• Title/Summary/Keyword: Metal (Ag) layer

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Jangdo(Small Ornamental Knives) manufacturing process and restoration research using Odong Inlay application (오동상감(烏銅象嵌)기법을 활용한 장도(粧刀)의 제작기술 및 복원연구)

  • Yun, Yong Hyun;Cho, Nam Chul;Jeong, Yeong Sang;Jang, Chu Nam
    • Korean Journal of Heritage: History & Science
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    • v.49 no.2
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    • pp.172-189
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    • 2016
  • In this research, literature research on the Odong material, mixture ratio, casting method and casting facility was conducted on contemporary documents, such as Cheongong Geamul. Also, a long sword was produced using the Odong inlay technique. The sword reproduction steps were as follows; Odong alloying, silver soldering alloying, Odong plate and Silver plate production, hilt and sheath production, metal frame and decorative elements, such as a Dugup (metal frame), production, Odong inlay assembly and final assembly. For the Odong alloy production, the mixture ratio of the true Odong, which has copper and gold ratio of 20:1, was used. This is traditional ratio for high quality product according to $17^{th}$ century metallurgy instruction manual. The silver soldering alloy was produced with silver and brass(Cu 7 : Zn 3) ratio of 5:1 for inlay purpose and 5:2 ratio for simple welding purpose. The true Odong alloy laminated with silver plate was used to produce hilt and sheath. The alloy went through annealing and forging steps to make it into 0.6 mm thick plate and its backing layer, which is a silver plate, had the matching thickness. After the two plates were adhered, the laminated plate went through annealing, forging, engraving, silver inlaying, shaping, silver welding, finishing and polishing steps. During the Odong colouring process, its red surface turns black by induced corrosion and different hues can be achieved depending on its quality. To accomplish the silver inlay Odong techniques, a Hanji saturated with thirty day old urine is wrapped around a hilt and sheath material, then it is left at warm room temperature for two to three hours. The Odong's surface will turn black when silver inlay remains unchanged. Various scientific analysis were conducted to study composition of recreated Odong panel, silver soldering, silver plate and the colouring agent on Odong's surface. The recreated Odong had average out at Cu 95.57 wt% Au 4.16wt% and Cu 98.04 wt% Au 1.95wt%, when documented ratio in the old record is Cu 95wt% and Au 5wt%. The recreated Odong was prone to surface breakage during manufacturing process unlike material made with composition ratio written in the old record. On the silver plate of the silver and Odong laminate, 100wt% Ag was detected and between the two layers Cu, Ag and Au were detected. This proves that the adhesion between the two layers was successfully achieved. The silver soldering had varied composition of Ag depending on the location. This shows uneven composition of the silver welding. A large quantities of S, that was not initially present, was detected on the surface of the black Odong. This indicates that presence of S has influence on Odong colour. Additional study on the chromaticity, additional chemical compounds and its restoration are needed for the further understanding of the origin of Odong colour. The result of Odong alloy testing and recreation, Odong silver inlay long sword production, scientific analysis of the Odong black colouring agent will form an important foundation of knowledge for conservation of Odong artifact.

Drop reliability evaluation of Sn-3.0Ag-0.5Cu solder joint with OSP and ENIG surface finishes (OSP.ENIG 표면 처리된 기판과 Sn-3.0Ag-0.5Cu 솔더 접합부의 낙하충격 신뢰성 평가)

  • Ha, Sang-Ok;Ha, Sang-Su;Lee, Jong-Bum;Yoon, Jeong-Won;Park, Jai-Hyun;Chu, Yong-Chul;Lee, Jun-Hee;Kim, Sung-Jin;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.1
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    • pp.33-38
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    • 2009
  • The use of portable devices has created the need for new reliability criterion of drop impact tests because of the tendency to accidentally drop in the use of these devices. The effects of different PCB surface finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) and high temperature storage (HTS) test on the drop reliability were studied. Various drop test conditions were used to evaluate a drop reliability of assemblies to endure such impact and shock load. In the case of the as-reflowed samples (no HTS test), the SAC/OSP boards exhibited a better drop impact reliability than that of SAC/ENIG. However, the reverse was true if HTS test is performed. In addition, significant decrease of drop reliability was observed for both SAC/ENIG and SAC/OSP assemblies after HTS test. It was also observed that the thickness of intermetallic compound layer do play an important role in the brittle fracture of drop test.

