• Clean Technology
• /
• v.11 no.2
• /
• pp.69-74
• /
• 2005

A metal ion detector with a submicron size electrode was fabricated by field-induced AFM oxidation. The square frame of the mesa pattern was functionalized by APTES for the metal ion detection, and the remaining portion was used as an electrode by the self-assembly of MPTMS for Au metal deposition. The conductance changed with the quantity of adsorbed copper ions, due to electron tunneling between the mobile and surface electrodes. The smaller electrode has a lower limit of detection due to the enhancement in electron tunneling through metal ions that are adsorbed between the conductive-tip (mobile) and the surface (fixed) electrode. This two-electrode system immobilized with different functional groups was successfully used in the selective adsorption and detection of target materials.

• The Journal of Korean Academy of Prosthodontics
• /
• v.36 no.2
• /
• pp.336-354
• /
• 1998

Traditionally, many kinds of mechanical bonding techniques were used for bonding resins to the surface of the metal alloys. If there is a seperation between resin and metal junction by stress accumulation and temperature change of oral cavity, the cracks or crazing may occur, accompanied by failure of resin bonding to metal. This study was designed to compare the shear bond strength of the type IV gold alloy and Cr-Co alloy surfaces treated with various methods and thermocycling. Universal Instron (Model 1000) and scanning electron microscope (JEOL, Japan) was used to record the shear bond strength of 5 groups. Forty specimens were made for each group ; group 1 was treated with sandblasting only, group 2 was coated with V-primer after sandblasting, group 3 was coated with Metal primer, group 4 wase coated with MR Bond and group 5 was coated with silane. After treated with various methods, thermocycling was done for half of the each group. The surfaces of failed pattern were observed with SEM. The results were as follows : 1. Shear bond strength of the group 1 was lower than that of another groups in type IV gold alloys and bond strength of the group 1, 2 were lower than that of group 3, 4, 5 in Cr-Co alloys. 2. Shear bond strength of the gold alloy with resin was higher than that of Cr-Co alloy when specimens were coated with V-primer. 3. Shear bond strength of the Co-Cr alloys with resin was higher than that of gold alloys when specimens were coated with Metal primer. 4. The bond strength of all specimens did not decreased significantly after thermocycling. 5. Adhesive failures were found in group 1 and Cr-Co alloy in group 2, but adhesive and cohesive failures were found in another groups.

• Transactions of Materials Processing
• /
• v.23 no.6
• /
• pp.363-368
• /
• 2014

Electromagnetic forming(EMF) is one of the high-speed forming methods, and has been used to deform metal sheets. The advantages of electromagnetic forming are reduced wrinkling due to non-contact characteristic and fine formability because of the high speed impact. In the current study, we suggest the application of electromagnetic forming to emboss pattern shapes using electromagnetic forces with only one forming coil and one punch. The high impact of the sheet at speeds of 100~300m/s produces significant coining pressure. In the current paper, electromagnetic forming was applied to Al 1100-O sheets; with thickness of 1.27mm and an area of $40mm{\times}40mm$. Using a single spiral coil, totally different types of patterns were created. Four different patterns were successfully produced on the aluminum sheet. The length and depth of the patterns were measured by three-dimensional scanning. Comparisons to the die shape showed good agreement. The test results confirm that emboss pattern forming by EMF using a single die can be used to replace the costly conventional method.

• Journal of the Korean Society of Costume
• /
• v.44
• /
• pp.235-247
• /
• 1999

The influences of Art nouveau and Art Deco are as follow: The first, in the side of silhouette, hourglass style and bell shaped skirt influence on mordern fashion chiefly and S-curve style was mollified. Empire style, hobble style in art deco age are all showed diversely, in these styles especially boyish style give an outstanding trasts to modern fashion. The second, the color of art deco, characterized by pastel in art nouveau's color tone, original color and black and gold was reflected on the textile design and showed diversely in the color fo modern fashion. The third, in the field of textile and pattern, flower and plant which was a motive of art nouveau style, organic curve and geometrical pattern and exotic motive was seperately used with motive in the pattern and design of mordern. Textile of goldish and silver tone, metal stuff, lace embroidery, fur, artifical flower, feather etc. showed up on the many parts of clothing. Like this Art Nouveau and Art style not only had a great effect on the costume but also decorations and formative arts.

