• Title/Summary/Keyword: Mechanical Failure

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Deformation and Failure Analysis of Heterogeneous Microstructures of Ti-6Al-4V Alloy using Probability Functions (확률함수를 이용한 비균질 Ti-6Al-4V 합금의 변형 및 파손해석)

  • Kim, Tae-Won;Ko, Eun-Young
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.6
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    • pp.685-692
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    • 2004
  • A stochastic approach has been presented for superplastic deformation of Ti-6Al-4V alloy, and probability functions are used to model the heterogeneous phase distributions. The experimentally observed spatial correlation functions are developed, and microstructural evolutions together with superplastic deformation behavior have been investigated by means of the two-point and three-point probability functions. The results have shown that the probability varies approximately linearly with separation distance, and deformation enhanced probability changes during the process. The stress-strain behavior with the evolutions of probability function can be correctly predicted by the model. The finite element implementation using Monte Carlo simulation associated with reconstructed microstructures shows that better agreement with experimental data of failure strain on the test specimen.

Numerical Analysis of Interfacial Fracture Behavior in Repaired Structures. (구조 보강재와 피보강재 접합경계면의 역학적 특성에 관한 해석적 연구)

  • 박진완;신승교;임윤묵;김문겸
    • Proceedings of the Korea Concrete Institute Conference
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    • 1999.10a
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    • pp.471-474
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    • 1999
  • An interface always appears when a repair is applied to an aged infrastructure system for repair. These repaired structures have the high chance to fail along the interface because of the stress concentration/discontinuity along the interface. So, mechanical properties of the interface have much influence on the behavior of repaired structure systems. In this paper, numerical tool that can predict effectively the interfacial fracture behavior is developed using axial deformation link elements, and this numerical technique is applied to the interfacial failure behavior. The results coincide with the ultimate strength and failure profile on the interfacial behavior of carbon fiber sheets for strengthening with epoxy adhesion. Thus, the mechanical behavior of the interface up to failure can be predicted using numerical technique with the proposed axial deformation link elements.

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Kinematic Analysis of Fault-Tolerant 3 Degree-of-Feedom Spherical Modules (고장에 강인한 구형 3자유도 모듈에 관한 기구학적 해석)

  • 이병주;김희국
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.18 no.11
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    • pp.2846-2859
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    • 1994
  • This work deals with kinematic analysis of fault-tolerant 3 degree-of-freedom spherical modules which have force redundancies in its parallel structure. The performance of a redundantly actuated four-legged module with no actuator failure, a single actuator failure, partial and half failure of dual actuator are compared to that of a three-legged module, in terms of maximum force transmission ratio, isotropic characteristics, and fault-tolerant capability. Additionally, a system with an excess number of small floating actuators is considered, and the contribution of these small actuators to the force transmission and fault-tolerant capability is evaluated. This study illustrates that the redundant actuation mode allows significant saving of input actuation effort, and also delivers a fault tolerance.

Shape Optimization of Cutouts in a Laminated Composite Plate Using Volume Control (체적제어에 의한 적층 복합재 구멍의 형상 최적화)

  • Han, Seog-Young;Ma, Young-Joon
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.9
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    • pp.1337-1343
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    • 2004
  • Shape optimization was performed to obtain a precise shape of cutouts including the internal shape of cutouts in a laminated composite plate by three dimensional modeling using solid element. Volume control of the growth-strain method was implemented and the distributed parameter chosen as Tsai-Hill fracture index for shape optimization. It makes Tsai-Hill failure index at each element uniform in laminated composites under the predetermined volume a designer requires. Shapes optimized by Tsai-Hill failure index were compared with those of the initial shapes for the various load conditions and cutouts. The following conclusions were obtained in this study; (1) It was found that growth-strain method was applied efficiently to shape optimization of three dimensional cutouts in a laminate composite, (2) The optimal shapes of the various load conditions and cutouts were obtained, (3) The maximum Tsai-Hill failure indices of the optimal shapes were remarkably reduced comparing with those of the initial shapes.

Failure Analysis of Connecting Rod at Small End (커넥팅로드 소단부 파단의 해석)

  • 민동균;전병희;김낙수
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.19 no.2
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    • pp.382-390
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    • 1995
  • Failure of connecting rod in automotive engine may cause catastrophic situation. The corner radius at small end has an effect on stress raising. To investigate the stress distribution in connecting rod during operation, the finite element analysis was used by giving possible maximum tension and compression. Excessive sizing after forging connecting rod may result in the tensile residual stress which lower the fatigue life and cause premature failures. It was shown that when the sizing amount is too large, the location of high tensile residual stress coincide with that of high stress amplitude during operation through the elastic-plastic finite element analysis. The endurance limit moves down due to the surface finish and decarburization, which combines with the movement of resultant stress points to dangerous range. It was concluded that the precise control of sizing and enough corner radius are necessary to a reliability of connecting rod.

