• Title/Summary/Keyword: Mechanical peeling

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Effect of Peeling Blades and Abrasives on Mechanical Peeling of Cynanchum wilfordii Hemsley (박피(剝皮)날 및 연마재(硏磨材)가 백하수오(白何首烏) 기계박피(機械剝皮)에 미치는 영향(影響))

  • Kim Ju;Kim Chang-Soo;Song Yeung-Eun;Lee Yun-Suk;Shim Jin-Chan;Han Jong-Hyun;Kwak Joon-Soo
    • Korean Journal of Acupuncture
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    • v.18 no.1
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    • pp.165-170
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    • 2001
  • A rapid increasing in cultivation area due to favorable price temporarily and decreasing in consumer's demands caused by economic depressions recently, lead the price of Cynanchum wilfordii Hemsley to decline sharply. Thus, it may give rises to weakening of cultivation bases in Cynanchum wilfordii Hemsley. To investigate optimal mechanical peeling conditions of Cynanchum wilfordii Hemsley, protruded rubber, plastic pad, diamond shape's steel and palstic brush were introduced as blades and artificial stone, sand and small pebble were done as abrasives. The main results obtained were summarized as follows; 1. It took 2 minutes per 1kg in mechanical peeling of Cynanchum wilfordii Hemsley's raw root whereas 36 minutes in manual peeling and values of lightness showed more higher in manual peeling than in mechanical peeling. 2. Yield in combination of diamond shape's steel blade and sand abrasive showed the lowest at 89.9% among treatments and peeling rates in combination of diamond shape's steel blade and small pebble showed the highest at 71.3% in mechanical peeling. 3. Lightness, one of the most important factors in determining quality of Cynanchum wilfordii Hemsley, showed the highest in combination of diamond shape's steel blade and small pebble brasive at 61.90 in mechanical peeling. 4. As the speed of rotation gets faster, yields tend to lower in mechanical peeling. Peeling rates and lightness showed the highest at 66.8%, 57.96 respectively among treatments at 30 r.p.m. in mechanical peeling.

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Reduction of Free Edge Peeling Stress in Composite Laminates under Bending Load (굽힘하중이 가해지는 복합재 평판 자유단에서의 박리응력 감소 연구)

  • Jung, Seok-Joo;Sung, Myung-Kyun;Kim, Heung Soo
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.28 no.5
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    • pp.497-502
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    • 2015
  • In this paper, a stress function-based approach was proposed to analyze the reduction of free-edge peeling stress in smart composite laminates using piezoelectric actuator under bending load. Electro-mechanically coupled governing equation was obtained by complimentary virtual work principle. The stress state was solved by the generalized eigenvalue procedure. The free-edge peeling stress of smart composite laminates was reduced by the piezoelectric actuation. The reduction rate of peeling stress in cross-ply composite laminate is larger than that in angle ply composite laminate.

Effect of Tio2 particles on the mechanical, bonding properties and microstructural evolution of AA1060/TiO2 composites fabricated by WARB

  • Vini, Mohamad Heydari;Daneshmand, Saeed
    • Advances in materials Research
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    • v.9 no.2
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    • pp.99-107
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    • 2020
  • Reinforced aluminum alloy base composites have become increasingly popular for engineering applications, since they usually possess several desirable properties. Recently, Warm Accumulative Roll Bonding (WARB) process has been used as a new novel process to fabricate particle reinforced metal matrix composites. In the present study, TiO2 particles are used as reinforcement in aluminum metal matrix composites fabricated through warm accumulative roll bonding process. Firstly, the raw aluminum alloy 1060 strips with TiO2 as reinforcement particle were roll bonded to four accumulative rolling cycles by preheating for 5 min at 300℃before each cycle. The mechanical and bonding properties of composites have been studied versus different volume contents of TiO2 particles by tensile test, peeling test and vickers micro-hardness test. Moreover, the fracture surface and peeling surface of samples after the tensile test and peeling test have been studied versus different amount of TiO2 volume contents by scanning electron microscopy. The results indicated that the strength and the average vickers micro-hardness of composites improved by increasing the volume content of TiO2 particles and the amount of their elongation and bonding strength decreased significantly.

