• 제목/요약/키워드: Metal (Ag) layer

검색결과 154건 처리시간 0.023초

Ag-Cu-Ti Brazing 금속을 이용한 Inconel/$Si_3N_4$ 접합의 계면구조 (Interfacial Structure of Inconel/$Si_3N_4$ Joint Using Ag-Cu-Ti Brazing Metal)

  • 정창주;장복기;문종하;강경인
    • 한국세라믹학회지
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    • 제33권12호
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    • pp.1421-1425
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    • 1996
  • Sintered Si3N4 and Inconel composed of Ni(58-63%) Cr(21-25%) Al(1-17%) Mn(<1%) fe(balance) were pressurelessly joined by using Ag-Cu-Ti brazing filler metal at 950℃ and 1200℃ under N2 gas atmosphere of 1atm and their interfacial structures were investigated. In case that the reaction temperature was low as 950℃ its interfacial structure was "Inconel metal/Ti-rich phase layer/brazing filler metal layer/Si3N4 " Ti used as reactive metal existed in between inconel steel and brazing metal and moved to the interface of between brazing filler metal nd Si3N4 according as reaction temperature increased up to 1200℃. The interfacial structure of inconel steel-Si3N4 reacted at 1200℃ was ' inconel metal/Ni-rich phase layer containing of Fe. Cr and Si/Cu-rich phase layer containing of Mn and Si/Si3N4 " Cr Mn, Ni and Fe diffused to the interface of between brazing filler metal and Si3N4 and reacted with Si3N4 The most reactive components of ingredients of inconel metal were Cr and Mn. On the other hand Ti added as reactive components to Ag-Cu eutectic segregated into Ni-rich phase layer,.

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Top Emission OLED를 위한 금속을 이용한 투명전극 형성 (Formation of Transparent Metal Electrode for Top Emission OLEDs)

  • 김소연;하미영;문대규;이찬재;한정인
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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    • pp.457-458
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    • 2006
  • Transparent metal cathodes using Ca/Ag, Ba/Ag double layers have been fabricated to investigate its optical transmission. The transmission spectra show that Ca/Ag and Ba/Ag double layers result in higher transmittance compared to Ag single layer. The Ba/Ag double layer shows over 80% transmittance at 400 nm and 70% at 700 nm. The electroluminescence efficiency of fluorescent TEOLED using Ba/Ag transparent metal cathode was 10 ~ 15 cd/A.

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Low Emissivity Property of Amorphous Oxide Multilayer (SIZO/Ag/SIZO) Structure

  • Lee, Sang Yeol
    • Transactions on Electrical and Electronic Materials
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    • 제18권1호
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    • pp.13-15
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    • 2017
  • Low emissivity glass for high transparency in the visible range and low emissivity in the IR (infrared) range was fabricated and investigated. The multilayers were have been fabricated, and consisted of two outer oxide layers and a middle layer of Ag as a metal layer. Oxide layers were formed by rf sputtering and metal layers were formed using by an evaporator at room temperature. SiInZnO (SIZO) film was used as an oxide layer. The OMO (oxide-metaloxide) structures of SIZO/Ag/SIZO were analyzed by using transmittance, AFM (atomic force microscopye), and XRD (X-ray diffraction). The OMO multilayer structure was designed to investigate the effect of Ag layer thickness on the optical property of the OMO structure.

질화알루미늄과 금속간 계면접합에 관한 연구: 계면반응과 미세구조 형성이 접합체 강도에 미치는 영향 (Joining of AIN Ceramics to Metals: Effect of Reactions and Microstructural Developments in the Bonded Interface on the Joint Strength)

  • 박성계
    • 한국분말재료학회지
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    • 제4권3호
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    • pp.196-204
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    • 1997
  • Joining of AIN ceramics to W and Cu by active-metal brazing method was tried with use of (Ag-Cu)-Ti alloy as insert-metal. Joints were produced under various conditions of temperature, holding time and Ti-content in (Ag-Cu) alloy Reaction and microstructural development in bonded interface were investigated through observation and analysis by SEM/EDS, EPMA and XRD. Joint strengths were measured by shear test. Bonded interface consists of two layers: an insert-metal layer of eutectic Ag- and Cu-rich phases and a reaction layer of TiN. Thickness of reaction layer increases with bonding temperature, holding time and Ti-content of insert-metal. It was confirmed that the growth of reaction layer is a diffusion-controlled process. Activation energy for this process was 260 KJ/mol which is lower than that for N diffusion in TiN. Maximum shear strength of 108 MPa and 72 MPa were obtained for AIN/W and AIN/Cu joints, respectively. Relationship between processing variables, joint strength and thickness of reaction layer was also explained.

