• 소성∙가공
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• 제8권3호
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• pp.306-312
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• 1999

In the recent sheet metal forming simulations, it increases to adopt the dynamic explicit method for an effective computation and the elastoplastic formulation for stress recovery. It is inevitable in the dynamic explicit method that some noises occur, which sometimes partly spoil results of simulations. This phenomenon becomes severer when complicate contact conditions are included in simulations. In commercial dynamic codes, the concept of contact damping is introduced. However, the formulation process of it is not revealed well. In this paper, a contact damping method is formulated in order for effectively suppressing noises occurring due to complicated contact conditions. This is checked by analyzing a simple sheet metal stamping process (U-draw bending). From the computational results, it is shown that the contact damping can effectively control the noises due to contacts, especially when considering the sheet thickness, and help to develop more reliable internal stress states, which result in more realistic shapes after springbank.

• 대한화학회지
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• 제59권2호
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• pp.132-135
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• 2015

Bonding force and stiffness in amine-linked single-molecule junctions for Ag electrodes were measured using a home-built conducting atomic force microscope under ambient conditions at room temperature. For comparison, Au electrodes were used to measure the rupture force and stiffness of the molecular junctions. The traces of the force along with the conductance showed a characteristic saw-tooth pattern owing to the breaking of the metal atomic contacts or the metal-molecule- metal junctions. We found the rupture force and stiffness for Ag are smaller than those for Au electrodes. Furthermore, we observed that the force required to break the amine-Ag bond in the conjugated molecule, 1,4-benzenediamine, is smaller than in 1,4-butanediamine which is fully saturated. These results consist with the previous theoretical calculations for the binding energies of the nitrogen bonded to Ag or Au atoms.

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권5호
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• pp.588-593
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• 2014

Current crowding problem can worsen the internal quantum efficiency and the negative-voltage ESD of InGaN-based LEDs. In this paper, by using photon emission microscope and thermal emission microscope measurement, we confirmed that the electric field and the current of the InGaN-based LED sample are crowded in specific regions where the distance between p-type metal contact and n-type metal contact is shorter than other regions. To improve this crowding problem of electric field and current, modified metal contact geometry having uniform distance between the two contacts is proposed and verified by a numerical simulation. It is confirmed that the proposed structure shows better current spreading, resulting in higher internal quantum efficiency and reduced reverse leakage current.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1996년도 한국자동제어학술회의논문집(국내학술편); 포항공과대학교, 포항; 24-26 Oct. 1996
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• pp.612-615
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• 1996

In the continuous casting process, molten metal contacts the mold wall and the molten metal surface is subject to the mold oscillation. The mold oscillation results in the oscillation marks on the surface of solidified steel, which has undesirable effects on the quality of slabs. In order to reduce the oscillation marks by achieving soft contact of molten metal with the mold surface, alternating magnetic field is applied to the surface of molten metal. However, if the magnetic field strength becomes too strong, the melt flow induced by the magnetic field. causes the instability of the molten metal surface, which has also the bad influence on the slab quality. Therefore, it is very important to choose the optimal position of the inductor coil and the optimal level of electric power to minimize the surface defects. In the present work, as a first step toward the optimization problem of the process, numerical studies are performed to investigate the effects of coil position and the electric power level on the meniscus shape and the flow field. As numerical tools, the boundary integral equation method(BIEM) is used for the magnetic field analysis and the finite difference method (FDM) with orthogonal grid generation is used for the flow analysis.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제51권4호
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• pp.147-151
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• 2002

The resistances of metal2 contact to metall and poly Si are checked by various RF etch conditions in terms of pre-cleaning. The changes of resistance are evaluated by statistical analysis method(SAS) for the AC bias power, coil power and RF target. The contact area on poly Si is shown by TEM image and the distributions of contact resistance according to ar etch target and RTP are investigated. The RTP groups have larger variations than normal RF etch targets. When the RF etch target becomes lower and coil power becomes higher, the resistances of metal2 contact to metals and poly Si have lower contact resistance. But the condition of AC bias power did not satisfied low meta12 contacts resistance for metall and poly Si simultaneously. The R-square of ststistical analysis was 0.98 for resistances of meta12 contact to poly Si and 0.87 for resistances of meta12 contact to metall.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 춘계학술대회논문집A
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• pp.121-126
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• 2000

