• Title/Summary/Keyword: Metal Plating Process

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Optimum Parameter Values for A Metal Plating Process (금속도금공정에서의 최적 모수 값 결정)

  • Kim, Young-Jin;Hong, Sung-Hoon;Lee, Min-Koo;Kwon, Hyuck-Moo
    • Journal of Korean Institute of Industrial Engineers
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    • v.34 no.3
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    • pp.337-343
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    • 2008
  • The problem of determining the optimum metal plating thicknesses on the plane and curved surfaces of an electronic part is considered. A lower specification limit for the plating thickness is usually pre-specified. In most applications, the plating thickness on the curved surface is proportional to that on the plane surface. The proportion can be adjusted by adding chemical catalysts to the plating fluid. From the economic point of view, nonconforming items with a thickness smaller than the lower specification limit incur rejection costs, such as rework and scrap costs, while a thicker plating may incur an excessive material costs. In this article, an economic model is proposed for simultaneously determining the target plating thickness and the ratio of the plating thickness on the plane surface to that on the curved surface. An illustrative example demonstrates the applicability of the proposed model.

The Research of Ni/Cu Contact Using Light-induced Plating for Cryatalline Silicom Solar Cells (결정질 실리콘 태양전지에 적용될 Light-induced plating을 이용한 Ni/Cu 전극에 관한 연구)

  • Kim, Min-Jeong;Lee, Soo-Hong
    • 한국태양에너지학회:학술대회논문집
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    • 2009.11a
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    • pp.350-355
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    • 2009
  • The crysralline silicon solar cell where the solar cell market grows rapidly is occupying of about 85% or more high efficiency and low cost endeavors many crystalline solar cells. The fabricaion process of high efficiency crystalline silicon solar cells necessitate complicated fabrication processes and Ti/Pd/AG contact, This metal contacts have only been used in limited areas in spite of their good srability and low contact resistance because of expensive materials and process. Commercial solar cells with screen-printed solar cells formed by using Ag paste suffer from loe fill factor and high contact resistance and low aspect ratio. Ni and Cu metal contacts have been formed by using electroless plating and light-induced electro plating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on 0.2~0.6${\Omega}$ cm, $20{\times}20mm^2$, CZ(Czochralski) wafer.

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Analysis of the effect on the whisker growth as grain size of plating and base metal (Plating 및 Base metal의 Grain size에 따른 Whisker 성장 영향 분석)

  • Kim, Su-Jin;Chang, Mi-Soon;Kwack, Kae-Dal
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1337-1342
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    • 2008
  • The whisker grows at the plating of a lead frame so that it causes the serious problem like the short. To prove this case, many people have studied the cause and influence of the tin whisker growth. This study explains the grain size affects the growth of the whisker in the lead frame. By these studies about the whisker, the whisker growth is discovered by stresses generated by the intermetallic compound and CTE mismatch in both plating and base metal. The stresses or lattice defect generated in the plating process changes grain structure of plating. Consequently, these various stresses are stabilized by forming unspecified whiskers through lots of grain boundaries. Because the grain boundary is the path of the whisker growth, the smaller grain size exists, the more whiskers grow.

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Fabrication Process and Characterization of Sonic Polymer-Metal Composite Actuators by Electroless Plating of Platinum (백금의 무 전해 도금에 의한 이온성 고분자-금속 복합물 액추에이터의 제작 공정 및 특성 측정)

  • Cha, Seung-Eun;Park, Jeong-Ho;Lee, Seung-Gi
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.51 no.9
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    • pp.455-463
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    • 2002
  • Ionic Polymer metal composite(IPMC), one of new actuation materials of EAPs is fabricated by electroless plating of platinum on both sides of the perfluorosulfonic acid film or Nafion film and its electromechanical characteristics are investigated. The IPMC strip bends towards anode under electrical field. As the number of plating cycle increases, the distance between plated platinum electrodes on both sides of Nafion membrane decreases and also the displacement is almost inversely proportional to the number of plating. The displacement of IPMC strip depends on voltage magnitude and applied signal frequency and its maximum deformation is observed at a critical frequency, resonant frequency. Low pressure sandblasting is used for surface treatment of Nafion membrane and at 8 times of plating cycle produced actuator with high displacement performance. For more efficiency of fabricated IPMC, it is useful to add one or two surface developing step which is the second reduction process using hydrazine.

