• 제목/요약/키워드: Micro Etching

검색결과 425건 처리시간 0.03초

UV 경사노광에 의한 미세광학패턴 LCD-도광판 (Development of Micro-Optical Patterned LCD-LGP using UV Inclined-Exposure Process)

  • 황철진;김종선;고영배;허영무
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 춘계학술대회 논문집
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    • pp.51-54
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    • 2005
  • Light Guide Plate (LGP) of LCD-BLU(Back Light Unit) is manufactured by forming optical pattern with $5\~100um$ in diameter on the LGP by means of sand blasting or etching method. However, in order to improve the luminance of LCD-LGP, the design of optical pattern has introduced UV inclined-exposure process in this study. This micro-optical pattern, which has asymmetric elliptical column shaped pattern, can change low viewing-angle to high viewing-angle, as well as it contribute to diffusion of light. As a result, this type of micro-optical pattern can introduce the highly luminance. The PR structure obtained in the stage of lithography has asymmetric elliptical column shape and it is processed into a micro-optical pattern. Optical design with this kind of micro-optical pattern, mold fabrication by electroplating and LGP molding with injection molding are under way.

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MEMS-IR SENSOR용 식각-접합-박막증착 기반공정 (Etching-Bonding-Thin film deposition Process for MEMS-IR SENSOR Application)

  • 박윤권;주병권;박흥우;박정호;염상섭;서상희;오명환;김철주
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1998년도 하계학술대회 논문집 G
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    • pp.2501-2503
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    • 1998
  • In this paper, the silicon-nitride membrane structure for IR sensor was fabricated through the etching and the direct bonding. The PTO layer as a IR detection layer was deposited on the membrane and its characteristics were measured. The attack of PTO layer during the etching of silicon wafer as well as the thermal isolation of the IR detection layer can be solved through the method of bonding/etching of silicon wafer. Because the PTO layer of c-axial orientation raised thermal polarization without polling, the more integration capability can be achieved. The surface roughness of the membrane was measured by AFM, the micro voids and the non-contacted area were inspected by IR detector, and the bonding interface was observed by SEM. The polarization characteristics and the dielectric characteristics of the PTO layer were measured, too.

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플라즈마 에칭 처리된 PTFE 표면의 발수성 연구 (Study on Water Repellency of PTFE Surface Treated by Plasma Etching)

  • 강효민;김재형;이상혁;김기웅
    • 한국가시화정보학회지
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    • 제19권3호
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    • pp.123-129
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    • 2021
  • Many plants and animals in nature have superhydrophobic surfaces. This superhydrophobic surface has various properties such as self-cleaning, moisture collection, and anti-icing. In this study, the superhydrophobic properties of PTFE surface were treated by plasma etching. There were four important factors that changed the surface properties. Micro-sized protrusions were formed by plasma etching. The most influential parameter was RF Power. The contact angle of the pristine PTFE surface was about 113.8°. The maximum contact angle of the surface after plasma treatment with optimized parameters was about 168.1°. In this case, the sliding angle was quite small about 1°. These properties made it possible to remove droplets easily from the surface. To verify the self-cleaning effect of the surface, graphite was used to contaminate the surface and remove it with water droplets. Graphite particles were easily removed from the optimized surface compared to the pristine surface. As a result, a surface having water repellency and self-cleaning effects could be produced with optimized plasma etching parameters.

플라즈마 에칭과 중합에 의한 탄소섬유의 표면 개질 (Plasma Etching and Polymerization of Carbon Fiber)

