• Corrosion Science and Technology
• /
• 제8권1호
• /
• pp.15-20
• /
• 2009

Surface of PEEK(poly-ether-ether-ketone) was modified by chemical etching, plasma treatment and mechanical grinding to improve the plating adhesion. The plating characteristics of these samples were studied by the contact angle, plating thickness, gloss and adhesion. Chemical etching and plasma treatment increased wettability, adhesion and gloss. The contact angle of as-received PEEK was $61^{\circ}$. The contact angles of chemical etched, plasma treated or both were improved to the range of $15{\sim}33^{\circ}$. In the case of electroless plating, the thickest layer without blister was $1.6{\mu}m$. The adhesion strengths by chemical etching, plasma treatment or both chemical etching and plasma treatment were $75kgf/cm^2$, $102kgf/cm^2$, $113kgf/cm^2$, respectively, comparing to the $24kgf/cm^2$ of as-received. In the case of mechanically ground PEEKs, the adhesion strengths were higher than those unground, with the sacrifice of surface gloss. The gloss of untreated PEEK were greater than mechanically ground PEEKs. Plating thickness increased linearly with the plating times.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 2010년도 춘계학술발표대회
• /
• pp.27.2-27.2
• /
• 2010

In recent years, there is a strong requirement of low cost, stable microelectro mechanical systems (MEMS) for resonators, microswitches and sensors. Most of these devices consist of freely suspended microcantilevers, which are usually made by the etching of some sacrificial materials. Herein, we have attempted to use Si nanowires, inherited from the parent Si wafer, as a sacrificial material due to its porosity, low cost and ease of fabrication. Prior to the fabrication of the Si nanowires silver nanoparticles were continuously formed on the surface of Si wafer. Vertically aligned Si nanowires were fabricated from the parent Si wafers by aqueous chemical route at $50^{\circ}C$. Afterwards, the morphological and structural characteristics of the Si nanowires were investigated. The morphology of nanowires was strongly modulated by the resistivity of the parent wafer. The 3-step etching of nanowires in diluted KOH solution was carried out at room temperature in order to control the fast etching. A layer of $Si_3N_4$ (300 nm) was used for the selective fabrication of nanowires. Finally, a freely suspended bridge of zinc oxide (ZnO) was fabricated after the removal of nanowires from the parent wafer. At present, we believe that this technique may provide a platform for the inexpensive fabrication of futuristic MEMS.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제48권4호
• /
• pp.261-268
• /
• 1999

Laser-induced thermochemical etching has been recognized as a new powerful method for processing a variety of materials, including metals, semiconductors, ceramics, insulators and polymers. This study presents characteristics of direct etching for Si substrate using focused argon ion laser beam in aqueous KOH and $CCl_2F_2$ gas. In order to determine process conditions, we first theoretically investigated the temperature characteristics induced by a CW laser beam with a gaussian intensity distribution on a silicon surface. Major process parameters are laser beam power, beam scan speed and reaction material. We have achieved a very high etch rate up to $434.7\mum/sec$ and a high aspect ratio of about 6. Potential applications of this laser beam etching include prototyping of micro-structures of MEMS(micro electro mechanical systems), repair of devices, and isolation of opto-electric devices.

• 한국산업융합학회 논문집
• /
• 제26권4_1호
• /
• pp.517-527
• /
• 2023

Many techniques have been proposed and investigated for microlens array manufacturing in three-dimensional (3D) structures. We present fabricating a microlens array using selective laser etching and a CO₂ laser. The femtosecond laser was employed to produce multiple micro-cracks that comprise the predesigned 3D structure. Subsequently, the wet etching process with a KOH solution was used to produce the primary microlens array structures. To polish the nonoptical surface to the optical surface, we performed reflow postprocessing using a CO₂ laser. We confirmed that the micro lens array can be manufactured in three primary shapes (cone, pyramid and hemisphere). Compared to our previous study, the processing time required for laser processing was reduced from approximately 1 hour to less than 30 seconds using the proposed processing method. Therefore, micro lens arrays can be manufactured using our processing method and can be applied to mass productionon large surface areas.

