• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.926-931
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• 2002

Although ceramic plates with many micro-hales are used as MCP (Micro-channel plate) for electron amplification, catalytic converters, filters, electrical insulators and thermal conductors in integrated circuits, the drilling of micro-hales in the ceramics is difficult because of their low thermal conductivity, high hardness and brittleness. Therefore, in this work, the machining of ceramic green body fellowed by sintering of green body was employed fur fabricating ceramic plates with many micro-holes. The micro-drilling of alumina green body was performed with diamond abrasive WC drills, and the cutting force w.r.t. drilling times was measured for the determination of toot life. From the investigation of the wear of micro-drill tip w.r.t. drilling times, the wear mechanism of tip during micro-drilling of ceramic green body was suggested.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.79.1-84
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• 1995

The thermal analysis method containing micro drilling characteristic is proposed for the first time. There are such problems in thermal analysis of micro hole drilling as the thermal modeling complexity of drilling process and the undesirable micro drilling characteristic. Especially, the undesirable micro drilling characteristic prevents our using conventional thermal modeling. To model the thermal behavior of the micro drilling process, the finite different method, where heat source vectors are distributed by the measured rhrust and torque, is proposed. This method agrees with thermal behavior of the real system. And, it enable to predict the temperature field near the drill during. The validity of this method is verified in comparing with experimental results.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.5
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• pp.99-103
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• 2012

Presently, A glass is widely used in telecommunication system, optoelectronic devices and micro electro mechanical systems. Micro drilling of glass using the laser can save processing cost and improve the accuracy. This paper experiments micro drilling using KrF excimer laser on the pyrex glass of $500{\mu}m$ thickness. We have experiment to find out optimum laser machining conditions of micro drilling of glass and ablation depth and influence by processing parameter suc'h pulse repetition rate, energy density and number of pulses. Pulse repetition rate don't influence ablation depth at the micro drilling of pyrex glass. Energy density influence micro drilling of parallelism and maximum thickness that can be drilled. Ablation depth is most influenced by number of pulses.

• Journal of Advanced Marine Engineering and Technology
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• v.18 no.4
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• pp.62-68
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• 1994

Recently, the trends toward reduction in size and weight of industrial products increased the application of micro hole for manufacturing gadgets of high precision and gave rise to a great deal of interest for micro hole drilling M/C. Quite a few research work is performed on micro drilling on domestic basis compared with the tendency of analyzing cutting mechanism, adaptive control, monitoring of generally available drills of diameter greater than 1mm. This study adresses the design, manufacturing and controlling a micro hole drilling M/C with the overload detection instrument and the step feed mechanism. Controlling and monitoring of the drilling process are acomplished on PC basis for more user interfaces and effectiveness. The test machine of the results of this research shows a good foundation for extending further micro hole machining technique.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.1
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• pp.117-129
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• 1998

Micro-hole drilling (holes less than 0.5 mm in diameter with aspect ratio larger than 10) is recently having more attention in a wide spectrum of precision production industries. Alternative methods such as EDM. laser drilling, etc. can sometimes replace the mechanical micro-hole drilling but are not acceptable in PCB manufacture because of the inferior hole quality and accuracy. The major difficulties in micro-hole drilling are related to small signal to noise ratios, wandering motions of the inlet stage, high aspect ratios, high temperatures and so forth. Of all the difficulties. the most undesirable one is the increase of drilling force as the drill proceeds deeper into the hole. This is caused mainly from the chip effects. Peck-drilling is thus widely used for deep hole drilling despite that it suffers from low productivity. In the paper, a method of cutting force regulation is proposed to achieve continuous drilling. A PD and a sliding mode control algorithms were implemented through controlling the spindle rotating frequency. Experimental results show that the sliding mode control reduces the nominal cutting force and the variation of the cutting force better than the PD control. The advantages of the regulation, such as increase of drill life, fast stabilization of a wandering motion, and the precise positioning of the hole are verified in experiment.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.593-598
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• 2003

Ceramic plates containing many micro-holes are used in diverse applications such as MCP (Microchannel Plate). catalytic converters, filters, electrical insulators in integrated circuits, and so on. One of the efficient methods for machining many holes in ceramic plates is wet drilling of ceramic green bodies followed by sintering them. Since the strength of ceramic green bodies is much lower than the strength of sintered ceramic plate, ceramic green bodies can be drilled with high feed rate. The axial force during micro-drilling of ceramic green bodies increases rapidly at high feed rate, which induces the crack in workpiece. Therefore, the tool lift of micro-drill with respect to feed rate may be determined by the predicting increase of axial force. In this work, the axial force during micro-drilling was calculated using the chip flow model on the micro-drill tip. from which the tool life of diamond abrasive micro-drill during micro-drilling of ceramic green bodies was calculated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1064-1067
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• 2001

Micro drilling is used in the production of fuel injection nozzle, watch, camera, air bearing and pinted circuit boards(PCB) are demanded for high precision. Recently industries of precision production require more small hole, high aspect ratio and high speed working for micro deep hole drilling. But the undesirable characteristics of micro drilling is the small signal to noise ratios, wandering motion of drill, high aspect ratio and the increase of cutting force as cutting depth increase. So in this paper to obtain the optimization of cutting condition a study on the characteristics of micro deep hole drilling used Tool dynamometer is proposed.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.161-166
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• 2003

The micro-extruding die is a die for manufacturing of fine-wire by extruding process. The fine-wire made from the micro-extruding can be effectively applied to fields of semiconductor parts and medical parts etc. It is predicted that the demand of fine-wire in industry is more and more increasing. In this study $\phi50\mu m$ micro-drill which is coated with diamond is used for drilling of super micro-hole sizes. For the machining of taper parts of entrance and exit, drill having $\phi50\mu\textrm{mm}$ inclination angle $20^{\circ}$and angle $30^{\circ}$ is used. This is useful for anti tool-breakage and excessive too-wear in drilling process. After micro-drilling, the polishing process by diamond abrasive and polishing wood s carried out for increasing surface roughness.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.953-956
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• 1997

Micro drilling characteristics by EDM method was investigated. In detail, Micro tool electrode for EDM drilling was machined by use of WEDG method and micro hole was drilled using the machined tool electrode in SUS plate. The machining accuracy and time was compared in a different dielectric fluid. As a result, it was convinced that this method could be utilized as a fabrication technology of micro mold or micro 3 dimensional parts.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.842-846
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• 1997

Micro-hole drilling (holes less than 0.5 mm in diameter with aspect ratios larger than 10) is gaining increased attention in a wide spectrum of precision production industries. Alternative methods such as EDM, laser drilling, etc. can sometimes replace mechanical micro-hole drilling but are not acceptable in PCB manufacture because they yield inferior hole quality and accuracy. The major difficulties in micro-hold drilling are related to wandering motions during the inlet stage, high aspect ratios, high temperature,etc. However, of all the difficulties, the most undesirable one is the increase of drilling force as the drill penetrates deeper into hold. This is caused mainly by chip related effects. Peck-drilling is thus widely used for deep hole drilling despite the fact that it leads to low productivity. Therefore, in this paper, a method of cutting force regulation is proposed to achieve continuous drilling. A proportional plus derivative (PD) and a sliding modecontrol algorithm will be implemented for controlling the spinle rotational frequeency. Experimental results will show that sliding mode control reduces the nominal cutting force and its variation better than the PD control, resulting in a number of advantages such as an increase in drill life, fast stabilization of the wandering motion, and precise positioning of the hole.