• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.491-494
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• 1999

We have examined the electrical properties of arachidic acid Langmuir (L) films by using a displacement current measuring technique with pressure stimulation. We give pressure stimulation into organic thin films and detect the Induced displacement current. The structure of manufactured device is Au/arachidic acid/Al, the number of accumulated layers are 17, 19 and 21. Also, we then examined of the MIM device by means of I-V The I-V characteristic of the device is measured from 0 to +1[V]. The insulation property of a thin film is better as the distance between electrodes is larger.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.1-8
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• 2024

Bonding wires are composed of conductive metals of Au, Ag & Cu with excellent electrical conductivities for transmitting power and signals to wafer chips. Wire metals do not provide electrical insulation, adhesion promoter and corrosion passivation. Adhesion between metal wires is extremely weak, which is responsible for wire cut failures during thermal cycling. Organic coating for electrical insulation does not satisfy bondability and manufacturability, and it is complex to apply very thin organic coating on metal wires. Automotive packages require enhanced reliability of packages under harsh conditions. LED and power packages are susceptible to wire cut failures. Contrary to conventional OCB behaviors, forming gas was not required for free air ball formation for both Ag and Pd-coated Cu wires with Al₂O₃ passivation.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.16 no.5
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• pp.29-37
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• 2002

This paper presents the diagnostic method for fault prevention in metal clad switchgear(MCS) through comparison of signals before and after detecting the partial discharge using electromagnetic detection technique. Electromagnetic waves detected by antennas of the inside and outside of MCS are analyzed and compared by frequency spectrum analysis method which can estimate an insulation abnormality and normality of MCS. As a result of the experiment by the proposed method, we can detect the insulation abnormality as partial discharge in MCS and these results can be applied to preventive diagnosis of MCS.

• Journal of the Korean Magnetics Society
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• v.17 no.6
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• pp.226-231
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• 2007

High frequency loss property of nanocrystalline amorphous ribbon with a high resistivity insulation layer of $TiO_2$ and $SiO_2$ was studied. The insulation layer was fabricated by sol-gel method using dip-coating. The optimum composition ratio of metal alkoxide and slurry for fabrication of insulation layer was established and insulation layer with high adhesion was coated on the nanocrystalline amorphous ribbon. Frequency loss of magnetic core material manufactured on nanocrystalline amorphous ribbon with the surface insulation layer decreased over 40 % compared with that of magnetic core material without surface insulation layer. The insertion loss of an inductive coupler, which was prepared by using magnetic core material coated insulation layer, decreased due to reduction of frequency loss for magnetic core material and insertion loss decreased in proportion to frequency.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.226-229
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• 1999

Epoxy compound has been used as insulation material in electrical equipment for a long time because of its excellent electrical, mechanical and chemical properties. Nowdays, becoming higher voltage system, the properties of interface between epoxy and metal insert become more important. The breakdown voltage of epoxy compound for electric material is variable according to the surface roughness of metal insert. Generally, with metal insert sanding, the adhesion strength is enhanced and the breakdown strength is reduced. But in this study, we knew that the adhesion strength became enhanced but the breakdown strength didn\`t reduced with metal insert sanding. So in this study sanding. So in this study, we suggest the optimum interface condition by adjusting the surface roughness.

• Journal of the Korea Institute of Military Science and Technology
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• v.21 no.4
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• pp.464-470
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• 2018

A development of one-dimensional thermal analysis tool is performed to estimate the thickness of cork insulation for flight vehicle. In the calculation of cork temperature, the cork density model, heat of ablation and pyrolysis gas enthalpy model were applied. The calculation for the two-layer model of cork and metal was performed by the tool and compared with the experimental data. The results for the two aerodynamic heating conditions were 17 % and -12 % different from the experimental data, respectively. The effect of mechanical ablation not included in the calculation can be expected as the cause of the difference. The temperature-density curve of cork which adjusted by experimental data was also presented.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.2
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• pp.68-73
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• 2002

In compared with air insulated switchgear, GIS has a high efficiency and confidence. Insulation method using $SF_6$ gas has a very excellent insulation characteristic for high voltage equipment but has a characteristic that insulation heredity is changed for internal unequal electric field. So analysis of time varying electromagnetic field in GIS is very important for structure design and trouble diagnosis process. In compared with established method, the SNM(Spatial Network Method) in this Paper can observe variation of electromagnetic field with real time and get result very similar to measurement. In order to Know variation of electromagnetic field distribution in fast moving particle, we make used of SNM.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.207-208
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• 2007

Epoxy resin insulators show a lot of advantages for electrical power apparatus. Because epoxy resin provide electrical and mechanical characteristic which is excellent, it is desirable to apply epoxy resin as a spacer and post insulation in Gas Insulated Switchgear (GIS). In this study, we have investigated the influence of surface electric field attached particle contaminated spacer surfaces under SF6 gas. Also, we performed analysis of electric field. As a result, when the particle was attached on spacer, we found out a surface electric field of characteristics.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.39-46
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• 2017

This paper presents the fabrication of ceramic insulation layer on metallic heat spreading substrate, i.e. an insulated metal substrate, for planar type heater. Aluminum alloy substrate is preferred as a heat spreading panel due to its high thermal conductivity, machinability and the light weight for the planar type heater which is used at the thermal treatment process of semiconductor device and display component manufacturing. An insulating layer made of ceramic dielectric film that is stable at high temperature has to be coated on the metallic substrate to form a heating element circuit. Two technical issues are raised at the forming of ceramic insulation layer on the metallic substrate; one is delamination and crack between metal and ceramic interface due to their large differences in thermal expansion coefficient, and the other is electrical breakdown due to intrinsic weakness in dielectric or structural defects. In this work, to overcome those problem, selected metal oxide buffer layers were introduced between metal and ceramic layer for mechanical matching, enhancing the adhesion strength, and multi-coating method was applied to improve the film quality and the dielectric breakdown property.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.