• Journal of Powder Materials
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• v.25 no.5
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• pp.375-378
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• 2018

Conductive and dielectric SiC are fabricated using electroless plating of Ni-Fe films on SiC chopped fibers to obtain lightweight and high-strength microwave absorbers. The electroless plating of Ni-Fe films is achieved using a two-step process of surface sensitizing and metal plating. The complex permeability and permittivity are measured for the composite specimens with the metalized SiC chopped fibers dispersed in a silicone rubber matrix. The original non-coated SiC fibers exhibit considerable dielectric losses. The complex permeability spectrum does not change significantly with the Ni-Fe coating. Moreover, dielectric constant is sensitively increased with Ni-Fe coating, owing to the increase of the space charge polarization. The improvements in absorption capability (lower reflection loss and small matching thickness) are evident with Ni-Fe coating on SiC fibers. For the composite SiC fibers coated with Ni-Fe thin films, a -35 dB reflection loss is predicted at 7.6 GHz with a matching thickness of 4 mm.

• Transactions on Electrical and Electronic Materials
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• v.13 no.2
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• pp.78-84
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• 2012

An in-situ optical monitoring method for real-time process monitoring of electrochemical copper deposition (CED) is presented. Process variables to be controlled in achieving desired process results are numerous in the CED process, and the importance of the chemical bath conditions cannot be overemphasized for a successful process. Conventional monitoring of the chemical solution for CED relies on the pH value of the solution, electrical voltage level for the reduction of metal cations, and gravity measurement by immersing sensors into a plating bath. We propose a nonintrusive optical monitoring technique using three types of optical sensors such as chromatic sensors and UV/VIS spectroscopy sensors as potential candidates as a feasible optical monitoring method. By monitoring the color of the plating solution in the bath, we revealed that optically acquired information is strongly related to the thickness of the deposited copper on the wafers, and that the chromatic information is inversely proportional to the ratio of $Cu$ (111) and {$Cu$ (111)+$Cu$ (200)}, which can used to measure the quality of the chemical solution for electrochemical copper deposition in advanced interconnection technology.

• Resources Recycling
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• v.13 no.2
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• pp.9-15
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• 2004

A large tons of spent iron oxide catalyst come from the Styrene Monomer(SM) production company. It is caused to pollute the land and underground water due to the high alkali contents in the catalyst by burying them in the landfill. In order to recycle the spent catalyst, a basic study on the recovery of chromium ion from metal plating wastewater with the spent catalyst was carried out. The iron oxide catalyst adsorbed physically $Cr^{+6}$ in the lower pH 3.0, that is the isoelectric point of the spent catalyst. It was found that the iron oxide catalyst reduced the $Cr^{+6}$ into Cr+3 by the oxidation of ferrous ion into ferric ion on the surface of catalyst, and precipitated as $Cr(OH)_3$ in the higher than pH 3.0. The $Cr^{+6}$ was recovered 2.0∼2.3g/L catalyst in the range of pH 0.5∼2.0, but it was recovered 1.5 g/L catalyst at pH 3.0 of wastewater. The recovery of Cr was increased as the higher concentration in the continuous process, but the flowrates were nearly affected on the Cr recovery.

• Journal of environmental and Sanitary engineering
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• v.15 no.1
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• pp.54-61
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• 2000

We studied the adsorption characteristics on the treatment process of heavy metal wastewater by using cuttle fish bones powder. When adding the 0.25% cuttle fish born powder in the heavy metal solution, $Fe^{3+}$ and $Pb^{2+}$ were high removed than other heavy metals as above 95%. In the solution which was adjusted to pH 5, 7 and 9, there was not observed the difference thing on the heavy metal removal rate. At test using plating wastewater treatment, adding 1%, 1.5% and 2% of the cuttle fish born powder, the heavy metal removal rate were as follows; Zn 12.5 - 37.5%, Mn 18.0 - 62.2%, Cd 36.8 -93.0%, Cu 51.4 - 97.4%, Cr 70.8 - 99.1%, Fe 87.2 - 99.3% and Pb 92.8 - 99.9%. When adding the 0.15% cuttle fish born powder and mixing for 20 minutes, the solution was happened the adsorption equability. Applied this results to the Freundlich＇s iso-thermal equation, we found the cuttle fish born＇s probability as a good adsorbent.

• Clean Technology
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• v.3 no.2
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• pp.57-73
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• 1997

Metal cleaning process is a technology which removes oil, dust and soil etc. on the surface of metal utilizing cleaning agents. These contaminants disturb the following processes such as plating and painting etc. if they are not removed. Thus, metal cleaning is typically an environmentally hazardous activity. Until recently, vapor degreasers as utilizing chlorinated solvents have been relatively cheap, extraordinarily versatile and waste disposal costs have been perceived as insignificant. Today, however, it is readily apparent that Industry's reliance upon chlorinated solvents as metal cleaners have resulted in a myriad of environmental, health and safety concerns. Therefore, this paper studies on a parameter and a sort of the alternative cleaning agents for the optimum cleaners. Also, a great deal of effort has been devoted to developing alternative metal cleaning technologies in advanced countries and some processes are being commercialized among them. We are going to consider alternative aqueous cleaning agents replacing organic chlorinated solvents and to pursue a domain application through a successful improvement case.