  • H. M. Kang;Kim, N. I.;T. H. Yoon
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2002년도 춘계학술발표대회 논문집
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    • pp.143-146
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    • 2002
  • Unsized AS-4 carbon fibers were etched by RF plasma and then coated via plasma polymerization in order to enhance adhesion to vinyl ester resin. The gases utilized for the plasma etching were Ar, $N_2 and O_2$, while the monomers used for the plasma polymerization coating were acetylene, butadiene and acrylonitrile. The conditions for the plasma etching and the plasma polymerization were optimized by measuring interfacial adhesion with vinyl ester resin via micro-droplet tests. Among the treatment conditions, the combination of Ar plasma etching and acetylene plasma polymerization provided greatly improved interfacial shear strength (IFSS) of 69MPa compared to 43MPa with as-received carbon fiber. Based on the SEM analysis of failure surface and load-displacement curve, it was assume that the failure might be occurred at the carbon fiber and plasma polymer coating. The plasma etched and plasma polymer coated carbon fibers were subjected to analysis with SEM, XPS, FT-IR or Alpha-Step, and dynamic contact angles and tensile strengths were also evaluated. Plasma polymer coatings did not change tensile strength and surface roughness of fibers, but decreased water contact angle except butadiene plasma polymer coating, possibly owing to the functional groups introduced, as evidenced by FT-IR and XPS.

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평판형 마이크로 고체 추진제 추력기의 설계, 제작 및 평가 (Design, Fabrication and Testing of Planar Type of Micro Solid Propellant Thruster)

  • 이종광;권세진
    • 한국추진공학회지
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    • 제10권4호
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    • pp.77-84
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    • 2006
  • 마이크로/나노 위성체 개발과 함께 위성체의 자세 제어 및 궤도 수정을 위한 마이크로 추력기의 개발이 필요하게 되었다. 다양한 마이크로 추력기들 중 가장 각광 받고 있는 마이크로 고체 추진제 추력기를 소개하고, 추력기의 구성 요소들에 관한 연구 결과를 기술하였다. 추진제 점화를 위한 마이크로 백금 점화기를 제작하여 형상 변수에 관한 성능 평가를 수행하였다. HTPB/AP 고체 추진제의 특성 연구를 수행하여, 추진제의 연소 속도를 측정하였다. 마이크로 챔버는 감광성 유리를 이방성 식각하여 제작하였으며, 최종적으로 이들 요소들을 통합하여 마이크로 고체 추진제 추력기의 연소 실험을 수행하였다.

휴대폰용 2인치 LCD-BLU의 광특성에 미치는 광학패턴 세장비의 영향 연구 : I. 광학 해석 및 설계 (A Study on the Effect of Optical Characteristics in 2 inch LCD-BLU by Aspect Ratio of Optical Pattern : I. Optical Analysis and Design)

  • 황철진;고영배;김종선;윤경환
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2006년도 춘계학술대회 논문집
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    • pp.239-242
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    • 2006
  • LCD-BLU (Liquid Crystal Display - Back Light Unit) is one of kernel parts of LCD unit and it consists of several optical sheets(such as prism, diffuser and protector sheets), LGP (Light Guiding Plate), light source (CCFL or LED) and mold frame. The LGP of LCD-BLU is usually manufactured by forming numerous dots with $50{\sim}200$ um in diameter on it by etching process. But the surface of the etched dots of LGP is very rough due to the characteristics of the etching process during the mold fabrication, so that its light loss is high along with the dispersion of light into the surface. Accordingly, there is a limit in raising the luminance of LCD-BLU. In order to overcome the limit of current etched dot patterned LGP, optical pattern design with 50um micro-lens was applied in the present study. The micro-lens pattern fabricated by modified LiGA with thermal reflow process was applied to the optical design of LGP. The attention was paid to the effects of different aspect ratio (i.e. $0.2{\sim}0.5$) of optical pattern conditions to the brightness distribution of BLU with micro-lens patterned LGP. Finally, high aspect ratio micro-lens patterned LGP showed superior results to the one made by low aspect ratio in average luminance.

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미세금형 가공을 위한 전기화학식각공정의 유한요소 해석 및 실험 결과 비교

