated shadow mask.

• Design & Manufacturing
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• 제14권1호
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• pp.36-41
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• 2020

Recently, due to the development of MEMS technology, researches for the production of effective micro structures and shapes have been actively conducted. However, the process technology based on chemical etching has a number of problems such as environmental pollution and time problems due to multi-process. Various processes to cope with this process are being studied, and one of the mechanical etching processes is the powder blasting process. This process is a method of spraying fine particles, which has the advantage of being an effective process in manufacturing hard brittle materials. However, it is also a process that adversely affects the material surface roughness and material properties due to the impact of the injection of fine particles. In this study, after fabricating micro-channels in fused silica glass with excellent optical properties among the hard brittle materials, we used the nano indentation system to analyze the micro parts using nano-particles as well as machinability and surface roughness analysis of the processed surface. The analysis was performed for the effective processing of powder blasting.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 추계학술대회 논문집
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• pp.370-375
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• 2002

Recently, the interest on micro optical parts has increased rapidly with the development of technology related to microsystems. Among the optical parts, micro lens is one of the most broadly used micro parts. To mass-produce the micro lenses, it is very effective to use the mold insert and injection molding process. There are many methods to fabricate the mold insert for micro lenses: electroforming, etching, mechanical micromachining and so on. In this study, we fabricated the mold insert for micro lenses using a micro ball endmill to apply mechanical micromaching method and analyzed the effect of main process parameters such as spindle speed, feed rate, dwell time on the processed surface. Then, using fabricated the mold insert we fabricated the micro lenses through injection molding process.

• 한국세라믹학회지
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• 제39권6호
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• pp.570-575
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• 2002

현재 전기 . 전자 기술의 추세는 소형화를 비롯하여 집적화, 저전력화, 저가격화의 장점을 가진 MEMS(Micro Electro Mechanical Systems) device의 개발에 주력하고 있으며, 이를 위해서는 고종횡비와 높은 식각 속도를 가진 HDP(High Density Plasma) etching 기술 개발이 필수적이라 할 수 있다. 이를 위하여 우리는 Inductively Coupled Plasma(ICP) 장비를 이용하여 각 공정 변수에 의한 실리콘 deep trench식각 반응을 연구하였다. 실험 공정 변수인 platen power, etch/passivation cycle time에서 etching 단계 시간에 따른 변화와 SF$_{6}$:C$_4$F$_{8}$ 가스유량을 변화시켜 연구하였으며 또한 이들의 profile, scallops, 식각 속도, 균일도, 선택비도 관찰하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.375-378
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• 2002

We investigated the reduction of etching damage by additive O$_2$ in etching gas and recovery of etching damage by O$_2$ annealing. The PZT thin films were etched using additive Ar or O$_2$ into Cl$_2$/CF$_4$ gas mixing ratio of 8/2. In order to recover ferroelectric properties of PZT thin films after etching, the etched PZT thin films were annealed at 600 C in O$_2$ atmosphere for 10 min. The remanent polarization is decreased seriously and fatigue is accelerated in the PZT sample etched in Ar/(C1$_2$+CF$_4$) plasma, whereas these characteristics are improved in O$_2$/(Cl$_2$/CF$_4$). From x-ray photoelectron spectroscopy (XPS) analysis, the intensities of Pb-O, Zr-O and Ti-O peaks are changed and the etch byproducts such as metal chloride and metal fluoride are reduced by O$_2$ annealing. From electron probe micro analyzer (EPMA) and auger electron spectroscopy(AES), O$_2$ vacancy is observed after etching. In x-ray diffraction (XRD), the structure damage in the additive O$_2$ into C1$_2$/CF$_4$ is reduced and the improvement of ferroelectric behavioral annealed sample is consistent with the increase of the (100) and (200) PZT peaks.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.32-32
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• 2011

