• Proceedings of the Korean Radioactive Waste Society Conference
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• 2004.06a
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• pp.337-337
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• 2004

As one of researches for the P ＆ T purposes, a basic experiment on the recovery of actinide elements from the mixture with rare earth elements by means of electrorefining using a liquid cadmium cathode in the LiCl-KC1 eutectic melt was carried out. In order to examine the behaviors of electrodeposition of metal ions on a liquid electrode, recovery experiments of rare earth metals resulting from forming electrodeposits were performed by a galvanostatic electrolysis method at various current densities. A cyclic voltammetric technique was applied to determine reduction-oxidation potential of each metal element in the melt and to detect the changes of the multi component melt composition for on-line monitoring. Also, a collaboration study with RIAR was completed to test the preliminary feasibility on a recovery of actinide elements from the mixture with rare earth elements using a liquid cadmium cathode and actinide metals. Experimental results showed that the ratio of actinides to rare earths, 9: 0.5∼1 led to the rare earth content of about 5∼10 wt% in the deposit.

• Journal of the Korean institute of surface engineering
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• v.55 no.3
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• pp.180-186
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• 2022

The production of hydrogen via water electrolysis (i.e., green hydrogen) using renewable energy is key to the development of a sustainable society. However, most current electrocatalysts are based on expensive precious metals and require the use of highly purified water in the electrolyte. We demonstrated the preparation of a non-precious metal catalyst based on CuCo₂O₄ (CCO) via simple electrodeposition. Further, an optimization process for electrodeposition potential, solution concentration and electrodeposition method was develop for a catalyst-substrate integrated electrode, which indicated the highly electrocatalytic performance of the material in electrochemical tests and when applied to an anion exchange membrane water electrolyzer.

• Resources Recycling
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• v.25 no.2
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• pp.25-32
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• 2016

A electrodeposion behavior of tin was tested to recovery of tin metal from sulfate solution using a newly designed cyclone type electrolyzer. Parameters, such as flow rate, current density, tin and sulfuric acid concentration in the electrolyte were investigated. From the experimental results, a powered tin metal below $100{\mu}m$ can be obtained. As the increase of flow rate, current density and sulfuric acid concentration in the electrolyte, electrodeposition ratio of tin and current efficiency were increased. The electrodeposition ratio of tin was increased with the decrease of tin concentration in the electrolyte, but the current efficiency was decreased.

• Applied Chemistry for Engineering
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• v.16 no.2
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• pp.250-256
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• 2005

Coating appearance is the most important problem in automotive industry. To increase the coating appearance quality, the corrosion resistance and the coating adhesion on metal substrates must be basically solved. The phosphating film made by the pretreatment of metal substrate is important factor to increase the coating adhesion. During the cathodic electrodeposition, the pH at the cathode surface increases up to about 12. In such a highly alkaline condition, the dissolution of metal substrate and phosphate film occurs. These phenomena result in the decrease of the bonding strength between the phosphating film and the substrate. Generally, the structure of zinc phosphating film is hopeite or phosphophyllite. It has been known that the phosphophyllite film contains better corrosion resistance and paint adhesion for hot water immersion test because of the decrease of dissolving amount of both metal substrate and phosphating film during the cathodic electrodeposition. It is found that the addition of Ni and Mn composition increase P-ratio and then can improve the paint adhesion on metal surface and the corrosion resistance.

• Journal of Electrochemical Science and Technology
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• v.5 no.4
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• pp.115-127
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• 2014

Cd-Pb thin films were electrodeposited from a diluted chloride solution using stainless steel rotating disc electrode. The linear sweep voltammograms of the single metallic ions show that electrodeposition of these ions was mass transfer control due to the plateau observed for different rotations at concentration (50 and 200 ppm). The voltammograms of binary system elucidate that electrodeposition process always start at cathodic potential located between the potential of individual metals. Currents transients measurements, anodic linear sweep voltammetry (ALSV) and atomic force microscopy (AFM) were used to characterize the electrocryatalization process and morphology of thin films. ALSV profiles show a differentiation for the dissolution process of individual metals and binary system. Two peaks of dissolution Cd-Pb film were observed for the binary system with different metal ion concentration ratios. The model of Scharifker and Hills was used to analyze the current transients and it revealed that Cd-Pb electrocrystalization processes at low concentration is governed by three-dimensional progressive nucleation controlled by diffusion, while at higher concentration starts as a progressive nucleation then switch to instantaneous nucleation process. AFM images reveal that Cd-Pb film electrodeposited at low concentration is more roughness than Cd-Pb film electrodeposited at high concentrated solution.

