• Title/Summary/Keyword: Mechanical technology

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Effects of Rotor Misalignment in Airgap on Dynamic Response of an Eccentric Rotor in BLDC Motor

  • Kim, Tae-Jong;Kim, Kyung-Tae;Hwang, Sang-Moon;Park, No-Gill;Lee, Shi-Bok
    • Journal of Mechanical Science and Technology
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    • v.16 no.12
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    • pp.1576-1582
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    • 2002
  • Vibration of a BLDC motor is a coupled phenomenon between mechanical characteristics and magnetic origins which takes place through the motor airgap. When relative misalignment of a rotor in the airgap is introduced during assembly, the dynamic characteristics of the motor system are affected. The rotor-motor system used in a washing machine is modeled using FETM and magnetic forces in a BLDC motor with radial rotor eccentricity are determined analytically The transient whirl responses of a rotor system supported on two roller bearings with relative misalignment in the motor airgap are investigated by considering mechanical and magnetic coupling effects. Results show that rotor misalignment in the airgap considerably affects the vibration of the rotor-motor system.

Structural Formulation of As-grown Vertically Aligned Nanostructures to Multifunctional Thin-Film Frameworks through Controlled Mechanical Rolling (기계적 롤링을 통한 수직배향 나노구조의 다용도 박막 프레임워크 변환)

  • Park, Tae Jun;Choi, Seok Min;Youn, Do Kyung;Lee, Seungjo;Park, Jaekyu;Lee, Jae Hyuk;Kim, Jeong Dae;Lee, Han Kil;Ok, Jong G.
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.25 no.4
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    • pp.266-270
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    • 2016
  • We present a useful and practical manufacturing technique that enables the structural conversion of delicate as-grown nanostructures to more beneficial and robust thin-film frameworks through controlled mechanical rolling. Functional nanostructures such as carbon nanotubes grown through chemical vapor deposition in a vertically aligned and very loosely packed manner, and thus difficult to manipulate for subsequent uses, can be prepared in an array of thin blades by patterning the growth catalyst layer. They can then be toppled as dominos through precisely controlled mechanical rolling. The nanostructures formulated to horizontally aligned thin films are much more favorable for device applications typically based on thin-film configuration. The proposed technique may broaden the functionality and applicability of as-grown nanostructures by converting them into thin-film frameworks that are easier to handle and more durable and favorable for fabricating thin-film devices for electronics, sensors, and other applications.

Inverse Dynamic Analysis of Flexible Multibody Systems with Closed-Loops

  • Lee, Byung-Hoon;Lee, Shi-Bok;Jeong, Weui-Bong;Yoo, Wan-Suk;Yang, Jin-Saeng
    • Journal of Mechanical Science and Technology
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    • v.15 no.6
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    • pp.693-698
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    • 2001
  • The analysis of actuating forces (or torques) and joint reaction forces (or moments) are essential to determine the capacity of actuators, to control the system and to design the components. This paper presents an inverse dynamic analysis algorithm for flexible multibody systems with closed-loops in the relative joint coordinate space. The joint reaction forces are analyzed in Cartesian coordinate space using the inverse velocity transformation technique. The joint coordinates and the deformation modal coordinates are used as the generalized coordinates of a flexible multibody system. The algorithm is verified through the analysis of a slider-crank mechanism.

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Dependence of Dishing on Fluid Pressure during Chemical Mechanical Polishing

  • Higgs III, C. Fred;Ng, Sum Huan;Zhou, Chunhong;Yoon, In-Ho;Hight, Robert;Zhou, Zhiping;Yap, LipKong;Danyluk, Steven
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2002.10b
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    • pp.441-442
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    • 2002
  • Chemical mechanical polishing (CMP) is a manufacturing process that uses controlled wear to planarize dielectric and metallic layers on silicon wafers. CMP experiments revealed that a sub-ambient film pressure developed at the wafer/pad interface. Additionally, dishing occurs in CMP processes when the copper-in-trench lines are removed at a rate higher than the barrier layer. In order to study dishing across a stationary wafer during polishing, dishing maps were created. Since dishing is a function of the total contact pressure resulting from the applied load and the fluid pressure, the hydrodynamic pressure model was refined and used in an existing model to study copper dishing. Density maps, highlighting varying levels of dishing across the wafer face at different radial positions, were developed. This work will present the results.