Peeling Operations of Root Vegetables: Potato, Sweet Potato and Carrot (근채류(감자, 고구마, 당근)의 탈피조작)

  • Lee, Cherl-Ho;Lee, Soon-Woo
    • Korean Journal of Food Science and Technology
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    • v.16 no.3
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    • pp.329-335
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    • 1984
  • The effect of peeling methods, spherecity and weight of potatoes and carrots on the peeling efficiency were investigated. The changes in the surface texture by peeling were estimated by Rheometer and were related to the changes in the microstructure. The optimum mechanical peeling conditions using abrasion type rotary peeler were 90 sec. at 300 rpm for potatoes, 70 sec. at 300 rpm for sweet potatoes and 60 sec. at 300 rpm for carrots. The peeling loss was influenced by the sphericity and weight of the sample. The optimum conditions for alkali peeling were 90 sec. immersion in boiling 10% NaOH solution for potatoes, 300 sec. in boiling 10% NaOH solution for sweet potatoes and 60 sec. in boiling 6% NaOH solution for carrots. Severe damage of surface structure was noticed by alkali peeling, demonstrated by denaturation of starch granules in the cell. The structural damage observed by microscope was related to the reduction of cutting force after peeling.

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Bonding evolution of bimetallic Al/Cu laminates fabricated by asymmetric roll bonding

  • Vini, Mohamad Heydari;Daneshmand, Saeed
    • Advances in materials Research
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    • v.8 no.1
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    • pp.1-10
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    • 2019
  • Roll bonding (RB) process of bi-metal laminates as a new noble method of bonding has been widely used in the production of bimetal laminates. In the present study, asymmetric roll bonding process as a new noble method has been presented to produce Al/Cu bimetallic laminates with the thickness reduction ratios 10%, 20% and 30% together with mismatch rolling diameter ($\frac{R_2}{R_1}$) ratio 1:1, 1:1.1 and 1:1.2. ABAQUS as a finite element simulation software was used to model the deformation of samples. The main attention in this study focuses on the bonding properties of Al/Cu samples. The effect of the $\frac{R_2}{R_1}$ ratios was investigated to improve the bond strength. During the simulation, for samples produced with $\frac{R_2}{R_1}=1:1.2$, the vertical plastic strain of samples was reach the maximum value with a high quality bond. Moreover, the peeling surface of samples after the peeling test was investigated by the scanning electron microscopy (SEM).

Investigation of bonding properties of Al/Cu bimetallic laminates fabricated by the asymmetric roll bonding techniques

  • Vini, Mohamad Heydari;Daneshmand, Saeed
    • Advances in Computational Design
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    • v.4 no.1
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    • pp.33-41
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    • 2019
  • In this study, 2-mm Al/Cu bimetallic laminates were produced using asymmetric roll bonding (RB) process. The asymmetric RB process was carried out with thickness reduction ratios of 10%, 20% and 30% and mismatch rolling speeds 1:1, 1:1.1 and 1:1.2, separately. For various experimental conditions, finite element simulation was used to model the deformation of bimetallic Al/Cu laminates. Specific attention was focused on the bonding strength and bonding quality of the interface between Al and Cu layers in the simulation and experiment. The optimization of mismatch rolling speed ratios was obtained for the improvement of the bond strength of bimetallic laminates during the asymmetric RB process. During the finite element simulation, the plastic strain of samples was found to reach the maximum value with a high quality bond for the samples produced with mismatch rolling speed 1:1.2. Moreover, the peeling surfaces of samples around the interface of laminates after the peeling test were studied to investigate the bonding quality by scanning electron microscopy.

A Study on Solving the WSix Peeling Issue at MDDR DRAM (MDDR(Mobile Double Data Rate) DRAM의 WSix Peeling 불량 해결 연구)

  • Chae, Han-Yong;Lee, Sung-Young;Park, Tae-Hoon;Lee, Hyun-Sung;Lee, Kwang-Hee;Seo, Ju-Won;Choi, Kyue-Sang
    • Proceedings of the IEEK Conference
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    • 2008.06a
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    • pp.481-482
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    • 2008
  • In this paper, the advanced process has been presented to remove the WSix peeling that was made in sub 100nm DRAM SRCAT(Sphere-shaped-Recess-Ch annel-Array Transistor). The source of WSix peeling was proved to be the groove of gate poly film. We have completely solved the problems to adopt the gate-poly CMP (Chemical Mechanical Polishing) process.

