• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.220-221
• /
• 2007

Recently, imprint lithography have received significant attention due to an alternative technology for photolithography on high performance microelectronic devices. In this work, we investigated thermal stabilities and dynamic mechanical properties of dielectric materials for thermal imprint lithography. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various curing agent and spherical filler were studied using dynamic differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), rheometer and universal test machine(UTM).

• Science of Emotion and Sensibility
• /
• v.5 no.3
• /
• pp.47-52
• /
• 2002

The handle of fabrics including tactility and sense of visuality are closely related to the factors governing the preferences of end-users. This study shows the change of mechanical properties, thermal properties and optical properties by comparing two fabrics which are woven with circular shaped filaments and with triangular ones. The fabric mechanical characteristics required for primary hand values were evaluated with the KES-FB system. The mechanical properties measured by KES-FB system shows that fabrics made of circular filaments are greater than those made of triangular ones. The thermal properties measured by KES-F7(Thermo Labo II) system shows that the values of the initial maximum value(qmax) and the thermal conductivity(λ) are higher in the fabric made of triangular shaped ones. When the light rays tall on a surface, the fabric made of triangular filaments shows more lustrous than circular ones.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.21 no.8
• /
• pp.749-754
• /
• 2008

A large number of studies on the various characteristics of epoxy-layered silicate nanocomposites, such as electric and mechanical, morphology have been conducted and contributed to improve their characteristics. However, studies on the effects of its thermal conductivities in the thermal properties are not enough, even though there are some excellent evaluations for its insulation performances. Thermal properties will cause thermal degradation and significantly affect the reliability of these epoxy-layered silicate nanocomposites. In the results of the analysis of epoxy-layered silicate nanocomposites $T_g$ for various types of organoclays (10A, 15A, 20A, 30B, and 93A), it showed an excellent thermal property of 10A. Also, it represented low values in storage modulus and mechanical Tan (Delta) at a high temperature section 140$^{\circ}C$ and excellent thermal properties due to its movement to the high temperature section in the case of the property of 10A in the measurement of DMA elastics and mechanical losses. In the results of the measurement of thermal conductivities, power ultrasonic applications represented a significant increase in thermal conductivities in the case of the applications of power ultrasonic and planetary centrifugal mixers. Based on these results, it is necessary to perform related studies because it can be applied as useful materials for future power facilities applications in mold and impregnate insulation.

• Composites Research
• /
• v.26 no.1
• /
• pp.54-59
• /
• 2013

This study deals with effect of plasma treatment on the properties of unidirectional ligno cellulosic fabric Hildegardia Populofolia (HDP) fabric. Thermal stability of the fabric was determined by differential scanning calorimetry (DSC) and Thermo gravimetric analysis (DSC). Morphological properties was analyzed by SEM analysis and found that the surface was rough upon plasma treatment which provides good interfacial adhesion with matrix during composite fabrication. Thermal stability and mechanical properties of the plasma treated fabric slightly increases compare to alkali and untreated fabric. It was observed that tensile properties of the fabric increases upon plasma treatment due to the formation of rough surface. SEM analysis indicates formation of rough surface on plasma treatment which helps in increasing the interfacial interaction between the matrix (hydrophobic) and fabric (hydrophilic).

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2003.10a
• /
• pp.221-224
• /
• 2003

Polyvinyl chloride (PVC)/gypsum Polymer blend materials were prepared by melt blending of PVC with gypsum and additives. Effect of gypsum content on the properties of PVC/gypsum Polymer blend material was studied by investigating physico-mechanical properties, thermal properties and morphology development. It was found that the replacement of gypsum for methylene-butadiene-sarene (MBS) component in PVC/gypsum polymer blend material enhanced the tensile strength, but gradually decreased its impact strength. Besides, with the increase of gypsum content, the elongation at break of material gradually decreased. The Presence of the different gypsum contents made a shift of g1ass transition temperature and increased the thermal stability as well as the processing temperature range of polymer blends. The observation of morphology, the results of the physico-mechanical properties and thermal properties proved simultaneously that PVC/gypsum Polymer blend material with the gypsum content of 22.56 wt.% reached the optimum results among five kinds of PVC/gypsum Polymer blend materials investigated.

• Proceedings of the KSME Conference
• /
• 2000.04b
• /
• pp.367-372
• /
• 2000

By the means of microcellular (earning, we can make polymers with $10{\mu}m$ sized gas bubbles. After the $CO_2$ gas bubbles solve, diffuse and leave the polymer matrix, the thermal properties of polymer matrix are changed. Expecially, thermal conductivity becomes low. So, the polymer matrixes with gas bubbles can be used as insulator In this paper, we make model after microcellular foamed polymer matrix to know the change of thermal properties. Most of all, the purpose of this paper is the mlcrocellular foamed polymer matrix's availability as a insulator Beside of thermal properties the surface of microcellular foamed polymer is polished and easy to be colored. Above all the mechanical properties are better than the other insulator. So, microcellular foamed polymer can be used as exterior of building or it can be replaced as a tile.