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Brazing characteristics of $ZrO_2$ and Ti-6Al-4V brazed joints with increasing temperature (브레이징 온도 변화에 따른 $ZrO_2$와 Ti-6Al-4V의 접합 특성)

  • Kee, Se-Ho;Park, Sang-Yoon;Heo, Young-Ku;Jung, Jae-Pil;Kim, Won-Joong
    • The Journal of Korean Academy of Prosthodontics
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    • v.50 no.3
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    • pp.169-175
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    • 2012
  • Purpose: In this study, brazing characteristics of $ZrO_2$ and Ti-6Al-4V brazed joints with increasing temperature were investigated. Materials and methods: The sample size of the $ZrO_2$ was $3mm{\times}3mm{\times}3mm$ (thickness), and Ti-6Al-4V was $10mm(diameter){\times}5mm(thickness)$. The filler metal consisted of Ag-Cu-Sn-Ti was prepared in powder form. The brazing sample was heated in a vacuum furnace under $5{\times}10^{-6}$ torr atmosphere, while the brazing temperature was changed from 700 to $800^{\circ}C$ for 30 min. Results: The experimental results shows that brazed joint of $ZrO_2$ and Ti-6Al-4V occurred at $700-800^{\circ}C$. Brazed joint consisted of Ag-rich matrix and Cu-rich phase. A Cu-Ti intermetallic compounds and a Ti-Sn-Cu-Ag alloy were produced along the Ti-6Al-4V bonded interface. Thickness of the reacted layer along the Ti-6Al-4V bonded interface was increased with brazing temperature. Defect ratios of $ZrO_2$ and Ti-6Al-4V bonded interfaces decreased with brazing temperature. Conclusion: Thickness and defect ratio of brazed joints were decreased with increasing temperature. Zirconia was not wetting with filler metal, because the reaction between $ZrO_2$ and Ti did not occur enough.

A study on the fabrication of heatable glass using conductive metal thin film on Low-e glass (로이유리의 전도성 금속박막을 이용한 발열유리 제작에 관한 연구)

  • Oh, Chaegon
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.1
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    • pp.105-112
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    • 2018
  • This paper proposes a method for fabricating heatable glass using the conduction characteristics of metal thin films deposited on the surface of Low-e(Low emissivity) glass. The heating value of Low-e glass depends on the Joule heat caused by Low-e glass sheet resistance. Hence, its prediction and design are possible by measuring the sheet resistance of the material. In this study, silver electrodes were placed at 50 mm intervals on a soft Low-e glass sample with a low emissivity layer of 11 nm. This study measured the sheet resistance using a 4-point probe, predicted the power consumption and heating value of the Low-e glass, and confirmed the heating performance through fabrication and experience. There are two conventional methods for manufacturing heatable glass. One is a method of inserting nichrome heating wire into normal glass, and the other is a method of depositing a conductive transparent thin film on normal glass. The method of inserting nichrome heating wire is excellent in terms of the heating performance, but it damages the transparency of the glass. The method for depositing a conductive transparent thin film is good in terms of transparency, but its practicality is low because of its complicated process. This paper proposes a method for manufacturing heatable glass with the desired heating performance using Low-e glass, which is used mainly to improve the insulation performance of a building. That is by emitting a laser beam to the conductive metal film coated on the entire surface of the Low-e glass. The proposed method is superior in terms of transparency to the conventional method of inserting nichrome heating wire, and the manufacturing process is simpler than the method of depositing a conductive transparent thin film. In addition, the heat characteristics were compared according to the patterning of the surface thin film of the Low-e glass by an emitting laser and the laser output conditions suitable for Low-e glass.

The Solvent Extraction of Univalent Cation Picrates by New Podands (새로운 포단드에 의한 피크린산 일가 양이온 염의 용매추출)

  • Jung, Jong Hwa;Cho, Sung Bae;Kim, Jineun;Kim, Jae Sang;Lee, Shim Sung
    • Analytical Science and Technology
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    • v.6 no.1
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    • pp.29-37
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    • 1993
  • Some new podands containing phenyl(B), benzyl(Bz), pyridine(Py), quinoline(Q) and naphthalene(Np) as end-groups, and oxygen(O) and sulfur(S) in ether chains as donor atoms have been synthesized. The univalent cation binding characteristics of these podands have been studied by NMR titration and solvent extraction. By NMR titration we have found that the most of podands form 1:1 complexes with $Ag^+$ ion. Especially, the substituted sulfur atoms in ether chains show the effects to enhance the stabilities. We also carried out the extractions of univalent cation picrates including alkaline metal, $Ag^+$, $Tl^+$ and $NH_4{^-}$ ions from aqueous to chloroform layer by using these podands. We found that the extractabilities of $Ag^+$ ion with the quinoline-containing podands such as, $Q_2O_4$, $Q_2O_5$ and $BQO_5$ were 86.8, 86.6 and 48.0% respectively, but the naphthalene-containing podands such as, $Np_2O_4$ and $Np_2O_5$ extracted quite small amount. Otherwise, in cases of $Bz_2O_3S_2$(89.4%), $B_2O_2S_2$(96.8%), $B_2O_3S_2$(58.9%), $Py_2O_2S_2$(58.8%), $Py_2O_3S_2$(42.1%), and $B_2O_4S$(15.0%), interestingly, $Bz_2O_3S_2$ which have sulfur atoms and benzyl groups showed the highest extraction selectivity for $Ag^+$ ion. This result seems due to not only the strong interaction of $Ag^+$ ion with sulfur donors according to the HSAB theory, but also the effective ${\pi}-{\pi}$ stacking interaction between two aromatic end-groups which is enhanced by the flexible methylene spacing group in benzyl groups instead of phenyl groups. The extraction coefficients gave the similar tendency as the extractabilities and the stabilities. From these results, it could be concluded that the predominant factor affected to extraction coefficients is the stabilities, which are strongly influenced by the structures of podands.