• Journal of the Korean institute of surface engineering
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• v.55 no.6
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• pp.342-352
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• 2022

Purine catabolite screening enables reliable diagnosis of certain diseases. In this regard, the development of a facile detection strategy with high sensitivity and selectivity is demanded for point-of-care applications. In this work, the simultaneous detection of uric acid (UA), xanthine (XA), and hypoxanthine (HX) was carried out as model purine catabolites by surface-enhanced Raman Spectroscopy (SERS). The detection assay was conducted by employing high-aspect ratio Au nanopillar substrates coupled with in-situ Au electrodeposition on the substrates. The additional modification of the Au nanopillar substrates via electrodeposition was found to be an effective method to encapsulate molecules in solution into nanogaps of growing Au films that increase metal-molecule contact and improve substrate's sensitivity and selectivity. In complex solutions, the approach facilitated ternary identification of UA, XA, and HX down to concentration limits of 4.33 𝜇M, 0.71 𝜇M, and 0.22 𝜇M, respectively, which are comparable to their existing levels in normal human physiology. These results demonstrate that the proposed platform is reliable for practical point-of-care analysis of biofluids where solution matrix effects greatly reduce selectivity and sensitivity for rapid on-site disease diagnosis.

• Korean Journal of Materials Research
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• v.18 no.3
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• pp.163-168
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• 2008

The morphology of three-dimensional (3D) cross-linked electrodeposits of copper and tin was investigated as a function of the content of metal sulfate and acetic acid in a deposition bath. The composition of copper sulfate had little effect on the overall copper network structure, whereas that of tin sulfate produced significant differences in the tin network structure. The effect of the metal sulfate content on the copper and tin network is discussed in terms of whether or not hydrogen evolution occurs on electrodeposits. In addition, the hydrophobic additive, i.e., acetic acid, which suppresses the coalescence of evolved hydrogen bubbles and thereby makes the pore size controllable, proved to be detrimental to the formation of a well-defined network structure. This led to a non-uniform or discontinuous copper network. This implies that acetic acid critically retards the electrodeposition of copper.

• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.686-694
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• 1999

Insoluble anodes of the Ta/Ir mixed metal oxide for electrodeposition of Ni-W alloy in ammoniacal citrate bath were prepared by thermal decomposition method. Ti plate was etched in boiling oxalic acid solution and coated with ethanol solution of $TaCl_{5}$ and $IrCl_4$ mixed in a fixed ratio, followed by drying and treating at various temperatures. The coating layer of these insoluble anode was characterized by SEM, EDX, XRD and DSC. The decomposition rate of citric acid in plating bath was determined by measuring the $CO_2$ gas evolved at the anodes with Gas Chromatography. Evolution of $CO_2$ gas from Ta/Ir oxide anodes decreased about 5% compared with that of Pt. The $CO_2$ gas evolution was increased with the amount of Ir-oxide in the coatings. The coatings which have more than 40% ratio of Ta content and heat-treated at the temperature higher than $400^{\circ}C$ showed better efficiency

• Journal of the Korean Graphic Arts Communication Society
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• v.18 no.2
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• pp.133-141
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• 2000

Enhanced the value of badge good with the gold plating of emblem, sports pictogram, mascot in 2002 Asian Game and World Cup, applying the plating and coating technique to screen printing. In addition, tourist and characteristic goods were of great value and image of visual communication displayed outside. After the screen printing in the surface of stainless steel, it obtained the plate coloring of beautiful a black glossy with a black Ru plating. At the identical surface, it did that the electrodeposition coating process in order to making a conductor state of image areas and a nonconductor state of nonimage areas. After the electrodeposition process, it removed the printing ink of image areas with solvent. A manufacturing process, it removed the printing ink of image areas with solvent. A manufacturing process completed with copper, nickel and gold plating at bared metal surface.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.2
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• pp.38-43
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• 2019

Electrochemical etching is a popular process to apply metal patterning in various industries. In this study, the electrochemical etching using a patterned copper layer was proposed to fabricate multilayered structures. The process consists of electrodeposition, laser patterning, and electrochemical etching, and a repetition of this process enables the production of multilayered structures. In the fabrication of a multilayered structure, an etch factor that reflects the etched depth and pattern size should be considered. Hence, the etch factor in the electrochemical etching process using the copper layer was calculated. After the repetition process of electrochemical etching using copper layers, the surface characteristics of the workpiece were analyzed by EDS analysis and surface profilometer. As a result, multilayered structures with various shapes were successfully fabricated via electrochemical etching using copper layers.