• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.94-98
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• 2003

The microstructure of Sn1.8Bi0.8Cu0.6In alloys was evaluated at various aging time. The bumps of Sn1.8Bi0.8Cu0.6In alloys after reflowed at $250^{\circ}C$ were well-formed and had 260um height. The craters on the bumps, however, were observed. Intermetallic compounds formed on the interface between so]der and Cu/Ni UBM were consist of $(Cu,Ni)_6Sn_5$. As aging goes on up to 1000hours, the composition of Ni changed from $6.63\%$ at initial stage(as-reflowed) to $13.47\%$ at final stage(1000hours aging ). In addition, after 500hours aging, the floating of IMC to the solder was observed.

• Journal of the Korean Ceramic Society
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• v.35 no.6
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• pp.551-558
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• 1998

Detection of microcrack in {{{{ {Al }_{2 } {O }_{3 } }} ceramics were studided by AE(acoustic emission) technique with 4-point bending test in order to evaluate the fracture process and formation of microcrack. Fully-dense alu-mina ceramics having a different grain size were fabricated by varing the hot-pressing temperature. The grain size of alumina increased with increasing the hot-pressing temperature whereas the bending strength decreasd. The microcracks were observed by SEM and TEM. The generation of AE event increased with increasing the applied load and many AE event was generated at maximum applied load. Alumina with smaller grain size shows the generation of many AE event resulting in an increase of microcrack formation. An intergranular fracture is predominantly observed in fine-grained alumina whereas intragranular fracture occurs predominantly in coarse-grained alumina,. Analysis of micorstructure and AE prove that primary mi-crocracks occur within grain-boundaries of alumina. The larger microcracking were formed by the growth and/or coalesence of primary microcracks. Then the materials become to fracuture by main crack gen-eration at the maximum applied load.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.55-58
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• 2002

The possibility of SnCuX Solder as alternative for Pb-free Solder have been investigated in this study. SnCuX Solder balls(500${\mu}{\textrm}{m}$) were placed on Si-wafer which is Al/Ni/Cu(500nm/$4{\mu}{\textrm}{m}$/$4{\mu}{\textrm}{m}$)UBM layer. After reflow soldering at $250^{\circ}C$, shear strength and microstructure were analyzed. The results showed that the shear strength(500gf) of SnCuX was higher than that of SnCuX at $230^{\circ}C$ and $Cu_6Sn_5$ intermetallic compounds were formed between Cu and SnCuX Solder layers

• Korean Journal of Materials Research
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• v.15 no.11
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• pp.730-734
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• 2005

Cr-Al-Si-N coatings were deposited on WC-Co substrates by a hybrid coating system of arc ion plating and DC magnet :on sputtering technique in $N_2/Ar$ mixture. The Cr-tll-Si-N coatings were synthesized with different Si contents. Their microstructure and mechanical properties were systematically investigated. The average size of crystallites largely decreases with the increase of Si content compared with Cr-Al-N. The microhardness of Cr-Al-Si-N coatings largely increases from 24 to 55 GPa. The enhanced hardness is believed to originate from the microstructural change by the fine composite microstructure of Cr-Al-N coatings with Si addition. The average friction coefficient of Cr-Al-Si-N coatings decreases from 0.84 to 0.45 with increasing Si content up to $16\;at.\%$.

• The Korean Journal of Ceramics
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• v.2 no.3
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• pp.152-156
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• 1996

Fine (~0.09 $\mu$m) $\beta$-SiC Powders with 3.3wt% of large (~0.44$\mu$m) $\alpha$-SiC of $\beta$-SiC particles (seeds) added were hotpressed at 175$0^{\circ}C$ using $Y_2O_3$, $Al_2O_3$ and CaO as sintering aids and then annealed at 185$0^{\circ}C$ for 4 h to enhance grain growth. The resultant microstructure and polytypes were analyzed by high resolution electron microscopy (HREM).Growth of $\beta$-SiC with high density of microtwins and formation of ${\alpha}/{\beta}$ composite grains consisting of $\alpha$-SiC domain sandwiched between $\beta$-SiC domains were found in both specimens. When large $\alpha$-SiC (mostly 6H) seeds were added, the $\beta$-SiC transformend preferentially to the 6H polytype. In contrast, when large $\beta$-SiC (3C) seeds were added, the fine $\beta$-SiC transformed preferentially to the 4H polytype. Such results suggested that the polytype formation in SiC was influenced by crystalline form of seeds added as well as the chemistry of sintering aids. The ${\alpha}/{\beta}$ interface played and important role in the formation of elongated grains as evidenced by presence of ${\alpha}/{\beta}$ composite grains with high aspect ratio.

• The Korean Journal of Ceramics
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• v.2 no.3
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• pp.162-166
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• 1996

The effects of NiO addition on the microstructure and microwave dielectric properties of ($Zr_{08}Sn_{02}$)$TiO_4$ (ZST) were investigated. With the NiO addition, a higher density of ZST ceramics than 95% of the theoretical values has been obtained in the sintering temperature range of 1400 to 150$0^{\circ}C$. Energy dispersive X-ray spectrometry (EDS) analysis of sintered specimen shows the presence of second phase at grain boundaries, which is considered to be $NiTiO_3$. Dielectric constant of the specimen is found to increase linearly with density. Q-values and TC$_r$ decrease with increasing NiO content. The variation of dielectric properties with NiO content is discussed in terms of the second phase. The ZST ceramics with 0.25 wt% NiO showed ${\varepsilon}_{\gamma}$=38, Q=7000 at GHz and TC$\gamma$=-0.5 ppm/$^{\circ}C$, comparable with the values obtained by the previous investigations.

