• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.10
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• pp.1609-1618
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• 1997

Thermo-mechanical behaviors of polymer matrix composite(PMC) with continuous TiNi fiber are studied using theoretical analysis with 1-D analytical model and numerical analysis with 2-D multi-fiber finite element(FE) model. It is found that both compressive stress in matrix and tensile stress in TiNi fiber are the source of strengthening mechanisms and thermo-mechanical coupling. Thermal expansion of continuous TiNi fiber reinforced PMC has been compared with various mechanical behaviors as a function of fiber volume fraction, degree of pre-strain and modulus ratio between TiNi fiber and polymer matrix. Based on the concept of so-called shape memory composite(SMC) with a permanent shape memory effect, the critical modulus ratio is determined to obtain a smart composite with no or minimum thermal deformation. The critical modulus ratio should be a major factor for design and manufacturing of SMC.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.381-382
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• 2006

The mechanical behaviors of multi-layered foam core sandwich composite were investigated through a 3-point bending test. The sandwich specimens were obtained from sandwich panel consisting of aluminum faces and urethane foam core. Three types of sandwich specimens such as a single structure, a double structure and a triple structure were considered. The span of sandwich specimens were varied from 170mm to 350mm. According to the results, the flexural and shear properties of multi-layered sandwich composite were found to be higher than those of single-layered sandwich composite.

• Macromolecular Research
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• v.17 no.8
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• pp.585-590
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• 2009

The cure behaviors, dielectric characteristics and fracture toughness of diglycidylether of bisphenol-A (DGEBA)/poly(ethylene terephthalate) (PET) blend system were investigated. The degree of conversion for the DGEBA/PET blend system was measured using Fourier transform infrared (FTIR) spectroscopy. The cure kinetics were investigated by measuring the cure activation energies ($E_a$) with dynamic differential scanning calorimetry (DSC). The dielectric characteristic was examined by dielectric analysis (DEA). The mechanical properties were investigated by measuring the critical stress intensity factor ($K_{IC}$), critical strain energy release rate ($G_{IC}$), and impact strength test. As a result, DGEBAIPET was successfully blended. The Ea of the blend system was increased with increasing PET content to a maximum at 10 phr PET. The dielectric constant was decreased with increasing PET content. The mechanical properties of the blend system were also superior to those of the neat DGEBA. These results were attributed to the increased cross-linking density of the blend system, resulting from the interaction between the epoxy group of DGEBA and the carboxyl group of PET.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.7
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• pp.915-922
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• 2004

A stent is small tube-like structure expanded into stenotic arteries to restore blood flow. The stent expansion behaviors define the effectiveness of the surgical operation. In this paper, finite-element method was employed to analyze expansion behaviors and fatigue life of a typical diamond-shaped balloon-expandable stent. Beyond safety considerations, this type of analysis provides mechanical properties that are often difficult to obtain by experiments. Mechanical properties of the stent expansion pressure, radial recoil, longitudinal recoil and foreshortening were simulated using commercial FEM code, ANSYS and fatigue life were estimated using NISAII ENDURE. The FEM results showed that the pressures necessary to expand the stent up to a diameter of 3mm, 4mm and 5mm were 0.75MPa, 0.82MPa and 0.97MPa. The fatigue lifes according to expansion diameter were 114${\times}$10$^{7}$cycles, 714${\times}$$^{6}$cycles and 163${\times}$10$^{6}$cycles. As a result, a finite element model used in this study can simulate expansion behaviors of stents and should be useful to design new stents or analyze actual stents.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.30-34
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• 2008

The transfer assembly (or transfer printing) technique is a promising method for fabricating multi-scale structures on various substrates including semiconductors and polymers, and has been applied to fabrication of flexible devices with superior performance to conventional organic flexible devices. The mechanical behaviors of the structures fabricated by the transfer assembly is a very important information for design and reliability evaluation purpose, but the measurement of the behaviors is difficult since their critical-dimensions are very tiny. In this study, Au films with nano-scale thickness were fabricated on a silicon substrate and their mechanical properties were measured using micro-tensile test. The Au films on the silicon substrate were then transferred to a PDMS substrate using the transfer assembly technique. Self-assembled monolayer (SAM) with a thiol group was used to enhance the transfer of Au films, and the mechanical behaviors were characterized using wrinkle-based test. The test results from micro-tensile and wrinkle-based test are compared to each other, and their implication to the transfer assembly technique is discussed.