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GZO/Metal/GZO 하이브리드 구조 투명 전도막의 전기적, 광학적 특성; Ag, Cu, Al, Zn 금속 삽입층의 효과 (Electrical and Optical Properties of Transparent Conducting Films having GZO/Metal/GZO Hybrid-structure; Effects of Metal Layer(Ag, Cu, Al, Zn))

  • 김현범;김동호;이건환;김광호
    • 한국표면공학회지
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    • 제43권3호
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    • pp.148-153
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    • 2010
  • Transparent conducting films having a hybrid structure of GZO/Metal/GZO were prepared on glass substrates by sequential deposition using DC magnetron sputtering. Silver, copper, aluminum and zinc thin films were used as the intermediate metal layers in the hybrid structure. The electrical and optical properties of hybrid transparent conducting films were investigated with varying the thickness of metal layer or GZO layers. With increasing the metal thickness, hybrid films showed a noticeable improvement of the electrical conductivity, which is mainly dependent on the electrical property of the metal layer. GZO(40 nm)/Ag(10 nm)/GZO(40 nm) film exhibits a resistivity of $5.2{\times}10^{-5}{\Omega}{\cdot}cm$ with an optical transmittance of 82.8%. For the films with Zn interlayer, only marginal reduction in the resistivity was observed. Furthermore, unlike other metals, hybrid films with Zn interlayer showed a decrease in the resistivity with increasing the GZO thickness. The optimal thickness of GZO layer for anti-reflection effect at a given thickness of metal (10 nm) was found to be critically dependent on the refractive index of the metal. In addition, x-ray diffraction analysis showed that the insertion of Ag layer resulted in the improvement of crystallinity of GZO films, which is beneficial for the electrical and optical properties of hybrid-type transparent conducting films.

Ag계 Filler Metal을 사용한 YSZ와 STS430의 브레이징 접합시 Ti, Sn의 함량 변화가 접합강도에 미치는 영향 (The Effect of Ti and Sn Contents on the Shear Bonding Strength of Brazing Joint of YSZ to STS430 using Ag Based Filler Metals)

  • 이기영;박현균
    • Journal of Welding and Joining
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    • 제32권1호
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    • pp.66-70
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    • 2014
  • In Ti active brazing of YSZ to STS 430 using Ag-Cu Filler Metal, the effect of Ti contents on the shear bonding strength were investigated together with the effect of brazing temperature and holding time. The addition of Ti in Ag-Cu Filler Metal increased the bonding strength up to 4.68% Ti, followed by the decrease with further addition. This seems to be caused by formation of TixOy at the reaction layer. Brazing temperature was optimized at $960^{\circ}C$ among a given temperature ranges. The addion of Sn to Ag-Cu filler metal brought the decrease of its melting temperature its melting temperature without a significant decrease of bonging strength.

전면 발광 유기 발광 소자용 반투명 금속의 전기적 및 광학적 특성 (Electrical and Optical Properties of Semitransparent Metal Electrodes for Top-emission Organic Light-emitting Diodes)

  • 신은철;안희철;김태완
    • 한국전기전자재료학회논문지
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    • 제21권10호
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    • pp.938-942
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    • 2008
  • Electrical and optical properties of semitransparent Ag and Al layer were studied, which are used for the electrodes in top-emission organic light-emitting diodes. Sheet resistance and transmittance of visible light through a thin layer were measured and analyzed. Several thin metal layers of Ag and Al were deposited onto a glass substrate up to a thickness of 50 nm using a thermal evaporation. Sheet resistance measurements show that a layer thickness is needed more than 15 nm and 20 nm for Ag and Al, respectively, when a proper sheet resistance is assumed to be less than $50{\Omega}/sq$. From the measurements of transmittance of visible light through a thin-metal layer, metallic behavior was observed when the layer thickness is over 25 nm for both films. Thus, from a study of sheet resistance and transmittance of visible light, a minimum proper thickness of semitransparent metal layer is 20 nm and 25 nm for Ag and Al, respectively.

Metal Layer의 두께 변화에 따른 ZnO/Ag/ZnO 다층 박막의 특성 연구 Properties of Multi Layer (ZnO/Ag/ZnO Thin Films With Different Metal Layer Thickness)