Plasma etching is used in microelectronic processing for patterning of micro- and nano-scale devices. Commonly, optical emission spectroscopy (OES) is widely used for real-time endpoint detection for plasma etching. However, if the viewport for optical-emission monitoring becomes blurred by polymer film due to prolonged use of the etching system, optical-emission monitoring becomes impossible. In addition, when the exposed area ratio on the wafer is small, changes in the optical emission are so slight that it is almost impossible to detect the endpoint of etching. For this reason, as a simple method of detecting variations in plasma without contamination of the reaction chamber at low cost, a method of measuring plasma impedance is being examined. The object in this research is to investigate the suitability of using plasma impedance monitoring (PIM) with statistical approach for real-time endpoint detection of $SiO_2$ etching. The endpoint was determined by impedance signal variation from I-V monitor (VI probe). However, the signal variation at the endpoint is too weak to determine endpoint when $SiO_2$ film on Si wafer is etched by fluorocarbon plasma on inductive coupled plasma (ICP) etcher. Therefore, modified principal component analysis (mPCA) is applied to them for increasing sensitivity. For verifying this method, detected endpoint from impedance analysis is compared with optical emission spectroscopy (OES). From impedance data, we tried to analyze physical properties of plasma, and real-time endpoint detection can be achieved.

• 한국진공학회지
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• 제20권3호
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• pp.217-224
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• 2011

최근, 결정질 실리콘 태양전지 분야에서 저가격화와 공정의 단순화가 가장 중요한 부분으로 대두되고 있다. 특히 태양전지 가격의 대부분을 차지하고 있는 웨이퍼의 저가격화가 가장 큰 이슈로 떠오르면서, 웨이퍼의 저가격화를 실현하기 위한 최선의 방안으로 마이크로 블라스터를 이용한 재생웨이퍼 제작 방법이 대두되고 있다. 마이크로 블라스터를 이용하여 재생웨이퍼를 제작 할 경우, 표면의 요철이 형성되어 반사율이 감소되어 태양전지 내부로 입사하는 빛의 양을 증가시키는 긍정적인 효과가 있다. 또한, 공정비용이 저렴하여 태양전지 저가격화를 실현할 수 있다. 그러나, 마이크로 블라스터를 이용한 공정은 웨이퍼에 물리적인 충격을 주기 때문에 표면에 크랙이 형성되며 식각 잔여물들이 표면에 재흡착되는 단점이 있다. 본 연구에서는 이러한 단점들을 보완하기 위하여 DRE (Damage Remove Etching)를 수행하였다. DRE 공정 후 반사율과 소수 반송자 수명을 측정하여 미세 파티클과 마이크로 크랙의 제거를 확인하였고, 태양전지를 제작하여 효율에 미치는 영향을 분석하였다. 마이크로 블라스터 공정 후 웨이퍼의 소수 반송자 수명은 Bare 웨이퍼에 비해 80% 정도 감소하였으나, DRE 공정 수행 후에는 50% 까지 증가하였음을 확인할 수 있었다. 태양전지 효율을 비교해보면, DRE 공정을 수행한 웨이퍼의 경우 Bare 웨이퍼보다 약 1~2%, DRE 공정을 수행하지 않은 웨이퍼보다 약 3∼5% 증가했음을 확인하였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2001년도 추계학술대회 논문집
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• pp.200-203
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• 2001

Micromolding methods such as micro-injection molding and micro-compression molding are most suitable for mass production of plastic micro-optics with low cost. In this study, plastic micro-optical components, such as refractive microlenses and diffractive optical elements(DOEs) with various grating patterns, were fabricated using micro-compression molding process. The mold inserts were made by ultrapricision mechanical machining and silicon etching. A micro compression molding system was designed and developed. Polymer powders were used as molded materials. Various defects found during molding were analyzed and the process was optimized experimentally by controlling the governing process parameters such as histories of mold temperature and compression pressure. Mim lenses of hemispherical shape with $250{\mu}m$ diameter were fabricated. The blazed and 4 stepped DOEs with $24{\mu}m$ pitch and $5{\mu}m$ depth were also fabricated. Optical and geometrical properties of plastic molded parts were tested by interferometric technique.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.381-385
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• 2003

This paper presents the fabrication possibility of the micro actuator which uses a micro-thermal bubble, generated by a micro-heater under pulse heating. The micro-actuator is consist of three plate. The lower plate includes the channel and chamber are fabricated on high processability silicon wafer by the DRIE(Deep Reactive ion Etching) process. The middle plate includes the chamber and diaphragm, and the upper plate is the micro-heater. The micro-heater designed non-uniform width and results in periodic generation of stable single bubbles in D.I water. The single bubble appears precisely on the narrow part of the micro-heater and control is recorded.