• Journal of applied mathematics & informatics
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• v.30 no.5_6
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• pp.1031-1049
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• 2012

In this paper, a class of impulsive fuzzy bi-directional associative memory (BAM) neural networks with distributed delays and variable coefficients are considered. Using Lyapunov functional method and fixed point theorem, we derived some sufficient conditions for the existence and globally exponential stability of unique periodic solution of the networks. The results obtained are new and extend the previous known results. In addition, an example is given to show the effectiveness of our results obtained.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.13 no.4
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• pp.352-359
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• 1988

A learning control system which should have memory elements can be designed by utilizing the concept of parameter adaptation for unknown control object system parameters and regard it as a hybrid adaptive control system. A parameter adaptive learning control system applicable to a continuous time system has been already reported. Since there have been rapid developments in digital technology, it is possible to extend a continuous time parameter adaptive learning control system concept to a discrete time case. This problem is treated in this paper. Its justfication is proved and a simulation shows that this algorithms is effective.

• Journal of Mechanical Science and Technology
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• v.15 no.11
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• pp.1572-1579
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• 2001

We investigate the possibility of application of the Goore Scheme to turbulence control for drag reduction. In Part I, we examine the performance of the original Goore Scheme by applying it to a si mple one-dimensional problem. For the application of the scheme to turbulence control, we extend the scheme's capability so that it can treat multi-dimensional problems and examine its validity theoretically. The convergence of the extended scheme with a dynamic memory is faster by an order of magnitude than the original scheme. In Part II, we apply the proposed scheme to reduce drag for turbulent channel flows through direct numerical simulation.

• Journal of Information Processing Systems
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• v.17 no.2
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• pp.227-241
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• 2021

Object detection techniques based on deep learning such as YOLO have high detection performance and precision in a single channel video stream. In order to expand to multiple channel object detection in real-time, however, high-performance hardware is required. In this paper, we propose a novel back-end server framework, a real-time AI vision platform (RAVIP), which can extend the object detection function from single channel to simultaneous multi-channels, which can work well even in low-end server hardware. RAVIP assembles appropriate component modules from the RODEM (real-time object detection module) Base to create per-channel instances for each channel, enabling efficient parallelization of object detection instances on limited hardware resources through continuous monitoring with respect to resource utilization. Through practical experiments, RAVIP shows that it is possible to optimize CPU, GPU, and memory utilization while performing object detection service in a multi-channel situation. In addition, it has been proven that RAVIP can provide object detection services with 25 FPS for all 16 channels at the same time.

• The KIPS Transactions:PartD
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• v.15D no.1
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• pp.1-14
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• 2008

This paper is on query processing in the mobile devices where memory capacity is limited. In case that a query against a large volume of XML data is processed in such a mobile device, techniques of fragmenting the XML data into chunks and of streaming and processing them are required. Such techniques make it possible to process queries without materializing the XML data in its entirety. The previous schemes such as XFrag[4], XFPro[5], XFLab[6] are not scalable with respect to the increase of the size of the XML data because they lack proper memory management capability. After some information on XML fragments necessary for query processing is stored, it is not deleted even after it becomes of no use. As such, when the XML fragments are dynamically generated and infinitely streamed, there could be no guarantee of normal completion of query processing. In this paper, we address scalability of query processing over dynamic XML fragment stream, proposing techniques of deleting information on XML fragments accumulated during query processing in order to extend the previous schemes. The performance experiments through implementation showed that our extended schemes considerably outperformed the previous ones in memory efficiency and scalability with respect to the size of the XML data.

• ETRI Journal
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• v.42 no.4
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• pp.608-618
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• 2020

We present a novel GPU-based ray-casting algorithm for volume rendering of unstructured grid data. Our volume rendering system uses a ray-casting method that guarantees accurate rendering results. We also employ the per-pixel intersection list concept in the Bunyk algorithm to guarantee an accurate result for non-convex meshes. For efficient memory access for the lists on the GPU, we represent the intersection lists for all faces as an array with our novel construction algorithm. With the intersection lists, we perform ray-casting on a GPU, and a GPU thread handles each ray. To increase ray-coherency in a thread block and improve memory access efficiency, we extend a prior image-tile-based work distribution method to fit modern GPU architectures. We also show that a prior approach using a per-thread local buffer to reduce redundant computation is not appropriate for modern GPU architectures. Instead, we take an on-demand calculation strategy that achieves better performance even though it allows duplicate computations. We applied our method to three unstructured grid datasets with different characteristics. With a GPU, our method achieved up to 36.5 times higher performance for the ray-casting process and 19.7 times higher performance for the whole volume rendering process compared with the Bunyk algorithm using a CPU core. Also, our approach showed up to 8.2 times higher performance than a GPU-based cell projection method while generating more accurate rendering results. These results demonstrate the efficiency and accuracy of our method.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.1-9
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• 2010

Three-dimensional (3-D) integration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip to form highly integrated micro-nano systems. Since CMOS device scaling has stalled, 3D integration technology allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. The potential benefits of 3D integration can vary depending on approach; increased multifunctionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, increased yield and reliability, flexible heterogeneous integration, and reduced overall costs. It is expected that the semiconductor industry's paradiam will be shift to a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of 3D based technologies in highly integrated systems. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of IT-NT-BT systems. This paper attempts to introduce new 3D integration technologies of the chip self-assembling stacking and 3D heterogeneous opto-electronics integration for realizng the super-chip.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.20 no.9
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• pp.1741-1746
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• 2016

Recently, technology using a PC and the personal server efficiently has been highlighted in accordance with the historical background. Solutions for large enterprises and public institutions and PC and personal server management are being commercialized for fee. Paying a fee for PC and personal server management being a burden and commercialized solutions include a function that does not require. In this paper, proposed the PC and personal server management system include monitoring that cpu, hdd, memory, respond speed. It expects to extend the PC and service life is available without charge through the free distribution of the burden. The Development program and application is available for free from the android market and on-line. Server agent program of the proposed system operates based on a single-threaded system. That is low load and the low functional burden on the server.

• Smart Structures and Systems
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• v.13 no.3
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• pp.353-374
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• 2014

Recent studies were dedicated to the realization of measurements on stay-cable samples of different geometry and static conditions as available at several facilities. The elaboration of the acquired data showed a a satisfactory efficacy of the dampers made of NiTi wires in smoothing the cable oscillations. A further attempt to investigate the applicability of the achieved results beyond the specific case-studies represented by the tested cable-stayed samples is herein pursued. Comparative studies are carried out by varying the diameter of the NiTi wire so that similar measurements can be taken also from laboratory steel cables of reduced size. Details of the preparation of the Ni-Ti wires are discussed with particular attention being paid to the suppression of the creep phenomenon. The resulting shape of the hysteretic cycle differs according to the wire diameter, which affects the order of the fitting polynomial to be used when trying to retrieve the experimental results by numerical analyses. For a NiTi wire of given diameter, an estimate of the amount of dissipated energy per cycle is given at low levels of maximum strain, which correspond to a fatigue fracture life of the order of millions of cycles. The dissipative capability is affected by both the temperature and the cycling frequency at which the tests are performed. Such effects are quantified and an ageing process is proposed in order to extend the working temperature range of the damper to cold weathers typical of the winter season in Northern Europe and Canada. A procedure for the simulation of the shape memory alloy behavior in lengthy cables by finite element analysis is eventually outlined.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.11-19
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• 2015

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.