• Macromolecular Research
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• v.14 no.3
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• pp.331-337
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• 2006

In the present study we investigated the relationship between the morphology and mechanical properties of electrospun polysulfone (PSF)/polyurethane (PU) blend nonwovens, by using the electrospinning process to prepare three types of electrospun nonwovens: PSF, PU and PSF/PU blends. The viscosity, conductivity and surface tension of the polymer solutions, were measured by rheometer, electrical conductivity meter and tensiometer, respectively. The electrospun PSF/PU blend nonwovens were characterized by scanning electron microscopy (SEM) and with a universal testing machine. The SEM results revealed that the electrospun PSF nonwoven had a structure consisting of cross-bonding between fibers, whereas the electrospun PU nonwoven showed a typical, point-bonding structure. In the electrospun PSF/PU blend nonwovens, the exact nature of the point-bonding structure depended on the PU contents. The mechanical properties of the electrospun PSF/PU blend nonwoven were affected by the structure or the morphology. With increasing PU content, the mechanical behaviors, such as Young's modulus, yield stress, tensile strength and strain, of the electrospun PSF/PU blend nonwovens were by up to 80%.

• Bulletin of the Korean Chemical Society
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• v.31 no.5
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• pp.1237-1240
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• 2010

The mechanical properties of multiwalled carbon nanotubes (MWNTs)-reinforced epoxy matrix composites with different weight percentages of MWNTs have been investigated. Also, the morphologies and failure behaviors of the composites after mechanical tests are studied by SEM and TEM analyses. As a result, the addition of MWNTs into the epoxy matrix has a remarkable effect on the mechanical properties. And the fracture surfaces of MWNTs/epoxy composites after flexural strength tests show different failure mechanisms for the composites under different nanotube contents. Also, a chemical functionalization of MWNTs can be a useful tool to improve the dispersion of the nanotubes in an epoxy system, resulting in increasing the mechanical properties of the composite materials studied.

• Journal of the Korean Ceramic Society
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• v.46 no.5
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• pp.484-487
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• 2009

$SiC_f$/SiC composites with whiskers and pyrolytic carbon (PyC) coated whiskers in the matrix were fabricated for enhancement of the fracture behaviors by the whisker growing assisted chemical vapor infiltration (WA-CVI) process, respectively. $SiC_f$/SiC composites were also prepared by the conventional CVI process as reference material. The mechanical properties and fracture behaviors were analyzed by comparison of the two types of composites prepared by WA-CVI and conventional CVI. The densities of $SiC_f$/SiC composites were in the range of $2.6{\sim}2.65g/cm^3$. The flexural strengths of composite with whiskers and with those coated by PyC were 650 MPa and 600 MPa, respectively. The tensile strength of composites with whiskers was ${\sim}285$ MPa.

• Journal of the Korean Ceramic Society
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• v.46 no.5
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• pp.510-514
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• 2009

The microstructure and mechanical behavior of deformed silicon were characterized using transmission electron microscopy and nanoindentation. Structural defects such as stacking faults and dislocations were observed through the diffraction contrast in transmission electron microscopy. The mechanical properties of deformed Si and 111 Si wafer and mechanical behaviors during contact loading were also characterized using nanoindentation. The hardness values of silicon samples were ${\sim}10$ GPa and the elastic modulus were varied with indentation conditions. Elbow or pop-out behaviors were found in load-displacement curves of silicon samples during nanoindentation. Deformed silicon showed 'pop-out' behavior more frequently under the load of 10 mN, which is attributed to the structural defects in deformed silicon.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.4
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• pp.394-401
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• 2004

In this study the mechanical behaviors of fiber metal laminates(FMLs) such as ARALL, GLARE and CARE which are recently developed as new structural materials and known to have excellent fatigue resistant characteristics while with relatively low densities compared to the conventional aluminum materials, are considered through the classical lamination theory. The mechanical properties such as elastic moduli, thermal expansion coefficients and hygro-thermally induced residual stresses in the fiber metal laminates are obtained and compared each other. Also, carpet plots of effective elastic moduli, Poisson's ratio and the thermal expansion coefficient for GLARE FML are plotted.