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Key Parameter of Peel-off Test for Reliability Assessment of Toner Film (토너 박막의 신뢰성 평가를 위한 Peel-off Test의 주요인자)

  • Kim, Kwang-Il;Kim, Dae-Eun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.11
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    • pp.1567-1573
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    • 2010
  • In printing systems, the reliability of printed material depends on the ability of the toner film to remain adhered to the paper surface. In order to measure the strength between the toner film and the paper surface, a peel-off test is often performed. After conducting the test, the amount of toner film remaining on the paper is measured in order to determine the interfacial strength. The results of this test can be affected by many factors such as the peeling rate, weight of the roller used, and dwell time of tape. Sensitivity analysis was performed with respect to peeling rate, weight of roller and dwell time of tape at different levels. It was found that the interfacial strength increased with an increase in these main parameters. On the other hand, the trend with respect to the percentage of toner loss was different. Further, the interfacial strength and percentage of toner loss were significantly affected by the peeling rate.

Quadrant Analysis in Correlation between Mechanical and Electrical Properties of Low-Temperature Conductive Film Bonded Crystalline Silicon Solar Cells

  • Baek, Su-Wung;Choi, Kwang-Il;Lee, Woo-Hyoung;Lee, Suk-Ho;Cheon, Chan-Hyuk;Hong, Seung-Min;Lee, Kil-Song;Shin, Hyun-Woo;Yan, Yeon-Won;Lim, Cheolhyun
    • Current Photovoltaic Research
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    • v.3 no.1
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    • pp.1-4
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    • 2015
  • In this study, we analyzed the correlation between mechanical and electrical properties of low-temperature conductive film (LT-CF) bonded silicon solar cells by a quadrant analysis (horizontal axis (peeling strength), vertical axis (power loss)). We found that a series of points with various bonding parameters such as bonding temperature, pressure and time were distributed in the different three regimes; weak regime (Q2: weak bonding strength and high power loss), moderate regime (Q4 : strong bonding strength and low power loss) and hard regime (Q3 : weak bonding strength and low power loss). Using this analogous technique, it was possible to fabricate the LT-CF bonded silicon solar cells with the various conditions displayed in Q3 of the quadrant plots, possessing the peeling strength of ~ 1N/mm and power loss of 2~3%.

Quality Characteristics of Potato and Sweet Potato Peeled by Different Methods (박피방법에 따른 감자 및 고구마의 초기 품질 비교)

  • Jeong Jin-Woong;Park Kee-Jai;Jeong Seong-Weon;Sung Jung-Min
    • Food Science and Preservation
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    • v.13 no.4
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    • pp.438-444
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    • 2006
  • This study was carried out to obtain fundamental data such as peeling efficiency and quality of potatoes and sweet potatoes peeled by hand, machine and alkali(NaOH). The weight loss by peeling was influenced by peeling methods. Weight losses by rotational brushing-type peeler showed the lowest value, 7.9% in potato, and 7.3% in sweet potato. Any significant differences in moisture content were not found in potatoes and sweet potatoes by peeling methods. The pH of potatoes and sweet potatoes just after peeling were 5.8-6.8 and 6.23-6.63, and decreased somewhat until 3 hrs after peeling. Hardness of potatoes and sweet potatoes peeled by hand with fruit knife were better than that of others. Depending upon the peeling method used the color and color differences undergo some changes in their color and browning. Color difference value of peeled potatoes by hand with a technical tools, and by mechanical peeler such as rotational cutting-type peeler and rotational brushing-type peeler showed just slightly. In particular, changes of rotor differences value of potatoes and sweet potatoes peeled by dipping with 10% NaOH solution at $100^{\circ}C$ was the highest in the samples peeled by NaOH.