• Title/Summary/Keyword: Metal Pattern

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Self-Assembling Adhesive Bonding by Using Fusible Alloy Paste for Microelectronics Packaging

  • Yasuda, Kiyokazu
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.3
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    • pp.53-57
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    • 2011
  • In the modern packaging technologies highly condensed metal interconnects are typically formed by highcost processes. These methods inevitably require the precise controls of mutually dependant process parameters, which usually cause the difficulty of the change in the layout design for interconnects of chip to-chip, or chip-to-substrate. In order to overcome these problems, the unique concept and methodology of self-assembly even in micro-meter scale were developed. In this report we focus on the factors which influenced the self-formed bumps by analyzing the phenomenon experimentally. In case of RMA flux, homogenous pattern was obtained in both plain surface and cross-section surface observation. By using RA flux, the phenomena were accelerated although the self-formtion results was inhomogenous. With ussage of moderate RA flux, reaction rate of the self-formation was accelerated with homogeneous pattern.

A Filling Analysis on Forging Process of Semi-Solid Aluminum Materials Considering Solidification Phenomena (응고현상을 고려한 반용융 알루미늄재료의 단조공정에 관한 충전해석)

  • 강충길;최진석;강동우
    • Transactions of Materials Processing
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    • v.5 no.3
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    • pp.239-255
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    • 1996
  • A new forming technology has been developed to fabricate near-net shape products using light metal. A semi-solid forming technology has some advantages compared with the conventional forming processes such as die casting squeeze casting and hot/cold forging. In this study the numerical analysis of semi-solid filling for a straight die shape and orifice die shape in gate pattern is studied on semi-solid materials(SSM) of solid fraction fs =30% in A356 aluminum alloy. The finite difference program of Navier-Stokes equation coupled with heat transfer and solidification has been developed to predict a filling pattern and the temperature distribution of SSM. The programdeveloped in this study gives die filling patterns of SSM and final solidifica-tion region.

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A Brief Overview of a Scale Independent Deformation Theory and Application to Diagnosis of Deformational Status of Solid-State Materials

  • Yoshida, Sanichiro
    • Journal of the Korean Society for Nondestructive Testing
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    • v.32 no.2
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    • pp.131-141
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    • 2012
  • A field theoretical approach to deformation and fracture of solid-state material is outlined, and its application to diagnosis of deformational status of metal specimens is discussed. Being based on a fundamental physical principle known as local symmetry, this approach is intrinsically scale independent, and capable of describing all stages of deformation on the same theoretical foundation. This capability enables us to derive criteria that can be used to diagnose transitions from the elastic to plastic regime, and the plastic to fracturing regime. For practical applications of these criteria, an optical interferometric technique known as electronic speckle-pattern interferometry is proved to be quite powerful; it is able to visualize the criteria as a whole image of the object on a real-time basis without numerical processing. It is demonstrated that this method is able to reveal loading hysteresis as well.

A Study on the Improvement of Formability of Embossing Structure (엠보싱 구조재의 성형성 향상에 관한 연구)

  • Kim H.J.;Jung D.W.;Choi D.S.;Jae T.J.;Park J.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1269-1272
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    • 2005
  • Sandwich structures, which are composed of thick core between two thin faces, are commonly used in many engineering applications because they combine high stiffness and strength with low weight. In this research, we have investigated the embossing configuration at the sheet metal shape through research with regard to the construction that the hardness and stiffness are excellent, and formability is advantage as inner structure. Through the FLD analysis according to the pattern changes, we have confirmed the forming possibility and variation of the aspect thickness. Also, we have fabricated the embossing press mold according to the pattern changes, and obtained the embossing inner structure the forming experiments.

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Nano-size Patterning with a High Transmission C-shaped Aperture (고 투과 C 형 개구를 이용한 나노 크기 패턴 구현)

  • Park, Sin-Jeung;Kim, Yong-Woo;Lee, Eung-Man;Hahn, Jae-Won
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.11
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    • pp.108-115
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    • 2007
  • We have designed a high transmission C-shaped aperture using finite differential time domain (FDTD) technique. The C-shaped aperture was fabricated in the aluminum thin film on a glass substrate using a focused ion beam (FIB) milling. Nano-size patterning was demonstrated with a vacuum contact device to keep tight contact between the Al mask and the photoresist. Using 405 nm laser, we recorded a 50 nm-size dot pattern on the photoresist with the aperture and analyzed the spot size dependent on the dose illuminated on the aperture.