Review on Electroless Plating(I) (무전해도금(I))

  • Kim, Man;Kwon, Sik-Chol
    • Journal of Surface Science and Engineering
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    • v.19 no.3
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    • pp.121-127
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    • 1986
  • There are many plating methods already commercially employed in te surface technology. One of the plating methods is electroless (chemical) plating, which is deposited by auto-catalytic reduction of metallic ion with the reducing agent in the plating bath. And it has many advantages comparing with electrolytic plating in respect of properties of deposit, such as corrosion resistance, wear resistance, uniformity, hardness, adhesion and so on. So, electroless plating is the fatest growing process in metallization of plastic and electronic industry. The properties and numerous applications of electroless deposits are attracting more and more attention from finish specifies. Many metal finishers are considering set-up of new electroless line in their shops. This review will be beneficial to domestic metal finishers to understand the real status of present electroless plating technology. It will also provide some knowledge on the economic aspect of electroless plating for the commercial application of specific parts.

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Sand Casting Process Design for the Bush Parts of the Continuous Hot Zinc Plating Roll Applied to Wear-Resistant Alloy Cast Steel (내마모 합금주강 소재를 적용한 연속용융아연도금설비 Roll용 부쉬의 사형 주조공정 설계)

  • Park, Dong-Hwan;Yun, Jae-Jung;Hong, Jin-Tae;Kwon, Hyuk-Hong
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.16 no.4
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    • pp.104-112
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    • 2017
  • In the sand casting process, the flow of liquid metal affects the quality of casting products and their die life. To determine the optimal bush part design process, this study performed various analyses using commercial finite element analysis S/W. The simulation focused on the molten metal behaviors during the mold filling and solidification stages of sand casting. This study aims to develop methods to reduce the cost and increase the tool life of the continuous hot zinc plating roll.

Application of the electroless plating method to the fabrication of metallic bus electrodes of PDP

  • Oh, Young-Joo;Jeung, Won-Young
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.829-831
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    • 2003
  • In the present study, the electroless plating method was applied instead of the sputtering as a formation method of metallic bus electrodes. No additional blackening step is needed in this method since this process provides a metallic seed layer with black color by a single step. The parameters which affects color and morphology of the metallic seed layer in the electroless plating solution were investigated

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Micro patterning of conductor line by laser induced forward transfer(LIFT) (LIFT 방법에 의한 전도성 미세 패터닝 공정 연구)

  • 이제훈;한유희
    • Laser Solutions
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    • v.2 no.3
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    • pp.52-61
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    • 1999
  • The laser induced forward transfer(LIFT) technique employs a pulsed laser to transfer parts of a thin metal film from an optically transparent target onto an arbitrary substrate in close proximity to the metal film on the target. In this work, a two-step method, the combination of LIFT process, in which a Au film deposited on the $Al_2$O$_3$ substrate by Nd:YAG laser and subsequent Au electroless metal plating on the by LIFT process generated Au seed, was presented. The influence of laser parameters, wavelength, laser power, film thickness and overlap ratio of pulse tracks, on the shapes of deposit and conductor line after electroless plating is experimentally studied. As a results, the threshold power densities for ablation, deposition and metallization were determined and comparison of threshold value between the wave length 1064nm and the second harmonic generated 532nm. In odor to determine a possible application in the electronic industry, a smallest conduct spot size, line width and isolated line space were generated.

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Understanding and trends in plastic plating technology (플라스틱 도금 기술에 대한 이해와 동향)

  • Jiwang Noh;Ingyeong Bae;Hyunwoo Kim;Sunkyu Kim
    • Journal of Surface Science and Engineering
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    • v.57 no.4
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    • pp.225-233
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    • 2024
  • The plastic plating process refers to coating a thin metal film onto a plastic surface. This technique has become essential for replacing costly metal products while maintaining equivalent performance, making plastic plating a critical technology. This paper presents an overview of the methods and future prospects of plastic plating.

A Study on Applying an Electrolytic Plating to a Screen Printing (스크린 인쇄와 전해 도금의 응용에 관한 연구)

  • 강봉근
    • Journal of the Korean Graphic Arts Communication Society
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    • v.18 no.2
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    • pp.133-141
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    • 2000
  • Enhanced the value of badge good with the gold plating of emblem, sports pictogram, mascot in 2002 Asian Game and World Cup, applying the plating and coating technique to screen printing. In addition, tourist and characteristic goods were of great value and image of visual communication displayed outside. After the screen printing in the surface of stainless steel, it obtained the plate coloring of beautiful a black glossy with a black Ru plating. At the identical surface, it did that the electrodeposition coating process in order to making a conductor state of image areas and a nonconductor state of nonimage areas. After the electrodeposition process, it removed the printing ink of image areas with solvent. A manufacturing process, it removed the printing ink of image areas with solvent. A manufacturing process completed with copper, nickel and gold plating at bared metal surface.

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