• Tribology and Lubricants
• /
• 제23권6호
• /
• pp.298-300
• /
• 2007

Frictional characteristics of mesoporous $SiO_2$ thin films were evaluated with different pore sizes. The films were manufactured by sol-gel and self-assembly methods to have a porous structure. The pores on the surface may play as the outlet of wear particle and the storage of lubricant so that the surface interactions could be improved. The pores were exposed on the surface by chemical mechanical polishing (CMP) or plasma-etching after forming the porous films. The ball-on-disk tests with mesoporous $SiO_2$ thin films on glass specimen were conducted at sliding speed of 15 rpm and a load of 0.26 N. The results show considerable dependency of friction on pore size of mesoporous $SiO_2$ thin films. The friction coefficient decreased as increasing the pore size. CMP process was very useful to expose the pores on the surface.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2006년도 춘계학술대회 논문집
• /
• pp.145-146
• /
• 2006

A fluorine-doped diamond-like carbon (F-DLC) stamp which has high contact angle, high UV-transmittance and sufficient hardness, was fabricated using the following direct etching method: F-DLC is deposited on a quartz substrate using DC and RF magnetron sputtering, PMMA is spin coated and patterned using e-beam lithography and finally, O2 plasma etching is performed to transfer the line patterns having 100 nm line width, 100 nm line space and 70 nm line depth on F-DLC. The optimum fluorine concentration was determined after performing several pre-experiments. The stamp was applied successfully to UV-NIL without being coated with an anti-adhesion layer.

• 한국기계가공학회지
• /
• 제12권2호
• /
• pp.75-80
• /
• 2013

Cathode is an essential component used in plasma etching process which is to make micro pattern on the silicon wafer. The currently used cathodes produce particles at the high temperature plasma etching process. To overcome this problem, a 'Silicon Only Cathode' was developed. This 'Silicon Only Cathode' requires manufacturing process changes due to the change of shapes, material features, and machining characteristics of work materials. This research investigates the small hole drilling process. The conclusion is that PCD drills with twist angles of $20^{\circ}$ and $25^{\circ}$ were tested for small hole drilling and the experimental results indicate that the drill with $25^{\circ}$ twist angle drill causes less thrust force.

• 대한소아치과학회지
• /
• 제32권2호
• /
• pp.321-331
• /
• 2005

치면열구전색제의 접착력에 영향을 줄 수 있는 교합면 열구 법랑질의 미세구조 및 산부식 형태, 그리고 산부식 형태에 영향을 줄 수 있는 prismless enamel의 존재 여부 및 법랑질의 화학적 조성을 규명하고자 소구치를 대상으로 협설면과 근원심으로 각각 절단하여 열구내의 법랑질 표면과 산부식 형태를 주사전자현미경으로 관찰하고 EDX를 사용하여 법랑질의 화학적 조성을 분석한 결과 다음과 같은 결과를 얻었다. 1. 열구내 법랑질은 대부분이 prismless enamel이 존재하였다. 2. 미성숙 영구치와 성숙된 영구치간의 열구내 법랑질 표면 구조 및 산부식 형태는 차이가 없었다. 3. 열구 법랑질은 부위에 관계없이 60초 산부식이 15초, 30초, 45초에 비해 산부식 효과가 가장 컸으며 15초, 30초, 45초의 산부식 시간에서는 적절한 유지력을 얻을 수 있는 산부식 상이 관찰되지 않았다. 4. 열구 법랑질의 표면을 기계적으로 제거한 경우는 30초의 산부식 시간에서도 60초 산부식 시간에 못지않은 전형적인 산부식 상이 관찰되었다. 5. 산부식 형태는 주로 rod 주위가 소실된 제 2형의 산부식 상이 관찰되었다. 6. 열구 내 법랑질의 부위별 화학적 조성의 차이는 없었으나 미성숙 영구치와 성숙된 영구치 사이의 칼슘/인 비는 유의한 차이를 보였다. 이상의 연구결과를 종합하면 교합면 열구 내 법랑질은 대부분 산에 저항성이 큰 prismless enamel로 덮여 있어 기존에 제안된 15-30초의 산부식 시간으로는 적절한 유지력을 얻을 수 있는 산부식 상을 형성할 수 없다는 사실을 알 수 있다. 따라서 기존의 제안된 산부식 시간에 대한 재고가 필요하며 이와 함께 적절한 산부식 상을 얻기 위한 방안으로 산부식 전 bur를 사용하여 열구내 법랑질 표면을 제거해 주는 보조적인 술식에 대한 검토가 필요하리라 사료된다.

• 한국정밀공학회지
• /
• 제29권10호
• /
• pp.1089-1095
• /
• 2012

Laser beam machining (LBM) using nanosecond pulsed laser is widely known to be rapid and non-wear process for micromachining. However, the quality itself cannot meet the precision standard due to the recast layer and heat affected zone. In this paper, a fabrication method for machining micro features in stainless steel using a hybrid process of LBM using nanosecond pulsed laser and electrochemical etching (ECE) is reported. ECE uses non-contacting method for precise surface machining and selectively removes the recast layer and heat affected zone produced by laser beam in an effective way. Compared to the single LBM process, the hybrid process of LBM and ECE enhanced the quality of the micro features.

• Carbon letters
• /
• 제28권
• /
• pp.100-104
• /
• 2018