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Characteristics of photo-thermal reduced Cu film using photographic flash light

  • Kim, Minha;Kim, Donguk;Hwang, Soohyun;Lee, Jaehyeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.293.1-293.1
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    • 2016
  • Various materials including conductive, dielectric, and semi-conductive materials, constitute suitable candidates for printed electronics. Metal nanoparticles (e.g. Ag, Cu, Ni, Au) are typically used in conductive ink. However, easily oxidized metals, such as Cu, must be processed at low temperatures and as such, photonic sintering has gained significant attention as a new low-temperature processing method. This method is based on the principle of selective heating of a strongly absorbent film, without light-source-induced damage to the transparent substrate. However, Cu nanoparticles used in inks are susceptible to the growth of a native copper-oxide layer on their surface. Copper-oxide-nanoparticle ink subjected to a reduction mechanism has therefore been introduced in an attempt to achieve long-term stability and reliability. In this work, a flash-light sintering process was used for the reduction of an inkjet-printed Cu(II)O thin film to a Cu film. Using a photographic lighting instrument, the intensity of the light (or intense pulse light) was controlled by the charged power (Ws). The resulting changes in the structure, as well as the optical and electrical properties of the light-irradiated Cu(II)O films, were investigated. A Cu thin film was obtained from Cu(II)O via photo-thermal reduction at 2500 Ws. More importantly, at one shot of 3000 Ws, a low sheet resistance value ($0.2527{\Omega}/sq.$) and a high resistivity (${\sim}5.05-6.32{\times}10^{-8}{\Omega}m$), which was ~3.0-3.8 times that of bulk Cu was achieved for the ~200-250-nm-thick film.

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Probing Polarization Modes of Ag Nanowires with Hot Electron Detection on $Au/TiO_2$ Nanodiodes

  • Lee, Young Keun;Lee, Jaemin;Lee, Hyosun;Lee, Jung-Yong;Park, Jeong Young
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.225-225
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    • 2013
  • Nanostructured noble metals have been attractive for their unusual optical properties and are widely utilized for various purposes. The optical properties mainly originating from collective electron oscillation can assist direct energy conversion via surface plasmon resonances. Here, we investigated the effect of surface plasmons of silver nanowires on the generation of hot electrons. It is reported that the surface plasmons of silver nanowires exhibit longitudinal and transverse modes, depending on the aspect ratio of the nanowires. In order to measure the hot electron flow through the metallic nanowires, chemically modified Au/TiO2 Schottky diodes were employed as the electric contact. The silver nanowires were deposited on a Au metal layer via the spray method to control uniformity and the amount of silver nanowire deposited. We measured the hot electron flow generated by photon absorption on the silver nanowires deposited on the Au/TiO2 Schottky diodes. The incident photon-to-current efficiency was measured a function of the photon energy, revealing two polarization modes of siliver nanowires: transverse and longitudinal modes. UV-Vis spectra exhibited two polarization modes, which are also consistent with the photocurrent measurements. Good correlation between the IPCE and UV-vis measurements suggests that hot electron measurement on nanowires on nanodiodes is a useful way to reveal the intrinsic properties of surface plasmons of nanowires.

