• Title/Summary/Keyword: Mica Heater

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A Study on the Temperature and Electrical Characteristics of Carbon Heater (카본 발열체의 온도 및 전기적 특성에 관한 연구)

  • Jin, Z.H.;Shim, K.J.;Kong, T.W.;Jeong, H.M.;Chung, H.S.
    • Journal of Power System Engineering
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    • v.10 no.1
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    • pp.71-76
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    • 2006
  • This paper aims to study several type heaters which are mica heater, film heater, quartz heater and rod heater and to get an temteraturel and electrical characteristics. These four type heaters have a merit in many fields than present electric heater with nichrome wire. Carbon and mica plate heater have higher heat efficiency and less electromagnetic waves. Also it has been reported that far infrared ray emission from this heater is good for our health. Additionally heating element is thin and lighter plate. For these reasons, they will be widely used to various application such as room-heating or manufacturing goods. Experimental result confirmed that when 220V current authorized, the temperature, electric current, electric power and the resistance rise to stationary state in early stage. Moreover, the temperatures and electric characteristics show a good stability.

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A Heating Apparatus for Semiconductor Manufacturing using Direct Heating Method (직접 가열 방식을 이용한 반도체 제조용 히팅 장치)

  • Jung, Soon-Won;Koo, Kyung-Wan
    • The Transactions of the Korean Institute of Electrical Engineers P
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    • v.57 no.4
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    • pp.408-411
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    • 2008
  • As to this research is new structure of the semiconductor substrate heating apparatus. The fast thermoresponsive according to the direct heating structure of the heating plate layer adhering closely to the floor side of a substrate and the fast heat loss minimization can be accomplished. Moreover, the contact area of the sheath heater, which is the heating plate layer built-in heating apparatus, is increased, so that it has more heating valid area. For this, it adheres closely to the substrate, in which the photosensitive film is coated and the heating plate layer, adhering closely to the floor side of a substrate the mica layer which adheres closely to the floor side of the upper heating plate layer in order to minimize an insulation and heat loss, and the lower part of the mica layer and it is comprised of the floor plate layer. The heating plate layer forms the continued groove portion over the floor side whole. The sheath heater for heating a substrate is inserted with the groove portion and the heating plate layer is comprised. It is confirmed that by using the new substrate heating structure, the temperature change of the heating plate against the time is observed. Then, there is the electric power saving effect of about 40% in comparison with the existing method.