Life Prediction by Lethargy Coefficient under Dynamic Load (동적인장하중시 무기력상수에 의한 수명 예측)

  • Kwon, S.J.;Song, J.H.;Kang, H.Y.;Yang, S.M.
    • Journal of the Korean Society for Precision Engineering
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    • v.14 no.7
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    • pp.91-98
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    • 1997
  • Because of a complicated behavior of fatigue in mechanical structures, the analysis of fatigue is in need of much researches on life prediction. A method is developed for the dynamic tensile strength analysis by simple tensile test, which is for the failure life prediction by lethargy coefficient of various materials. Then it is programed to analyze the failure life prediction of mechanical system by virtue of fracture. Thus the dynamic tensile strength analysis is performed to evaluate life parameters as a numerical example, using the developed method.

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Fatigue Failure Model for the Adhesively Bonded Tubular Single Lap Joint Under Torsional Fatigue Loadings (비틀림 하중하에서의 튜브형 단면겹치기 접착조인트의 피로파괴모델에 관한 연구)

  • 이수정;이대길
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.19 no.8
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    • pp.1869-1875
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    • 1995
  • The adhesively bonded tubular single lap joint shows a nonlinear relationship between the applied torque and the resulting displacement under the static-torsional loading, which is induced from the nonlinear properties of the adhesive. However the torque transmission capability in the case of the dynamic-torsional loading is much less than that in the case of the static-torsional loading, the stress level of the adhesive is usually in the region of the linear stress and strain relation and the stress distributions of the joint can be obtained by the linear analysis. In this paper, a failure model for the adhesively bonded tubular single lap joint under the torsional fatigue loading was developed with respect to the adhesive thickness that was a critical factor in predicting the static torque transional-cyclic loadings was proposed.

An Application of the HRA Methodology in PSA: A Gas Valve Station (PSA의 인간신뢰도분석 모델의 적용)

  • 제무성
    • Journal of the Korean Society of Safety
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    • v.15 no.4
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    • pp.150-156
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    • 2000
  • In this paper, the human error contributions to the system unavailability are calculated and compared to the mechanical failure contributions. The system unavailability is a probability that a system is in the failed state at time t, given that it was the normal state at time zero. It is a function of human errors committed during maintenance and tests, component failure rates, surveillance test intervals, and allowed outage time. The THERP (Technique for Human Error Rate Prediction), generally called "HRA handbook", is used here for evaluating human error rates. This method treats the operator as one of the system components, and human reliability is assessed in the same manner as that of components. Based on the calculation results, the human error contribution to the system unavailability is shown to be more important than the mechanical failure contribution in the example system. It is also demonstrated that this method is very flexible in that it can be applied to any hazardous facilities, such as gas valve stations and chemical process plants.ss plants.

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Failure analysis on the phenomenon of water condensing of automotive head lamp assembly (자동차용 head lamp의 수밀원인 분석)

  • Cho, Young-Jin;Jeon, Jong-Soo
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1349-1354
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    • 2008
  • In this study, we try to find the root cause of water condensing failures in a headlamp using chemical and mechanical analysis. Through the surface inspection by OM, SEM and CT, it was found that water infiltrate into the headlamp through hotmelt adhesive debonding part caused by adhesion force degradation and poor quality. IR spectra shows that adhesion force degradation are characterized by increase of some functional group(1742, 1710, 1649, 1016). Through the ESPI measurement, it is turned out that bonding structural change by thermal expansion and degradation of adhesive can be the cause of void generation. So it is recommended that cooling passage and the bonding part should be redesigned to give a guarantee of less thermal stress and high adhesion quality.

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The Stress Analysis of Semiconductor Package (반도체 패키지의 응력 해석)

  • Lee, Jeong-Ick
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.17 no.3
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    • pp.14-19
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    • 2008
  • In the semiconductor IC(Integrated Circuit) package, the top surface of silicon chip is directly attached to the area of the leadframe with a double-sided adhesive layer, in which the base layer have the upper adhesive layer and the lower adhesive layer. The IC package structure has been known to encounter a thermo-mechanical failure mode such as delamination. This failure mode is due to the residual stress on the adhesive surface of silicon chip and leadframe in the curing-cooling process. The induced thermal stress in the curing process has an influence on the cooling residual stress on the silicon chip and leadframe. In this paper, for the minimization of the chip surface damage, the adhesive topologies on the silicon chip are studied through the finite element analysis(FEA).