• Journal of the Korean Society for Precision Engineering
• /
• v.22 no.2
• /
• pp.38-45
• /
• 2005

Chemical mechanical polishing(CMP) has been widely accepted for the planarization of multi-layer structures in semiconductor fabrication. But a variety of defects such as abrasive contamination, scratch, dishing, erosion and corrosion are occurred during CMP. Especially, dishing and erosion defects increase the metal resistance because they decrease the interconnect section area, and ultimately reduce the lift time of the semiconductor. Due to this reason dishing and erosion must be prohibited. The pattern density and size in chip have a significant influence on dishing and erosion occurred by over-polishing. The fixed abrasive pad(FAP) was applied and tested to reduce dishing and erosion in this paper. The abrasive concentration decrease of FAP results in advanced pattern selectivity which can lead the uniform removal in chip and declining over-polishing. Consequently, reduced dishing and erosion was observed in CMP of tungsten pattern wafer with proposed FAP and chemicals.

• The Journal of Advanced Prosthodontics
• /
• v.1 no.3
• /
• pp.129-135
• /
• 2009

STATEMENT OF PROBLEM. Zirconia-based restorations have the common technical complication of delamination, or porcelain chipping, from the zirconia core. Thus the shear bond strength between the zirconia core and the veneering porcelain requires investigation in order to facilitate the material's clinical use. PURPOSE. The purpose of this study was to evaluate the bonding strength of the porcelain veneer to the zirconia core and to other various metal alloys (high noble metal alloy and base metal alloy). MATERIAL AND METHODS. 15 rectangular ($4\times4\times9mm$) specimens each of zirconia (Cercon), base metal alloy (Tillite), high noble metal alloy (Degudent H) were fabricated for the shear bond strength test. The veneering porcelain recommended by the manufacturer for each type of material was fired to the core in thickness of 3mm. After firing, the specimens were embedded in the PTFE mold, placed on a mounting jig, and subjected to shear force in a universal testing machine. Load was applied at a crosshead speed of 0.5mm/min until fracture. The average shear strength (MPa) was analyzed with the oneway ANOVA and the Tukey's test ($\alpha$= .05). The fractured specimens were examined using SEM and EDX to determine the failure pattern. RESULTS. The mean shear strength ($\pm\;SD$) in MPa was 25.43 ($\pm\;3.12$) in the zirconia group, 35.87 ($\pm\;4.23$) in the base metal group, 38.00 ($\pm\;5.23$) in the high noble metal group. The ANOVA showed a significant difference among groups, and the Tukey' s test presented a significant difference between the zirconia group and the metal group. Microscopic examination showed that the failure primarily occurred near the interface with the residual veneering porcelain remaining on the core. CONCLUSION. There was a significant difference between the metal ceramic and zirconia ceramic group in shear bond strength. There was no significant difference between the base metal alloy and the high noble metal alloy.

• Journal of Fashion Business
• /
• v.22 no.1
• /
• pp.100-113
• /
• 2018

From the late 17th to the early 18th century, Europeans were strongly intrigued by products from the East. Therefore, several countries like England, France, and Netherlands formed the 'East India Company' to pursue trade. First, European markets rapidly responded to this desire for exoticism by importing goods; then, they produced imitation Oriental goods. Finally, they made stylistically advanced exotic merchandise from the perspectives of European. In terms of the textile industry, this trend was expressed in the pattern design of silk, or the so called 'bizarre silk.' In this paper, bizarre silk patterns were scrutinized based on a digital archive of museums, catalogues of museums, portal sites, and the literature. The bizarre silk patterns were analyzed then classified into six categories: pseudo-Oriental plant pattern, pattern mingled with architectural motifs, pattern of juxtaposed with Oriental goods, abstract pattern, exuberant pattern with metal threads, and semi-naturalistic pattern. These patterns were characterized according to the following features: strangely large exotic floral patterns were undulating and asymmetrical; exotic foliage and flowers were sometimes mixed with architectural motifs or Oriental goods to easily show the Oriental influence; motifs of bizarre silk patterns were abstractly stylized; bizarre silk patterns became luxurious once more like the Baroque period; finally, floral patterns became more natural, and still exotic motifs remained in the background to maintain the bizarre silk features. These bizarre silk patterns evolved from the viewpoints of Europeans through acceptance stage, compound stage, and confluent stage.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.2
• /
• pp.65-70
• /
• 2023