  • 이승민;이상렬;김홍배
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.352-352
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    • 2013
  • 국내 에너지 소비량의 21.6%가 건물 분야에 소비되고 있다. 창호는 벽체에 비해 8~10배 이상 낮은 단열 특성을 가지기 때문에 열 손실량이 크다. 유리는 창호를 이루는 요소 중 가장 큰 면적을 차지하고 있으며, 창호의 단열성능을 2배로 향상시키면 30% 이상 건물의 에너지 절감 효과를 가질 수 있다. 창호의 단열 성능을 향상시키기 위해서 Low-e(emissivity) 기술 연구가 진행 중이다. 이번 실험에서는 RF 마그네트론 스퍼터링 시스템을 사용하여 XG 유리기판 위에 ZnO박막을 증착하고, evaporator 장비를 사용하여 metal층인 Ag를 증착하였다. 그리고 다시 한번 ZnO박막을 증착하였다. Low-e 연구에 활용할 수 있는지를 확인하기 위해 XRD, AFM, 투과도를 측정하였다. ZnO박막의 증착 조건은 초기압력 $3.0{\times}10^{-6}$ Torr, 공정압력 $2.0{\times}10^{-2}$ Torr, RF파워 30 W, Ar gas는 50 sccm, 증착온도는 상온으로 하였다. Metal층인 Ag를 증착하기 위해 evaporator의 증착 조건은 Rotate rate 2 rpm, voltage 0.3V, 공정압력 $5.0{\times}10^{-6}$ Torr이며, 변수로 Ag두께를 3,5,7,9,11,13,15 nm로 하였다. AFM 측정결과 Ag두께가 증가할수록 RMS roughness값이 높아졌으며, 최소 0.71 nm의 거칠기를 가지는 것을 확인하였다. XRD분석결과 37도 부근의 피크가 발생하여 ZnO 박막이 결정질 구조임을 확인할 수 있었다. 그리고 UV-Visible-NIR 분광 광도계를 이용하여 광학적 투과를 측정한 결과 Ag두께가 13 nm일 때 가시광 영역의 투과도가 최대 75%, 적외선 영역의 투과도가 최소 28%로 좋은 차단 특성을 가지는 것을 확인하였다. 위 결과들로 ZnO 박막이 Low-e 기술에 활용될 수 있음을 확인하였다.

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고속 화염 용사 공정을 이용한 스위칭 소자용 BCuP-5 filler 금속/Ag 기판 클래드 소재의 제조, 미세조직 및 접합 특성 (Fabrication, Microstructure and Adhesion Properties of BCuP-5 Filler Metal/Ag Plate Clad Material by Using High Velocity Oxygen Fuel Thermal Spray Process)

  • 주연아;조용훈;박재성;이기안
    • 한국분말재료학회지
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    • 제29권3호
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    • pp.226-232
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    • 2022
  • In this study, a new manufacturing process for a multilayer-clad electrical contact material is suggested. A thin and dense BCuP-5 (Cu-15Ag-5P filler metal) coating layer is fabricated on a Ag plate using a high-velocity oxygen-fuel (HVOF) process. Subsequently, the microstructure and bonding properties of the HVOF BCuP-5 coating layer are evaluated. The thickness of the HVOF BCuP-5 coating layer is determined as 34.8 ㎛, and the surface fluctuation is measured as approximately 3.2 ㎛. The microstructure of the coating layer is composed of Cu, Ag, and Cu-Ag-Cu3P ternary eutectic phases, similar to the initial BCuP-5 powder feedstock. The average hardness of the coating layer is 154.6 HV, which is confirmed to be higher than that of the conventional BCuP-5 alloy. The pull-off strength of the Ag/BCup-5 layer is determined as 21.6 MPa. Thus, the possibility of manufacturing a multilayer-clad electrical contact material using the HVOF process is also discussed.

다층박막 IGZO/Ag/IGZO의 Ag 두께 변화에 따른 구조적, 광학적 특성 연구

  • 왕홍래;이상렬;김홍배
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.365-365
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    • 2013
  • 본 실험에서는 RF magnetron sputter장비와 evaporator장비를 이용하여 다층박막 IGZO/Ag/IGZO를 제작하였다. 소결된 타겟은 In:Ga:ZnO 1:1:1mol%로 조성된 타겟을 사용하였으며, Ag는 99.999%의 순도를 가진다.다층박막 OMO구조의 Oxide layer는sputter장비를 이용 IGZO막을 제작하였으며, Metal layer는 evaporator 장비를 이용 Ag막을 제작하였다. 변수로는 Metal layer 두께에 따른 구조적, 광학적 특성 변화를 연구하였다. Oxide layer의 RF sputter 공정 조건으로는 초기압력 $3.0{\times}10^{-6}$ Torr 이하로 하였으며, 증착압력 $2.0{\times}10^{-2}$ Torr, RF power 30 W, Ar 50 sccm으로 고정시켰으며, Metal layer의 evaporator 공정조건으로는 $5.0{\times}10^{-6}$ 이하, 전압은 0.3V, 기판 회전속도는 2RPM 두께는 Thickness moniter로 3. 5. 7. 9. 11. 13. 15 nm를 확인하며 증착하였다. 분석결과로는 AFM측정결과 거칠기는 2 nm이하의 거칠기를 확인했으며, XRD측정결과 Bragg's 법칙($2\;dsin{\Theta}=n{\lambda}$)를 만족하는 피크를 찾을 수 없어 비정질 구조임을 확인할 수 있었다. 투과도 측정결과 가시광 영역에서 최대 80% 이상의 투과율을 보여주었으며, IR영역에서는 30% 이하의 투과율을 보여주었다. 에너지 밴드갬 계산결과 4.5~4.6 eV를 갖는 것을 확인하였으며, Low-e 분야에 사용가능함을 보여주었다.

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