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Inorganic Printable Materials for Printed Electronics: TFT and Photovoltaic Application

  • Jeong, Seon-Ho;Lee, Byeong-Seok;Lee, Ji-Yun;Seo, Yeong-Hui;Kim, Ye-Na;More, Priyesh V.;Lee, Jae-Su;Jo, Ye-Jin;Choe, Yeong-Min;Ryu, Byeong-Hwan
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.05a
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    • pp.1.1-1.1
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    • 2011
  • Printed electronics based on the direct writing of solution processable functional materials have been of paramount interest and importance. In this talk, the synthesis of printable inorganic functional materials (conductors and semiconductors) for thin-film transistors (TFTs) and photovoltaic devices, device fabrication based on a printing technique, and specific characteristics of devices are presented. For printable conductor materials, Ag ink is designed to achieve the long-term dispersion stability and good adhesion property on a glass substrate, and Cu ink is sophisticatedly formulated to endow the oxidation stability in air and even aqueous solvent system. The both inks were successfully printed onto either polymer or glass substrate, exhibiting the superior conductivity comparable to that of bulk one. In addition, the organic thin-film transistor based on the printed metal source/drain electrode exhibits the electrical performance comparable to that of a transistor based on a vacuum deposited Au electrode. For printable amorphous oxide semiconductors (AOSs), I introduce the noble ways to resolve the critical problems, a high processing temperature above $400^{\circ}C$ and low mobility of AOSs annealed at a low temperature below $400^{\circ}C$. The dependency of TFT performances on the chemical structure of AOSs is compared and contrasted to clarify which factor should be considered to realize the low temperature annealed, high performance AOSs. For photovoltaic application, CI(G)S nanoparticle ink for solution processable high performance solar cells is presented. By overcoming the critical drawbacks of conventional solution processed CI(G)S absorber layers, the device quality dense CI(G)S layer is obtained, affording 7.3% efficiency CI(G)S photovoltaic device.

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Development and Evaluation of Impregnated Carbon Systems Against Iodine Vapours

  • Srivastava, Avanish Kumar;Saxena, Amit;Singh, Beer;Srivas, Suresh Kumar
    • Carbon letters
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    • v.8 no.4
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    • pp.274-279
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    • 2007
  • In order to understand the breakthrough behaviour of iodine vapours on impregnated carbon systems, an active carbon, 80 CTC grade, $12{\times}30$ BSS particle size and $1104\;m^2/g$ surface area, was impregnated with metal salts such Cu, Cr, Ag, Mo and Zn, and an organic compound Triethylene diamine (TEDA) to prepare different carbon systems such as whetlerite, whetlerite/TEDA, whetlerite/KI/KOH and ASZMT. The prepared adsorbents along with active carbon were characterized for surface area and pore volume by $N_2$ adsorption at liquid nitrogen temperature. These carbon systems were compared for their CT (concentration X time) values at 12.73 to 53.05 cm/sec space velocities and 2 to 5 cm carbon column bed heights. The carbon column of 5.0 cm bed height and 1.0 cm diameter was found to be providing protection against iodine vapours up to 5.5 h at 3.712 mg/L iodine vapour concentration and 12.73 cm/sec space velocity. The study clearly indicated the adsorption capacities of carbon systems to be directly proportional to their surface area values. Dead layer with all the prepared carbon systems was found to be less than 2.0 cm indicating it to be minimum bed height to have protection against $I_2$ vapours. Effect of carbon bed height and flow rate was also studied. The active carbon showed maximum protection at all bed heights and flow rates in comparison to all other impregnated carbon systems, showing that only physical adsorption is responsible for the removal of iodine vapours.

Long-term Stability of Perovskite Solar Cells with Inhibiting Mass Transport with Buffer Layers (물질이동 억제 버퍼층 형성을 통한 페로브스카이트 태양전지 장기 안정성 확보)

  • Bae, Mi-Seon;Jeong, Min Ji;Chang, Hyo Sik;Yang, Tae-Youl
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.3
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    • pp.17-24
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    • 2021
  • Perovskite solar cells (PSCs) can be fabricated through solution process economically with variable bandgap that is controlled by composition of precursor solution. Tandem cells in which PSCs combined with silicon solar cells have potential to reach high power conversion efficiency over 30%, however, lack of long-term stability of PSCs is an obstacle to commercialization. Degradation of PSCs is mainly attributed to the mass transport of halide and metal electrode materials. In order to ensure the long-term stability, the mass transport should be inhibited. In this study, we confirmed degradation behaviors due to the mass transport in PSCs and designed buffer layers with LiF and/or SnO2 to improve the long-term stability by suppressing the mass transport. Under high-temperature storage test at 85℃, PSCs without the buffer layers were degraded by forming PbI2, AgI, and the delta phase of the perovskite material, while PSCs with the buffer layers showed improved stability with keeping the original phase of the perovskite. When the LiF buffer and encapsulation were applied to PSCs, superior long-term stability on 85℃-85% RH dump heat test was achieved; efficiency drop was not observed after 200 h. It was also confirmed that 90.6% of the initial efficiency was maintained after 200 hours of maximum power tracking test under AM 1.5G-1SUN illumination. Here, we have demonstrated that the buffer layer is essential to achieve long-term stability of PSCs.