  • 류헌열;임현승;조시형;황병준;이성호;박진구
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2012년도 춘계학술발표대회
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    • pp.81.2-81.2
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    • 2012
  • To fabricate a metal mold for injection molding, hot-embossing and imprinting process, mechanical machining, electro discharge machining (EDM), electrochemical machining (ECM), laser process and wet etching ($FeCl_3$ process) have been widely used. However it is hard to get precise structure with these processes. Electrochemical etching has been also employed to fabricate a micro structure in metal mold. A through mask electrochemical micro machining (TMEMM) is one of the electrochemical etching processes which can obtain finely precise structure. In this process, many parameters such as current density, process time, temperature of electrolyte and distance between electrodes should be controlled. Therefore, it is difficult to predict the result because it has low reliability and reproducibility. To improve it, we investigated this process numerically and experimentally. To search the relation between processing parameters and the results, we used finite element simulation and the commercial finite element method (FEM) software ANSYS was used to analyze the electric field. In this study, it was supposed that the anodic dissolution process is predicted depending on the current density which is one of major parameters with finite element method. In experiment, we used stainless steel (SS304) substrate with various sized square and circular array patterns as an anode and copper (Cu) plate as a cathode. A mixture of $H_2SO_4$, $H_3PO_4$ and DIW was used as an electrolyte. After electrochemical etching process, we compared the results of experiment and simulation. As a result, we got the current distribution in the electrolyte and line profile of current density of the patterns from simulation. And etching profile and surface morphologies were characterized by 3D-profiler(${\mu}$-surf, Nanofocus, Germany) and FE-SEM(S-4800, Hitachi, Japan) measurement. From comparison of these data, it was confirmed that current distribution and line profile of the patterns from simulation are similar to surface morphology and etching profile of the sample from the process, respectively. Then we concluded that current density is more concentrated at the edge of pattern and the depth of etched area is proportional to current density.

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Micro-Porous Ceramics Using directionally $MgAl_2O_4/MgO$ eutectic crystals

  • Lee, Jong-Ho
    • 한국결정성장학회지
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    • 제15권6호
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    • pp.229-233
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    • 2005
  • Novel process was tried to obtain micro-porous ceramic body containing continuous pore channel. $MgAl_2O_4/MgO$ eutectic fibers and rods have been grown successfully by the micro-pulling-down method, and the microstructures and optical characterizations of grown crystals were performed. $MgAl_2O_4/MgO$ eutectic fibers of $0.3{\sim}1mm$ in diameter and about 500 mm in length, and the rods having 5 mm in diameter with approximately 60 mm in length have been grown with the $6{\sim}120mm/hr$ of growth speed. The eutectic fibers showed homogeneous microstructure in which MgO fiber aligned to the growth direction in the $MgAl_2O_4$ (spinel) matrix. The grown crystals looked semitransparency under naked eyes. Optical and orientational characterizations were performed. The second phase of MgO (periclase) was easily removed by selective etching with hydrochloric acid, and then porous bodies were obtained.

핫 엠보싱 공정을 이용한 플라스틱 CE(capillary electrophoresis) 마이크로 칩의 제작 (Fabrication of plastic CE (capillary electrophoresis) microchip by hot embossing process)

  • 차남구;박창화;임현우;박진구
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.1140-1144
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    • 2005
  • A plastic-based CE (capillary electrophoresis) microchip was fabricated by hot embossing process. A Si mold was made by wet etching process and a PMMA wafer was cut off from 1mm thick PMMA sheet. A micro-channel structure on PMMA substrate was produced by hot embossing process using the Si mold and the PMMA wafer. A vacuum assisted thermal bonding procedure was employed to seal an imprinted PMMA wafer and a blank PMMA wafer. The results of microscopic cross sectional images showed dimensions of channels were well preserved during thermal bonding process. In our procedure, the deformation amount of bonding process was below 1%. The entire fabrication process may be very useful for plastic based microchip systems.

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광디스크용 마이크로미러의 설계 및 제작에 관한 연구 (A Study on the Design and Fabrication for the Micro-Mirror of Optical Disk System)

  • 손덕수;김종완;임경화;서화일;이우영
    • 한국정밀공학회지
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    • 제19권11호
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    • pp.211-220
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    • 2002
  • Optical disk drives read information by replacing a laser beam on the disk track. As information has become larger, the more accurate position control of a laser beam is necessary. In this paper, we report the analysis and fabrication of the micro mirror for optical disk drivers. A coupled simulation of gas flow and structural displacement of the micro mirror using the Finite-Element-Method is applied to this. The mirror was fabricated by using MEMS technology. Especially, the process using the lapping and polishing step after the bonding of the mirror and electrode plates was employed for the Process reliability. The mirror size was 2.5mm${\times}$3mm and it needed about 35V for displacement of 3.2 ${\mu}$.