Fabrication Process of High Thermal Conductivity and Low CTE SiCp/Al Metal Matrix Composites for Electronic Packaging Applications (전자패키지용 고열전도도-저열팽창계수 SiCp/Al 금속복합재료의 제조공정)
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- Proceedings of the Korean Society For Composite Materials Conference
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- 1999.04a
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- pp.109-113
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- 1999