Nanoimprint lithography (NIL) has attracted much attention due to its process simplicity, excellent patternability, process scalability, high productivity, and low processing cost for pattern formation. However, the pattern size that can be implemented on metal materials through conventional NIL technologies is generally limited to the micro level. Here, we introduce a novel hard imprint lithography method, extreme-pressure imprint lithography (EPIL), for the direct nano-to-microscale pattern formation on the surfaces of metal substrates with various thicknesses. The EPIL process allows reliable nanoscopic patterning on diverse surfaces, such as polymers, metals, and ceramics, without the use of ultraviolet (UV) light, laser, imprint resist, or electrical pulse. Micro/nano molds fabricated by laser micromachining and conventional photolithography are utilized for the nanopatterning of Al substrates through precise plastic deformation by applying high load or pressure at room temperature. We demonstrate micro/nanoscale pattern formation on the Al substrates with various thicknesses from 20 ㎛ to 100 mm. Moreover, we also show how to obtain controllable pattern structures on the surface of metallic materials via the versatile EPIL technique. We expect that this imprint lithography-based new approach will be applied to other emerging nanofabrication methods for various device applications with complex geometries on the surface of metallic materials.

• Journal of the Korean Society of Radiology
• /
• v.17 no.7
• /
• pp.1115-1122
• /
• 2023

This study aimed to present reasonable reception bandwidth application standards for the purpose of suppressing metal objects during MRI examinations. For this purpose, T2 contrast images were acquired using high-speed spin echo technology on a phantom made of screws for spinal surgery, and metal objects were detected. In addition, images were obtained by increasing the reception bandwidth from 100 Hz/PX to 800 Hz/PX by 100 Hz/PX. The metal artifacts were determined as the sum of the areas of the signal attenuation area and the signal accumulation area. In addition, Pearson correlation analysis was performed to analyze the pattern of metal artifacts according to imaging variables. As a result, the signal accumulation area did not change significantly as the reception bandwidth increased (p>0.05), but the signal loss area and the area of metal artifacts decreased as the reception bandwidth increased (p<0.05). Interestingly, the area of metal objects decreased to a maximum in the section where the reception bandwidth was increased from 100 Hz/PX to 200 Hz/PX, consistent with the section where the echo spacing was reduced to a maximum due to the increase in reception bandwidth. In addition, the correlation analysis results also showed that the eco spacing was more related to the signal attenuation area and the area of metal objects than to the reception bandwidth. Therefore, if the reception bandwidth is increased for the purpose of reducing metal objects, it is reasonable to set it based on a value that minimizes the echo spacing in consideration of image quality factors.

• Journal of the Korean Society for Precision Engineering
• /
• v.31 no.11
• /
• pp.969-974
• /
• 2014

Previously fabricated electronic devices were used for vacuum manufacturing processes such as conventional semiconductor manufacturing. However, they are difficult to apply to continuous processes such as roll-to-roll printing, which results in very high device manufacturing and processing costs. Therefore, many developers have been interested in applying continuous processes to contact printing or noncontact printing technologies and they proposed various continuous printing techniques instead of conventional batch coating. In this paper, we proposed improved gravure offset printing process as one of the contact printing technique. We used etching pattern geometry with soft core blanket roll for printing of ultra fine line below the 10um.Using this technique we obtained flexible metal grid mesh film as transparent conductive film.