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A Fault Isolation Filter Design Using Left Eigenstructure Assignment Scheme

  • Choi, Jae-Weon;Lee, Shi-Bok;Lee, Dae-Young;Park, Un-Sik;Suh, Young-Soo
    • Journal of Mechanical Science and Technology
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    • v.14 no.6
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    • pp.583-589
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    • 2000
  • This paper presents a novel fault isolation filter design method using left eigenstructure assignment scheme proposed by the first author et al. The proposed method shows good performance of fault isolation with an exact eigenstructure assignment and guarantees that the corrupted ${\gamma}$ faults can be isolated simultaneously when the number of available output measurements are equal to or larger than (${\gamma}+1$). A numerical example for the fault isolation filter is also included.

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Introduction to Autonomous Vehicle PHAROS (자율주행자동차 PHAROS)

  • Ryu, Jee-Hwan;Park, Jang-Sik;Ogay, Dmitriy;Bulavintsev, Segey;Kim, Hyuk;Song, Young-wook;Yoon, Moon-Young;Kim, Jea-Seok;Kang, Jeon-Jin
    • Journal of Institute of Control, Robotics and Systems
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    • v.18 no.8
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    • pp.787-793
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    • 2012
  • This paper introduces the autonomous vehicle Pharos, which participated in the 2010 Autonomous Vehicle Competition organized by Hyundai-Kia motors. PHAROS was developed for high-speed on/off-road unmanned driving avoiding diverse patterns of obstacles. For the high speed traveling up to 60 km/h, long range terrain perception, real-time path planning and high speed vehicle motion control algorithms are developed. This paper describes the major hardware and software components of our vehicle.

Fabrication of V-grooved Mold for the Light Guide Plate of TFT-LCD with MEMS Technology

  • Lee, Woon-Seob;Han, Man-Hee;Lee, Sung-Keun;Lee, Seung-S
    • 한국정보디스플레이학회:학술대회논문집
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    • 2002.08a
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    • pp.994-996
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    • 2002
  • We present a novel fabrication method for a V-grooved mold of the light guide plat of TFT-LCD with MEMS technology. This method is performed by the inclined UV lithography and Ni electroplating unlike the previous mechanical processing technique. V-grooves with different dimension can be made simultaneously with single photomask.

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Optimal Placement of Sensors and Actuators Using Measures of Modal Controllability and Observability in a Balanced Coordinate

  • Park, Un-Sik;Choi, Jae-Weon;Yoo, Wan-Suk;Lee, Man-Hyung;Son, Kwon;Lee, Jang-Myung;Lee, Min-Cheol;Han, Sung-Hyun
    • Journal of Mechanical Science and Technology
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    • v.17 no.1
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    • pp.11-22
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    • 2003
  • In this paper, a method for optimal placement of sensors and actuators is presented by using new measures of modal controllability and observability defined in a balanced coordinate system. The proposed new measures are shown to have a great advantage in practical use when they are used as criteria for selecting the locations of sensors and actuators, since the most controllable and observable locations can be obtained to be identical. In addition, they are more accurate than the measures of Hamdan and Nayfeh in that the effects of the eigenvector norm are considered into the magnitude of measures. In simulations, to verify the effectiveness of the proposed measures and optimal placement method, the closed-loop response of a simply supported flexible beam, in which the number and locations of actuators are determined by using the proposed measures and optimal placement method, has been examined and compared with the case of Hamdan and Nayfeh’s measures.

Dishing and Erosion in Chemical Mechanical Polishing of Electroplated Copper

  • Yoon, In-Ho;Ng, Sum Huan;Hight, Robert;Zhou, Chunhong;Higgs III, C. Fred;Yao, Lily;Danyluk, Steven
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2002.10b
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    • pp.435-437
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    • 2002
  • Polishing of copper, a process called copper chemical mechanical polishing, is a critical, intermediate step in the planarization of silicon wafers. During polishing, the electrodeposited copper films are removed by slurries: and the differential polishing rates between copper and the surrounding silicon dioxide leads to a greater removal of the copper. The differential polishing develops dimples and furrows; and the process is called dishing and erosion. In this work, we present the results of experiments on dishing and erosion of copper-CMP, using patterned silicon wafers. Results are analyzed for the pattern factors and properties of the copper layers. Three types of pads - plain, perforated, and grooved - were used for polishing. The effect of slurry chemistries and pad soaking is also reported.

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