• Journal of the Korean institute of surface engineering
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• v.24 no.1
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• pp.24-24
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• 1991

Cr-N films were deposited on low-carbon steel sheets by the reactive arc-induced ion plating (AIIP). The influence of the deposition conditions (nitrogen pressure and substrate bias voltage) on the crystal orientation, morphology and microhardness of the Cr-N films has been investigated using x-ray diffractometer and scanning electron microscope. The impurities and contaminations on the surface and at the interface, and the layer-by-layer compositions of the film have been analyzed using scanning Auger multiprobe (SAM) and glow discharge spectroscope (GDS). The mixed state of Cr and Cr2N turned out to have a fine fibrous structure. The Cr2N films were deposited at a wide range of nitrogen flow rates. The orientations of Cr2N films were mainly (110) and (111), and the intensity of the (111) peak increased as the substrate bias voltage increased. The micorstructure of the Cr2N film was dense and no columnar structure was observed. The films in the mixed state of Cr2N and CrN were also dense without columnar structure. The maximum microhardness of the Cr-N films was 2400 kg/$\textrm{mm}^2$ at 10gf load.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.10
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• pp.828-833
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• 2000

Growth characteristics and microstructure of AIN thin films grown by plasma assisted molecular beam epitaxy on Si substrates have been investigated. Growing temperature and substrate orientation were chosen as major variables of the experiment. Reflection high energy electron diffraction (RHEED), X-ray diffraction (XRD), atomic force microscopy (AFM) and transmission electron microscopy/diffraction (TEM/TED) techniques were employed to characterize the micorstructure of the films. On Si(100) substrates, AlN thin films were grown along the hexagonal c-axis preferred orientation at temperature range 850-90$0^{\circ}C$. However on Si(111), the AlN films were epitaxially grown with directional coherency in AlN(0001)/Si(111), AlN(1100)/Si(110), and AlN(1120)/Si(112) at 85$0^{\circ}C$ and the epitaxial coherencry seemed to be slightly distorted with increasing temperature. The microstructure of AlN thin films on Si(111) substrates showed that the films include a lot of crystal defects and there exist micro-gaps among the columns.

• Journal of Technologic Dentistry
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• v.32 no.3
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• pp.195-207
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• 2010

Purpose: The purpose of this study was to observe the microstructural changes of surface in the specimens, performing the shear bond strength testing. The currently most used non-precious alloys are nickel-chromium based alloys with or without beryllium. However, their biocompatibility has been questioned concerning possible damages to the health of the patient and professionals involved in the fabrication of prosthesis caused by long exposure to Ni and Be. An option to nickel-chromium alloys is the cobalt-chromium alloy, an alternative that does not sacrifice the physical properties of the metal porcelain systems. Studies in the animals substantially show that the cobalt-chromium alloys are relatively well tolerated, being therefore more biocompatible than the nickel-chromium alloys. Methods: Non-addition Be to nickel-chromium based alloy(Bellabond plus) and cobalt-chromium alloy which has been widely used(Wirobond C) fused with ZEO light porcelain classified control group and cobalt-chromium alloy which is developing alloy of Alphadent company in Korea(Alphadent alloy) fused with ZEO light porcelain classified experimental group. The specimens of $4mm{\times}4mm{\times}0.5mm$ were prepared as-cast and as-opaque to cast body to analyze the mechanical characteristic change, the microstructure of alloy surface. The phase change was used to observe through XRD analysis and OM/SEM was used to observe the surface of specimens as-cast and as-opaque to cast body. Chemical formation of their elements was measured with EDS. Then hardness was measured with Micro Vicker's hardness tester. Shear bond strength test thirty specimens of $10mm{\times}10mm{\times}2mm$ was prepared, veneered, 3mm high and 3mm in diameter, over the alloy specimens. The shear bond strength test was performed in a universal testing machine(UTM) with a cross head speed of 0.5mm/min. Ultimate shear bond strength data were analyzed with one-way ANOVA and the Scheffe's test (P<0.05). Within the limits of this study, the following conclusions were drawn: The X-ray diffraction analysis results for the as-cast and as-opaque specimens showed that the major relative intensity of Bellabond plus alloy were changed smaller than Wirobond C and Alphadent Co-Cr based alloys. Results: Microstructural analysis results for the opaque specimens showed all the alloys increased carbides and precipitation(PPT). Alphadent Co-Cr based alloy showed the carbides of lamellar type. The Vickers hardness results for the opaque specimens showed Wirobond C and Alphadent Co-Cr based alloys were increaser than before ascast, but Bellabond plus alloy relatively decreased. The mean shear bond strengths (MPa) were: 33.11 for Wirobond C/ZEO light; 25.00 for Alphadent Co-Cr alloy/ZEO light; 18.02 for Bellabond plus/ZEO light. Conclusion: The mean shear bond strengths for Co-Cr and Ni-Cr based alloy were significantly different. But the all groups showed metal-metal oxide modes in shear bond strengths test at the interface.