• Korean Journal of Materials Research
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• v.19 no.7
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• pp.349-355
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• 2009

Metal thin film patterns on a LTCC substrate, which was connected through inner via and metal paste for electrical signals, were formed by a screen printing process that used electric paste, such as silver and copper, in a conventional method. This method brought about many problems, such as non uniform thickness in printing, large line spaces, and non-clearance. As a result of these problems, it was very difficult to perform fine and high resolution for high frequency signals. In this study, the electric signal patterns were formed with the sputtered metal thin films (Ti, Cu) on an LTCC substrate that was coated with protective oxide layers, such as $TiO_2$ and $SiO_2$. These electric signal patterns' morphology, surface bonding strength, and effect on electro plating were also investigated. After putting a sold ball on the sputtered metal thin films, their adhesion strength on the LTCC substrate was also evaluated. The protective oxide layers were found to play important roles in creating a strong design for electric components and integrating circuit modules in high frequency ranges.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.6
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• pp.367-374
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• 2000

This paper presents a method to fabricate freestanding structures by (100) silicon anisotropic etching and nickel electroless plating. The electroless plating process is simpler than the electroplating, and provides good coating uniformity and improved mechanical properties. Furthermore, the (100) silicon anisotropic etching in KOH solution with being aligned to <100> direction provides vertical (100) sidewalls on etched (100) surface. In this paper, the effects of the nickel electroless plating condition on the properties of electroless plated metal structures are investigated to apply fabrication of micro structures and then various micro structures are fabricated by nickel electroless plating. And then, the structures are released by silicon anisotropic etching in KOH solution with a large gap between the structure and the substrate. The fabricated cantilever structures are $210\mum$. wide, $5\mum$. thick and $15\mum$. over the silicon substrate, and the comb structure has the comb electrodes which are $4\mum$. wide and $4.3\mum$. thick separated by$1\mum$. It is released by silicon anisotropic etching in KOH solution. The gap between the structure and the substrate is $2.5\mum$.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2006.11a
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• pp.119-123
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• 2006

The ionic-polymer-metal-composite actuators have the best merit for bio-mimetic locomotion because of their large bending performance. Especially, they have the advantage for mimicking a fish-like motion because IPMCs are useful to be actuated in water. So we have developed IPMC actuators with multiple electrodes for realization of biomimetic motion. Generally, the IPMC actuator has been fabricated in electroless plating technique, while it needs very long fabrication time and shows poor repeatability in the actuation performance owing to the variables in chemical fabrication process. Therefore, the novel fabrication methods were investigated by combining electroless plating and electroplating techniques capable of patterning precisely. On the whole, two different methods were compared and analyzed with similar thickness level of Platinum electrodes. Present results show that mixing chemical reduction and electroplating can be a promising candidate for electrode patterning.

• Journal of Surface Science and Engineering
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• v.32 no.3
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• pp.257-264
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• 1999

Thin reflective films are synthesized by using PVD methods with a bright metal of Al or Ag. For purposes of improving the reflectance and adhesion of such films particularly, substrate bias was applied during sputtering (namely, ion-plating) to enhance the deposition process with higher energy. And we succeeded in fabricating a quality silver film which possesses an adhesion of $85{\;}Kg/\textrm{cm}^2$ and a high reflectivity of more than 96%. Both of reflectivity and adhesion are better in case of bias sputtering as controlled than nonbias sputtering, particularly the bias of 50-100 V showed most effective. The microstructures of sample films were examined by using various equipments and the XRD spectrum in particular showed that <111> direction is the preferred growth orientation.

• Journal of Sensor Science and Technology
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• v.22 no.2
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• pp.130-135
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• 2013

This study proposed a noble process to fabricate TSV (Through Silicon Via) structure which has lower cost, shorter production time, and more simple fabrication process than plating method. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process. The via hole was $100{\mu}m$ in diameter and $400{\mu}m$ in depth. A dielectric layer of $SiO_2$ was formed by thermal oxidation on the front side wafer and via hole side wall. An adhesion layer of Ti and a seed layer of Au were deposited. Soldering process was applied to fill the via holes with solder paste and metal powder. When the solder paste was used as via hole metal line, sintering state and electrical properties were excellent. However, electrical connection was poor due to occurrence of many voids. In the case of metal powder, voids were reduced but sintering state and electrical properties were bad. We tried the via hole filling process by using mixing solder paste and metal powder. As a consequence, it was confirmed that mixing rate of solder paste (4) : metal powder (3) was excellent electrical characteristics.