Metal/Ceramic structures have many attractive properties, with great potential for applications that demand high stiffness, as well as chemical and biological stability, thermal and electrical insulation. They are currently in use for mechanical and thermal protection in cutting tool and engine parts. With all their great advantage, ceramics suffer from one major problem they are brittle, and are especially susceptible to cracking from surface contacts. Delamination at the interfaces with adjacent layers is a particularly disturbing problem, and can cause premature failure of a composite system. so determination of adhesive properties of coating is one of the most important problems for the extension of the use of coated materials. In this work, mechanical characteristics of Interface of ceramic/Metal composites are evaluated by means of hardness test, indentation test apparent interfacial toughness and bonding strength test. The interface indentation test provides a relation between the applied load(P) and the length of the crack(a) created at the interface between the coating and the substrate.

• 한국전기전자재료학회논문지
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• 제24권4호
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• pp.328-332
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• 2011

The formation of front metal contact silicon solar cells is required for low cost, low contact resistance to silicon surface. One of the front metal contacts is Ni/Cu plating that it is available to simply and inexpensive production to apply mass production. Ni is shown to be a suitable barrier to Cu diffusion into the silicon. The process of Ni electroless plating on front silicon surface is performed using a chemical bath. Additives and buffer agents such as ammonium chloride is added to maintain the stability and pH control of the bath. Ni deposition rate is found to vary with temperature, time, utilization of bath. The experimental result shown that Ni layer by SEM (scanning electron microscopy) and EDX analysis. Finally, plated Ni/Cu contact solar cell result in an efficiency of 17.69% on $2{\times}2\;cm^2$, Cz wafer.

• Tribology and Lubricants
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• 제39권2호
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• pp.43-48
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• 2023

In this study, we investigate the tribological behavior of AISI 304 stainless steel pairs under deionized water and hexagonal boron nitride (h-BN) water dispersion lubrication. The specimen friction and wear properties are evaluated using a reciprocating ball-on-flat tribometer. The coefficient of friction remains nearly constant throughout the test under both lubricant conditions. The wear depth of the specimens under h-BN lubrication is smaller than that under deionized water lubrication, indicating the inhibition behavior of h-BN nanolubricants on direct metal-metal contacts. Optical micrographs and stylus profilometer measurements are performed to evaluate the severity of damage caused by the sliding motion and to determine the wear morphology of the specimens, respectively. The results show that h-BN nanolubricants does not have a significant effect on the friction behavior but demonstrates reduced wear owing to their trapping effect between the sliding interfaces. Moreover, scanning electron microscopy and energy-dispersive X-ray spectroscopy images of the specimens were acquired to confirm the trapping effect of h-BN between the sliding interfaces. The results also suggest that the trapped lubricants can distribute the contact pressure, reducing the wear damage caused by the metal-metal contact at the interface. In conclusion, h-BN nanolubricants have potential as an anti-wear additive for lubrication applications. Further investigation is needed to provide direct evidence of the trapping effect of h-BN nanoparticles between the sliding interfaces. These findings could lead to the development of more efficient and effective lubricants for various industrial applications.

• 반도체디스플레이기술학회지
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• 제14권1호
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• pp.27-30
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• 2015

SiC based Schottky barrier diodes were prepared by using the facing targets sputtering method. In this research, 4H-SiC polytypes of SiC were adopted and Molybdenum, Titanium was employed as the Schottky metal of the metal-semiconductor contacts. Both structures showed the rectifying nature in their forward and reverse J-V characteristic curve and the ideality factors calculated from these plots that were close to unity were represented the nearly ideal behavior. Difference of Schottky barrier height between prepared devices was also corresponding with the electrical characteristics of themselves. Therefore the suitability of the facing targets sputtering method for fabrication of Schottky diodes could be suggested from these results.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.5-6
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• 2006

There are typically applied on both rear and front sides of electrical contacts to the solar cell. The front contact formation is particularly sensitive to many parameters. Accordingly patterning of front grid line is an important factor of solar cells. This paper describe the electrical conversion efficiency, inclusive of shading loss that gives various spacing between front metal grid lines. In experiments with variation of spacing. It was verified that the wide spacing of grid fingers could increase the series resistance, also the narrow spacing of grid fingers also implies a grid with a higher density of grid fingers. The sunlight of incidence was more of reflection by grid fingers. In result, the short circuit current, which contribute to conversion efficiency was decreased, because maximum power input was reduced and increase the series resistance.