• Korean Journal of Materials Research
• /
• v.32 no.10
• /
• pp.403-407
• /
• 2022

This research investigated the effect of Si addition on the microstructure, mechanical properties, electric and thermal conductivity of as-extruded Al 6013 alloys. As the content of Si increased, the area fraction of the second phase increased. As the Si content increased, the average grain size decreased remarkably, from 182 (no Si addition) to 142 (1.5Si), 78 (3.0Si) and 77 ㎛ (4.5Si) due to dynamic recrystallization by the dispersed second particles in the aluminum matrix during the hot extrusion. As the Si content increased, the yield strength and ultimate tensile strength increased. The maximum values of yield strength and ultimate tensile strength were 224 MPa and 103 MPa for the 6013-4.5Si alloy. As the amount of Si added increased, the electrical and thermal conductivity decreased. The electrical and thermal conductivity of the Al6013-4.5Si alloy were 44.0 % IACS and 165.0 W/mK, respectively. The addition of Si to Al 6013 alloy had a significant effect on its thermal conductivity and mechanical properties.

• Journal of Advanced Marine Engineering and Technology
• /
• v.33 no.4
• /
• pp.524-532
• /
• 2009

In the mechanical clutches, the pressure plate is one of the important parts for transferring the power and reducing the vibration. Instead of gray and ductile irons, CGI(Compacted Graphite Cast Iron) is concerned to be the replacement recently. A thermo-mechanical coupled analysis was performed to investigate the behavior of the pressure plate for manual clutches. Thermal and mechanical properties of three kinds of cast irons were obtained from the mechanical experiments and referred other technical reports. The results of FEM analysis, were well match with the experimental ones. In this designated FEM method, temperature distribution, stress distribution and thermal deformation were successfully gained and these results will help to design the pressure plate which was made by cast irons including CGI.

• Korean Journal of Materials Research
• /
• v.21 no.4
• /
• pp.220-224
• /
• 2011

Zircon has excellent thermal, chemical, and mechanical properties, but it is hard to make a dense sintered product because of dissociation during the sintering process. This study analyzes how the addition of $SiO_2$ and $Al_2O_3$ affects the mechanical properties of sintered zircon, particularly in regards to reducing the thermal dissociation and improving the mechanical properties of $ZrSiO_4$. Zircon specimens containing different amounts of $SiO_2$ and $Al_2O_3$ were prepared and sintered to observe how the mechanical properties of $ZrSiO_4$ changed according to the differing amount of $SiO_2$ and $Al_2O_3$. The $ZrSiO_4$ that was used for the starting material was ground by ball mill to an average particle size of 3 ${\mu}m$. The $SiO_2$ and $Al_2O_3$ that was used for additives were ground to an average particle size of 3 ${\mu}m$ and 0.5 ${\mu}m$, respectively. Adding $SiO_2$ resulted in transformation in the liquid phase at high temperatures, which had little effect on suppressing the thermal dissociation but enhanced the mechanical properties of $ZrSiO_4$. When $Al_2O_3$ was added, the mechanical properties of $ZrSiO_4$ decreased due to the formation of pores and abnormal grains in the microstructure of the sintered zircon.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.242-242
• /
• 2006

Increasingly complex tasks are performed by computers or cellular phone, requiring more and more memory capacity as well as faster and faster processing speeds. This leads to a constant need to develop more highly integrated circuit systems. Therefore, there have been numerous studies by many engineers investigating circuit patterning. In particular, PCB including module/package substrates such as FCB (Flip Chip Board) has been developed toward being low profile, low power and multi-functionalized due to the demands on miniaturization, increasing functional density of the boards and higher performances of the electric devices. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. The imprint technique. is one of promising candidates, especially due to the fact that the expected resolution limits are far beyond the requirements of the PCB industry in the near future. For applying imprint lithography to FCB, it is very important to control thermal properties and mechanical properties of dielectric materials. These properties are very dependent on epoxy resin, curing agent, accelerator, filler and curing degree(%) of dielectric materials. In this work, the epoxy composites filled with silica fillers and cured with various accelerators having various curing degree(%) were prepared. The characterization of the thermal and mechanical properties wasperformed by thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), rheometer, an universal test machine (UTM).