A STUDY OF QUALITY MONITORING SYSTEM FOR MANUFACTURING PROCESS AUTOMATION DURING LASER TAILORED BLANK WELDING

  • Park, Young-Whan;Park, Hyunsung;Sehun Rhee
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.606-611
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    • 2002
  • Welding using lasers can be mass-produced in high speed. In the laser welding, performing real-time monitoring system of the welding quality is very important in enhancing the efficiency of welding. In this study, the plasma and molten metal which are generated during laser welding were measured using the UV sensor and IR sensors. The results of laser welding were classified into five categories such as optimal heat input, little low heat input, low heat input, partial joining due to gap mismatch, and nozzle deviation. Also, a system was formulated which uses the measured signals with a fuzzy pattern recognition method which is used to perform real-time evaluation of the welding quality and the defects which can occur in laser welding.

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Pattern Recognition of Dynamic Resistance and Real Time Quality Estimation (동저항 패턴 인식 및 실시간 품질 평가)

  • 조용준;이세헌
    • Proceedings of the KWS Conference
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    • 2000.04a
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    • pp.303-306
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    • 2000
  • Quality estimation of the weld has been one of the important issues in RSW which is a main process of the sheep metal fabrication in auto-body industry, It was well known that among the various welding process variables, dynamic resistance has a close relation with nugget formation. With this variable, it is possible to estimate the weld quality in real time. In this study, a new quality estimation algorithm is developed with the primary dynamic resistance measured at welding machine timer. For this, feature recognition method of Hopfield neural network is used. Primary resistance patterns are vectorized and classified with five patterns. The network trained by these patterns recognizes the dynamic resistance pattern and estimates the weld quality Because the process variable monitored at the primary circuit is used, it is possible to apply this system to real time application without any consideration of electrode wear or shunt effect.

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Real Time Quality Assurance with a Pattern Recognition algorithm during Resistance Spot Welding (패턴 인식 기법을 이용한 저항 점 용접의 실시간 품질 판단)

  • 조용준;이세헌
    • Journal of Welding and Joining
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    • v.18 no.3
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    • pp.114-121
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    • 2000
  • Since resistance spot welding has become one of the most popular sheet metal fabrication processes, a strong emphasis is being put on the quality of the welds. Throughout the years many quality estimation systems have been developed by many researchers to ensure weld quality. In this study, the process variables, which were monitored in the primary circuit of the welding machine, are used to estimate the weld quality with Hopfield neural network. The primary dynamic resistance is vectorized and stored as five patterns in the network. As the welding is done, the dynamic resistance patterns are recognized and the quality is estimated with the proposed method. Due to the primary process variables, it is possible to utilize this algorithms as an in-process real time quality monitoring system.

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Effect of Transition-Metal (Ni) on the Superconductor Y-Ba-Cu-O (Y-Ba-Ca-O 초전도체에서 천이금속(Ni)의 효과)

  • Han, Byoung-Sung
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.27 no.5
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    • pp.724-728
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    • 1990
  • The X-ray diffraction pattern, electrical resistance, density and critical temperature of a series of YBa2(Cu3-xNix)O7-\ulcornersamples (0\ulcorner\ulcorner.5) were investigated with the increase of the Ni content. The samples show a principal 1.2.3-like phase with well resolved orthorhombic peaks. The final pattern of the x=0.1 sample appears to be well reacted orthorhombic YBa2(Cu,Ni)3O7-\ulcornerwith minor impurities and an appreciable amorphous fraction. From the above results, we conclude that Ni does not play an important role for the superconductivity in the Y-Ba-Cu-O system.

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The Design of a Dielectric Rod Antenna Using Genetic Algorithm Optimization for Vessel's Collision Avoidance Applications

  • Kahng, Sung-Tek;Ju, Jeong-Ho
    • Journal of electromagnetic engineering and science
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    • v.7 no.3
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    • pp.129-133
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    • 2007
  • In this paper, we present the development of an antenna specialized for the maritime collision avoidance system. This antenna is configured as the dielectric rod partially embedded in the metal cavity to reduce the overall size, simultaneously assuring the mechanical sturdiness against the challenging oceanic weather conditions. More importantly, the design has been carefully done to meet the requirements on the radiation pattern(with the slope < 5 dB/deg in the elevation(E-plane), circular in the azimuth) suitable to receiving the reflected signals from the other objects on the sea. To find the optimal design parameters, the genetic algorithm has been used to meet the goals of the desired return loss and pattern. This design methodology is validated by the good agreement between the calculation and measurement.